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Ray Publish 0.1.0 1aebf5d 7d ago

F12T6

TLC Electronic · Disposable Fuses · 1206

F12T6 from TLC Electronic, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Fuse terminal 1 (one end cap of the non-polarized 1206 slow blow fuse), rated 6A, 32V DC, 50A breaking capacity at 32Vdc.
2 2 passive Fuse terminal 2 (opposite end cap of the non-polarized 1206 slow blow fuse), rated 6A, 32V DC, 50A breaking capacity at 32Vdc.

Key specifications

Parameter Value
Manufacturer TLC Electronic
Package 1206
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Rated Voltage 32 V Specifications table, Part No. F12T6 2
Breaking Capacity (DC interrupting rating) 50 A Printed as 50A@32Vdc; measured at rated voltage, time constant < 50 microseconds, battery source 2
Opening time at 1.0In 4 hour Rated current 6A, 1.0In; printed as '4 hour min.' 2
Opening time at 2.5In 5 sec Rated current 6A, 2.5In; printed as '5 sec max.' 2
Opening time at 3.0In 0.1 3 sec Rated current 6A, 3.0In; printed as '0.1sec, 3sec' 2
Opening time at 10.0In 0.2 20 ms Rated current 6A, 10.0In; printed as '0.2ms, 20ms' 2
Normal ambient temperature tolerance -3 23 3 ℃ Normal ambient temperature for testing, printed as 23+/-3℃ 6
Operating temperature -55 125 ℃ With proper correction factor applied 6
Wave solder reservoir temperature 260 ℃ Wave solder, reservoir temperature 5
Wave solder time in reservoir 10 s Wave solder, time in reservoir, maximum 5
Infrared reflow temperature 260 ℃ Infrared reflow 5
Infrared reflow time 30 s Infrared reflow, maximum 5
Preheat and soak temperature min (Tsmin) Tsmin 150 ℃ Lead-free solder reflow profile 5
Preheat and soak temperature max (Tsmax) Tsmax 200 ℃ Lead-free solder reflow profile 5
Preheat and soak time (Tsmin to Tsmax) tS 60 120 Seconds Lead-free solder reflow profile 5
Average ramp-up rate (Tsmax to Tp) 3 ℃ / Second Maximum, lead-free solder reflow profile 5
Liquidous temperature TL 217 ℃ Lead-free solder reflow profile 5
Time at liquidous tL 60 150 Seconds Lead-free solder reflow profile 5
Peak package body temperature TP 260 ℃ Lead-free solder reflow profile 5
Time within 5℃ of classification temperature tP 30 Seconds Within 5℃ of the specified classification temperature (TC) 5
Average ramp-down rate (TP to Tsmax) 6 ℃ / Second Maximum, lead-free solder reflow profile 5
Time from 25℃ to peak temperature 8 Minutes Maximum, lead-free solder reflow profile 5
Rated Current 6 A DC, Part No. F12T6 2
Typical Cold Resistance 16 mOhms Measured at <10% of rated current, ambient temperature 25℃ 2
Typical Voltage Drop 140 mV Typical, as printed in Specifications table 2
Typical Pre-arcing I2t I2t 12 A2Sec Measured at 10In 2

CAD (KiCad official)

  • Symbol: F12T6
  • Footprint: Fuse:Fuse_1206_3216Metric
  • 3D model: 1206 (KiCad packages3D, STEP)
  • 3D model files: f12t6-etched.step / f12t6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); f12t6.step / f12t6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TLC Electronic datasheet (6 pp, sha256 b8a9b7def5a0b319, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF