F280039CSPMR

Texas Instruments · Microcontrollers (MCU/MPU/SOC) · LQFP-64(10x10)

F280039CSPMR from Texas Instruments, in a LQFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	GPIO29	bidirectional	General-purpose digital I/O 29 with multiplexed peripheral functions.
2	GPIO28	bidirectional	General-purpose digital I/O 28 with multiplexed peripheral functions.
3	XRSn	input	Device reset input; internal pullup is always active.
4	VDD	power_in	1.2-V digital logic power pin; should not be used to bias external circuits.
5	VSS	power_in	Digital ground; must be connected to board ground.
6	A6	input	ADC-A input 6 (AIO228 digital input).
7	B2,C6	input	ADC-B input 2 and ADC-C input 6 on a shared pin (AIO226 digital input).
8	A3,B3,C5,VDAC	input	ADC-A input 3, ADC-B input 3, ADC-C input 5, or optional external COMPDAC/GPDAC reference VDAC (place at least 1 µF on the pin if used as reference).
9	A2,B6,C9	input	ADC-A input 2, ADC-B input 6, ADC-C input 9 (CMPSS-1 inputs, AIO224 digital input).
10	A15,B9,C7	input	ADC-A input 15, ADC-B input 9, ADC-C input 7 on a shared pin (AIO233 digital input).
11	A14,B14,C4	input	ADC-A input 14, ADC-B input 14, ADC-C input 4 on a shared pin (AIO239 digital input).
12	A11,B10,C0	input	ADC-A input 11, ADC-B input 10, ADC-C input 0 on a shared pin (AIO237 digital input).
13	A5,B12,C2	input	ADC-A input 5, ADC-B input 12, ADC-C input 2 on a shared pin (CMPSS-2 input 5).
14	A1,B7,DACB_OUT	bidirectional	ADC-A input 1, ADC-B input 7, or buffered DAC-B output (AIO232 digital input).
15	A0,B15,C15,DACA_OUT	bidirectional	ADC-A input 0, ADC-B input 15, ADC-C input 15, or buffered DAC-A output (AIO231 digital input).
16	VREFHI	input	ADC high reference; tie to VDDA if the ADC is not used.
17	VREFLO	input	ADC low reference; tie to VSSA if unused.
18	A12,C1	input	ADC-A input 12 and ADC-C input 1 on a shared pin (AIO238 digital input).
19	A7,C3	input	ADC-A input 7 and ADC-C input 3 on a shared pin (AIO245 digital input).
20	A8,B0,C11	input	ADC-A input 8, ADC-B input 0, ADC-C input 11 on a shared pin (AIO241 digital input).
21	VSSA	power_in	Analog ground; tie to VSS if no separate analog ground is used.
22	VDDA	power_in	3.3-V analog power pin; place a minimum 2.2-µF decoupling capacitor on the pin.
23	A4,B8,C14	input	ADC-A input 4, ADC-B input 8, ADC-C input 14 on a shared pin (AIO225 digital input).
24	A9,B4,C8	input	ADC-A input 9, ADC-B input 4, ADC-C input 8 on a shared pin (AIO227/AIO236 digital input).
25	A10,B1,C10	input	ADC-A input 10, ADC-B input 1, ADC-C input 10 on a shared pin (AIO230 digital input).
26	VSS	power_in	Digital ground; must be connected to board ground.
27	VDD	power_in	1.2-V digital logic power pin; should not be used to bias external circuits.
28	VDDIO	power_in	3.3-V digital I/O power pin.
29	GPIO13	bidirectional	General-purpose I/O 13 with muxed ePWM7_B, MCAN_TX, eQEP1_INDEX, SCIB_RX, PMBus alert and other functions.
30	GPIO12	bidirectional	General-purpose I/O 12 with muxed ePWM7_A, MCAN_RX, eQEP1_STROBE, SCIB_TX and other functions.
31	GPIO11	bidirectional	General-purpose I/O 11 with muxed ePWM6_B, OUTPUTXBAR7, eQEP1_B, SCIB_RX, SPIA_STE and other functions.
32	GPIO33	bidirectional	General-purpose digital I/O 33 with multiplexed peripheral functions.
33	GPIO16	bidirectional	General-purpose I/O 16 with muxed SPIA_SIMO, OUTPUTXBAR7, ePWM5_A, SCIA_TX, XCLKOUT and other functions.
34	GPIO17	bidirectional	General-purpose I/O 17 with muxed SPIA_SOMI, OUTPUTXBAR8, ePWM5_B, SCIA_RX, CANA_TX and other functions.
35	GPIO24	bidirectional	General-purpose I/O 24 with muxed OUTPUTXBAR1, eQEP2_A, ePWM8_A, SPIB_SIMO, SCIA_TX and other functions.
36	TCK	input	JTAG test clock input; internal pullup is always active.
37	GPIO37/TDO	bidirectional	GPIO37 or JTAG TDO (default); tri-stated without JTAG activity, so enable internal pullup or add external pullup.
38	TMS	input	JTAG test mode select input; internal pullup is always active.
39	GPIO35/TDI	bidirectional	GPIO35 or JTAG TDI (default); internal pullup disabled by default, enable it or add external pullup.
40	GPIO32	bidirectional	General-purpose digital I/O 32 with multiplexed peripheral functions.
41	GPIO18,X2	bidirectional	GPIO18 or crystal oscillator output X2.
42	GPIO19,X1	bidirectional	GPIO19 or crystal oscillator input X1 / single-ended 3.3-V clock input.
43	VDDIO	power_in	3.3-V digital I/O power pin.
44	VDD	power_in	1.2-V digital logic power pin; should not be used to bias external circuits.
45	VSS	power_in	Digital ground; must be connected to board ground.
46	GPIO39	bidirectional	General-purpose digital I/O 39 with multiplexed peripheral functions.
47	GPIO8	bidirectional	General-purpose digital I/O 8 with multiplexed peripheral functions.
48	GPIO4	bidirectional	General-purpose digital I/O 4 with multiplexed peripheral functions.
49	GPIO3	bidirectional	General-purpose digital I/O 3 with multiplexed peripheral functions.
50	GPIO2	bidirectional	General-purpose digital I/O 2 with multiplexed peripheral functions.
51	GPIO1	bidirectional	General-purpose digital I/O 1 with multiplexed peripheral functions.
52	GPIO0	bidirectional	General-purpose digital I/O 0 with multiplexed peripheral functions.
53	GPIO40	bidirectional	General-purpose digital I/O 40 with multiplexed peripheral functions.
54	GPIO23	bidirectional	General-purpose I/O 23 with muxed eQEP1_INDEX, SCIB_RX, SPIB_STE, SD1_C4, LINA_RX and other functions.
55	GPIO41	bidirectional	General-purpose digital I/O 41 with multiplexed peripheral functions.
56	GPIO22	bidirectional	General-purpose I/O 22 with muxed eQEP1_STROBE, SCIB_TX, SPIB_CLK, SD1_D4, LINA_TX and other functions.
57	GPIO7	bidirectional	General-purpose digital I/O 7 with multiplexed peripheral functions.
58	VSS	power_in	Digital ground; must be connected to board ground.
59	VDD	power_in	1.2-V digital logic power pin; should not be used to bias external circuits.
60	VDDIO	power_in	3.3-V digital I/O power pin.
61	GPIO5	bidirectional	General-purpose digital I/O 5 with multiplexed peripheral functions.
62	GPIO9	bidirectional	General-purpose I/O 9 with muxed EPWM5_B, SCIB_TX, OUTPUTXBAR6, eQEP1_INDEX, SCIA_RX, SPIA_CLK and other functions.
63	GPIO10	bidirectional	General-purpose I/O 10 with muxed EPWM6_A, ADCSOCBO, eQEP1_A, SCIB_TX, SPIA_SOMI and other functions.
64	GPIO6	bidirectional	General-purpose digital I/O 6 with multiplexed peripheral functions.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	LQFP-64(10x10)
Category	Embedded Processors & Controllers
Pins	64

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Low-level output voltage (IOL = IOL MAX)	VOL			0.4	V	IOL = IOL MAX	68
Low-level output voltage (IOL = 100 µA)	VOL			0.2	V	IOL = 100 µA	68
High-level output source current, all output pins	IOH			-4	mA		68
Low-level output sink current, all output pins	IOL			4	mA		68
High-level output impedance, all output pins	ROH	50	66	96	Ω	VOH=VDDIO-0.4V	68
Low-level output impedance, all output pins	ROL	48	60	84	Ω	VOL=0.4V	68
High-level input voltage	VIH	2			V		68
Low-level input voltage	VIL			0.8	V		68
Input hysteresis	VHYSTERESIS		125		mV		68
Input current, pins with pulldown	IPULLDOWN			120	µA	VDDIO = 3.3 V, VIN = VDDIO	68
Input current, digital inputs with pullup enabled	IPULLUP			160	µA	VDDIO = 3.3 V, VIN = 0 V	68
Weak pulldown resistance	RPULLDOWN	22	31	62	kΩ		68
Weak pullup resistance	RPULLUP	19	30	54	kΩ		68
Pin leakage, digital inputs	ILEAK			0.1	µA	Pullups and outputs disabled, 0 V ≤ VIN ≤ VDDIO	68
Input capacitance, digital inputs	CI		2		pF	Digital inputs	68
Device supply voltage, VDDIO and VDDA (internal BOR enabled)	VDDIO, VDDA		3.3	3.63	V	Internal BOR enabled; minimum is an expression (VBOR-VDDIO(MAX) + VBOR-VDDIO-GB)	60
Device supply voltage, VDDIO and VDDA (internal BOR disabled)	VDDIO, VDDA	2.8	3.3	3.63	V	Internal BOR disabled	60
Device supply voltage, VDD	VDD	1.14	1.2	1.32	V		60
Junction temperature	TJ	-40		150	°C		60
Free-air temperature	TA	-40		125	°C		60
Supply voltage VDDIO with respect to VSS	VDDIO	-0.3		4.6	V	with respect to VSS	59
Supply voltage VDDA with respect to VSSA	VDDA	-0.3		4.6	V	with respect to VSSA	59
Supply voltage VDD with respect to VSS	VDD	-0.3		1.5	V	with respect to VSS	59
Input voltage (3.3 V)	VIN	-0.3		4.6	V		59
Output voltage	VO	-0.3		4.6	V		59
Input clamp current, digital/analog input (per pin)	IIK	-20		20	mA	VIN < VSS/VSSA or VIN > VDDIO/VDDA	59
Input clamp current, total for all inputs	IIKTOTAL	-20		20	mA	VIN < VSS/VSSA or VIN > VDDIO/VDDA	59
Output current, digital output (per pin)	IOUT	-20		20	mA		59
Free-air temperature	TA	-40		125	°C		59
Operating junction temperature	TJ	-40		150	°C		59
Storage temperature	Tstg	-65		150	°C		59
VDDIO current consumption, operational usage	IDDIO		80	108	mA	TYP at Vnom, 30°C; heavily loaded application, PLL enabled, SYSCLK max	61
VDDA current consumption, operational usage	IDDA		8	17.5	mA	TYP at Vnom, 30°C	61
VDDIO current consumption, Idle mode	IDDIO		30	58	mA	TYP at Vnom, 30°C; CPU in IDLE mode, flash powered down	61
VDDIO current consumption, Standby mode	IDDIO		16.5	41	mA	TYP at Vnom, 30°C; CPU in STANDBY mode	61
VDDIO current consumption, Halt mode	IDDIO		12.5	36	mA	TYP at Vnom, 30°C; CPU in HALT mode	62
VDDIO current consumption during Erase/Program cycle	IDDIO		72	106	mA	TYP at Vnom, 30°C; SYSCLK 120 MHz, flash continuous program/erase	62
VDDA current consumption during Erase/Program cycle	IDDA		0.1	2.5	mA	TYP at Vnom, 30°C	62
Frequency, X1/X2 from external crystal or resonator	f(XTAL)	10		20	MHz		88
Frequency, X1 from external oscillator	f(X1)	10		25	MHz		88
Frequency, AUXCLKIN from external oscillator	f(AUXI)	10		60	MHz		88
Frequency, device (system) clock	f(SYSCLK)	2		120	MHz		89
Period, device (system) clock	tc(SYSCLK)	8.33		500	ns		89
Crystal load capacitance	CL1, CL2	12		24	pF		95
Crystal shunt capacitance	C0			7	pF		95
Frequency, INTOSC1 and INTOSC2	fINTOSC	9.82	10	10.1	MHz	-40℃ to 125℃	97
Frequency, INTOSC1 and INTOSC2	fINTOSC	9.86	10	10.1	MHz	-30℃ to 90℃	97
Frequency, INTOSC1 and INTOSC2	fINTOSC	9.9	10	10.1	MHz	-10℃ to 85℃	97
Frequency stability at room temperature	fINTOSC-STABILITY	-0.1		0.1	%	30°C, Nominal VDD	97
Hold time for boot-mode pins	th(boot-mode)	1.5			ms		83
Pulse duration, XRSn low on warm reset	tw(RSL2)	3.2			µs		83
Junction-to-case thermal resistance	RΘJC		12.4		°C/W	N/A airflow	71
Junction-to-board thermal resistance	RΘJB		25.6		°C/W	N/A airflow	71
Junction-to-free air thermal resistance (High k PCB)	RΘJA		51.8		°C/W	0 lfm	71
Junction-to-moving air thermal resistance	RΘJMA		42.2		°C/W	150 lfm	71
Junction-to-moving air thermal resistance	RΘJMA		39.4		°C/W	250 lfm	71
Junction-to-moving air thermal resistance	RΘJMA		36.5		°C/W	500 lfm	71
Junction-to-package top	PsiJT		0.5		°C/W	0 lfm	71
Junction-to-board	PsiJB		25.1		°C/W	0 lfm	71

CAD (KiCad official)

Symbol: F280039CSPMR
Footprint: Package_QFP:LQFP-64_10x10mm_P0.5mm
3D model: LQFP-64(10x10) (KiCad packages3D, STEP)
3D model files: f280039cspmr-etched.step / f280039cspmr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); f280039cspmr.step / f280039cspmr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (284 pp, sha256 c9f41b1092f6635f, retrieved 2026-10-18, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

# F280039CSPMR

**Texas Instruments** · Microcontrollers (MCU/MPU/SOC) · LQFP-64(10x10)

F280039CSPMR from Texas Instruments, in a LQFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GPIO29 | bidirectional | General-purpose digital I/O 29 with multiplexed peripheral functions. |
| 2 | GPIO28 | bidirectional | General-purpose digital I/O 28 with multiplexed peripheral functions. |
| 3 | XRSn | input | Device reset input; internal pullup is always active. |
| 4 | VDD | power_in | 1.2-V digital logic power pin; should not be used to bias external circuits. |
| 5 | VSS | power_in | Digital ground; must be connected to board ground. |
| 6 | A6 | input | ADC-A input 6 (AIO228 digital input). |
| 7 | B2,C6 | input | ADC-B input 2 and ADC-C input 6 on a shared pin (AIO226 digital input). |
| 8 | A3,B3,C5,VDAC | input | ADC-A input 3, ADC-B input 3, ADC-C input 5, or optional external COMPDAC/GPDAC reference VDAC (place at least 1 µF on the pin if used as reference). |
| 9 | A2,B6,C9 | input | ADC-A input 2, ADC-B input 6, ADC-C input 9 (CMPSS-1 inputs, AIO224 digital input). |
| 10 | A15,B9,C7 | input | ADC-A input 15, ADC-B input 9, ADC-C input 7 on a shared pin (AIO233 digital input). |
| 11 | A14,B14,C4 | input | ADC-A input 14, ADC-B input 14, ADC-C input 4 on a shared pin (AIO239 digital input). |
| 12 | A11,B10,C0 | input | ADC-A input 11, ADC-B input 10, ADC-C input 0 on a shared pin (AIO237 digital input). |
| 13 | A5,B12,C2 | input | ADC-A input 5, ADC-B input 12, ADC-C input 2 on a shared pin (CMPSS-2 input 5). |
| 14 | A1,B7,DACB_OUT | bidirectional | ADC-A input 1, ADC-B input 7, or buffered DAC-B output (AIO232 digital input). |
| 15 | A0,B15,C15,DACA_OUT | bidirectional | ADC-A input 0, ADC-B input 15, ADC-C input 15, or buffered DAC-A output (AIO231 digital input). |
| 16 | VREFHI | input | ADC high reference; tie to VDDA if the ADC is not used. |
| 17 | VREFLO | input | ADC low reference; tie to VSSA if unused. |
| 18 | A12,C1 | input | ADC-A input 12 and ADC-C input 1 on a shared pin (AIO238 digital input). |
| 19 | A7,C3 | input | ADC-A input 7 and ADC-C input 3 on a shared pin (AIO245 digital input). |
| 20 | A8,B0,C11 | input | ADC-A input 8, ADC-B input 0, ADC-C input 11 on a shared pin (AIO241 digital input). |
| 21 | VSSA | power_in | Analog ground; tie to VSS if no separate analog ground is used. |
| 22 | VDDA | power_in | 3.3-V analog power pin; place a minimum 2.2-µF decoupling capacitor on the pin. |
| 23 | A4,B8,C14 | input | ADC-A input 4, ADC-B input 8, ADC-C input 14 on a shared pin (AIO225 digital input). |
| 24 | A9,B4,C8 | input | ADC-A input 9, ADC-B input 4, ADC-C input 8 on a shared pin (AIO227/AIO236 digital input). |
| 25 | A10,B1,C10 | input | ADC-A input 10, ADC-B input 1, ADC-C input 10 on a shared pin (AIO230 digital input). |
| 26 | VSS | power_in | Digital ground; must be connected to board ground. |
| 27 | VDD | power_in | 1.2-V digital logic power pin; should not be used to bias external circuits. |
| 28 | VDDIO | power_in | 3.3-V digital I/O power pin. |
| 29 | GPIO13 | bidirectional | General-purpose I/O 13 with muxed ePWM7_B, MCAN_TX, eQEP1_INDEX, SCIB_RX, PMBus alert and other functions. |
| 30 | GPIO12 | bidirectional | General-purpose I/O 12 with muxed ePWM7_A, MCAN_RX, eQEP1_STROBE, SCIB_TX and other functions. |
| 31 | GPIO11 | bidirectional | General-purpose I/O 11 with muxed ePWM6_B, OUTPUTXBAR7, eQEP1_B, SCIB_RX, SPIA_STE and other functions. |
| 32 | GPIO33 | bidirectional | General-purpose digital I/O 33 with multiplexed peripheral functions. |
| 33 | GPIO16 | bidirectional | General-purpose I/O 16 with muxed SPIA_SIMO, OUTPUTXBAR7, ePWM5_A, SCIA_TX, XCLKOUT and other functions. |
| 34 | GPIO17 | bidirectional | General-purpose I/O 17 with muxed SPIA_SOMI, OUTPUTXBAR8, ePWM5_B, SCIA_RX, CANA_TX and other functions. |
| 35 | GPIO24 | bidirectional | General-purpose I/O 24 with muxed OUTPUTXBAR1, eQEP2_A, ePWM8_A, SPIB_SIMO, SCIA_TX and other functions. |
| 36 | TCK | input | JTAG test clock input; internal pullup is always active. |
| 37 | GPIO37/TDO | bidirectional | GPIO37 or JTAG TDO (default); tri-stated without JTAG activity, so enable internal pullup or add external pullup. |
| 38 | TMS | input | JTAG test mode select input; internal pullup is always active. |
| 39 | GPIO35/TDI | bidirectional | GPIO35 or JTAG TDI (default); internal pullup disabled by default, enable it or add external pullup. |
| 40 | GPIO32 | bidirectional | General-purpose digital I/O 32 with multiplexed peripheral functions. |
| 41 | GPIO18,X2 | bidirectional | GPIO18 or crystal oscillator output X2. |
| 42 | GPIO19,X1 | bidirectional | GPIO19 or crystal oscillator input X1 / single-ended 3.3-V clock input. |
| 43 | VDDIO | power_in | 3.3-V digital I/O power pin. |
| 44 | VDD | power_in | 1.2-V digital logic power pin; should not be used to bias external circuits. |
| 45 | VSS | power_in | Digital ground; must be connected to board ground. |
| 46 | GPIO39 | bidirectional | General-purpose digital I/O 39 with multiplexed peripheral functions. |
| 47 | GPIO8 | bidirectional | General-purpose digital I/O 8 with multiplexed peripheral functions. |
| 48 | GPIO4 | bidirectional | General-purpose digital I/O 4 with multiplexed peripheral functions. |
| 49 | GPIO3 | bidirectional | General-purpose digital I/O 3 with multiplexed peripheral functions. |
| 50 | GPIO2 | bidirectional | General-purpose digital I/O 2 with multiplexed peripheral functions. |
| 51 | GPIO1 | bidirectional | General-purpose digital I/O 1 with multiplexed peripheral functions. |
| 52 | GPIO0 | bidirectional | General-purpose digital I/O 0 with multiplexed peripheral functions. |
| 53 | GPIO40 | bidirectional | General-purpose digital I/O 40 with multiplexed peripheral functions. |
| 54 | GPIO23 | bidirectional | General-purpose I/O 23 with muxed eQEP1_INDEX, SCIB_RX, SPIB_STE, SD1_C4, LINA_RX and other functions. |
| 55 | GPIO41 | bidirectional | General-purpose digital I/O 41 with multiplexed peripheral functions. |
| 56 | GPIO22 | bidirectional | General-purpose I/O 22 with muxed eQEP1_STROBE, SCIB_TX, SPIB_CLK, SD1_D4, LINA_TX and other functions. |
| 57 | GPIO7 | bidirectional | General-purpose digital I/O 7 with multiplexed peripheral functions. |
| 58 | VSS | power_in | Digital ground; must be connected to board ground. |
| 59 | VDD | power_in | 1.2-V digital logic power pin; should not be used to bias external circuits. |
| 60 | VDDIO | power_in | 3.3-V digital I/O power pin. |
| 61 | GPIO5 | bidirectional | General-purpose digital I/O 5 with multiplexed peripheral functions. |
| 62 | GPIO9 | bidirectional | General-purpose I/O 9 with muxed EPWM5_B, SCIB_TX, OUTPUTXBAR6, eQEP1_INDEX, SCIA_RX, SPIA_CLK and other functions. |
| 63 | GPIO10 | bidirectional | General-purpose I/O 10 with muxed EPWM6_A, ADCSOCBO, eQEP1_A, SCIB_TX, SPIA_SOMI and other functions. |
| 64 | GPIO6 | bidirectional | General-purpose digital I/O 6 with multiplexed peripheral functions. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | LQFP-64(10x10) |
| Category | Embedded Processors & Controllers |
| Pins | 64 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Low-level output voltage (IOL = IOL MAX) | VOL |  |  | 0.4 | V | IOL = IOL MAX | 68 |
| Low-level output voltage (IOL = 100 µA) | VOL |  |  | 0.2 | V | IOL = 100 µA | 68 |
| High-level output source current, all output pins | IOH |  |  | -4 | mA |  | 68 |
| Low-level output sink current, all output pins | IOL |  |  | 4 | mA |  | 68 |
| High-level output impedance, all output pins | ROH | 50 | 66 | 96 | Ω | VOH=VDDIO-0.4V | 68 |
| Low-level output impedance, all output pins | ROL | 48 | 60 | 84 | Ω | VOL=0.4V | 68 |
| High-level input voltage | VIH | 2 |  |  | V |  | 68 |
| Low-level input voltage | VIL |  |  | 0.8 | V |  | 68 |
| Input hysteresis | VHYSTERESIS |  | 125 |  | mV |  | 68 |
| Input current, pins with pulldown | IPULLDOWN |  |  | 120 | µA | VDDIO = 3.3 V, VIN = VDDIO | 68 |
| Input current, digital inputs with pullup enabled | IPULLUP |  |  | 160 | µA | VDDIO = 3.3 V, VIN = 0 V | 68 |
| Weak pulldown resistance | RPULLDOWN | 22 | 31 | 62 | kΩ |  | 68 |
| Weak pullup resistance | RPULLUP | 19 | 30 | 54 | kΩ |  | 68 |
| Pin leakage, digital inputs | ILEAK |  |  | 0.1 | µA | Pullups and outputs disabled, 0 V ≤ VIN ≤ VDDIO | 68 |
| Input capacitance, digital inputs | CI |  | 2 |  | pF | Digital inputs | 68 |
| Device supply voltage, VDDIO and VDDA (internal BOR enabled) | VDDIO, VDDA |  | 3.3 | 3.63 | V | Internal BOR enabled; minimum is an expression (VBOR-VDDIO(MAX) + VBOR-VDDIO-GB) | 60 |
| Device supply voltage, VDDIO and VDDA (internal BOR disabled) | VDDIO, VDDA | 2.8 | 3.3 | 3.63 | V | Internal BOR disabled | 60 |
| Device supply voltage, VDD | VDD | 1.14 | 1.2 | 1.32 | V |  | 60 |
| Junction temperature | TJ | -40 |  | 150 | °C |  | 60 |
| Free-air temperature | TA | -40 |  | 125 | °C |  | 60 |
| Supply voltage VDDIO with respect to VSS | VDDIO | -0.3 |  | 4.6 | V | with respect to VSS | 59 |
| Supply voltage VDDA with respect to VSSA | VDDA | -0.3 |  | 4.6 | V | with respect to VSSA | 59 |
| Supply voltage VDD with respect to VSS | VDD | -0.3 |  | 1.5 | V | with respect to VSS | 59 |
| Input voltage (3.3 V) | VIN | -0.3 |  | 4.6 | V |  | 59 |
| Output voltage | VO | -0.3 |  | 4.6 | V |  | 59 |
| Input clamp current, digital/analog input (per pin) | IIK | -20 |  | 20 | mA | VIN < VSS/VSSA or VIN > VDDIO/VDDA | 59 |
| Input clamp current, total for all inputs | IIKTOTAL | -20 |  | 20 | mA | VIN < VSS/VSSA or VIN > VDDIO/VDDA | 59 |
| Output current, digital output (per pin) | IOUT | -20 |  | 20 | mA |  | 59 |
| Free-air temperature | TA | -40 |  | 125 | °C |  | 59 |
| Operating junction temperature | TJ | -40 |  | 150 | °C |  | 59 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 59 |
| VDDIO current consumption, operational usage | IDDIO |  | 80 | 108 | mA | TYP at Vnom, 30°C; heavily loaded application, PLL enabled, SYSCLK max | 61 |
| VDDA current consumption, operational usage | IDDA |  | 8 | 17.5 | mA | TYP at Vnom, 30°C | 61 |
| VDDIO current consumption, Idle mode | IDDIO |  | 30 | 58 | mA | TYP at Vnom, 30°C; CPU in IDLE mode, flash powered down | 61 |
| VDDIO current consumption, Standby mode | IDDIO |  | 16.5 | 41 | mA | TYP at Vnom, 30°C; CPU in STANDBY mode | 61 |
| VDDIO current consumption, Halt mode | IDDIO |  | 12.5 | 36 | mA | TYP at Vnom, 30°C; CPU in HALT mode | 62 |
| VDDIO current consumption during Erase/Program cycle | IDDIO |  | 72 | 106 | mA | TYP at Vnom, 30°C; SYSCLK 120 MHz, flash continuous program/erase | 62 |
| VDDA current consumption during Erase/Program cycle | IDDA |  | 0.1 | 2.5 | mA | TYP at Vnom, 30°C | 62 |
| Frequency, X1/X2 from external crystal or resonator | f(XTAL) | 10 |  | 20 | MHz |  | 88 |
| Frequency, X1 from external oscillator | f(X1) | 10 |  | 25 | MHz |  | 88 |
| Frequency, AUXCLKIN from external oscillator | f(AUXI) | 10 |  | 60 | MHz |  | 88 |
| Frequency, device (system) clock | f(SYSCLK) | 2 |  | 120 | MHz |  | 89 |
| Period, device (system) clock | tc(SYSCLK) | 8.33 |  | 500 | ns |  | 89 |
| Crystal load capacitance | CL1, CL2 | 12 |  | 24 | pF |  | 95 |
| Crystal shunt capacitance | C0 |  |  | 7 | pF |  | 95 |
| Frequency, INTOSC1 and INTOSC2 | fINTOSC | 9.82 | 10 | 10.1 | MHz | -40℃ to 125℃ | 97 |
| Frequency, INTOSC1 and INTOSC2 | fINTOSC | 9.86 | 10 | 10.1 | MHz | -30℃ to 90℃ | 97 |
| Frequency, INTOSC1 and INTOSC2 | fINTOSC | 9.9 | 10 | 10.1 | MHz | -10℃ to 85℃ | 97 |
| Frequency stability at room temperature | fINTOSC-STABILITY | -0.1 |  | 0.1 | % | 30°C, Nominal VDD | 97 |
| Hold time for boot-mode pins | th(boot-mode) | 1.5 |  |  | ms |  | 83 |
| Pulse duration, XRSn low on warm reset | tw(RSL2) | 3.2 |  |  | µs |  | 83 |
| Junction-to-case thermal resistance | RΘJC |  | 12.4 |  | °C/W | N/A airflow | 71 |
| Junction-to-board thermal resistance | RΘJB |  | 25.6 |  | °C/W | N/A airflow | 71 |
| Junction-to-free air thermal resistance (High k PCB) | RΘJA |  | 51.8 |  | °C/W | 0 lfm | 71 |
| Junction-to-moving air thermal resistance | RΘJMA |  | 42.2 |  | °C/W | 150 lfm | 71 |
| Junction-to-moving air thermal resistance | RΘJMA |  | 39.4 |  | °C/W | 250 lfm | 71 |
| Junction-to-moving air thermal resistance | RΘJMA |  | 36.5 |  | °C/W | 500 lfm | 71 |
| Junction-to-package top | PsiJT |  | 0.5 |  | °C/W | 0 lfm | 71 |
| Junction-to-board | PsiJB |  | 25.1 |  | °C/W | 0 lfm | 71 |

## CAD (KiCad official)

- Symbol: `F280039CSPMR`
- Footprint: `Package_QFP:LQFP-64_10x10mm_P0.5mm`
- 3D model: LQFP-64(10x10) (KiCad packages3D, STEP)
- 3D model files: `f280039cspmr-etched.step` / `f280039cspmr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `f280039cspmr.step` / `f280039cspmr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/tms320f280039c.pdf) (284 pp, sha256 `c9f41b1092f6635f`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/f280039cspmr-datasheet.pdf)