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F12T3

TLC Electronic · Disposable Fuses · 1206

F12T3 from TLC Electronic, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive One end-cap terminal of the 1206 slow blow fuse, rated 3A and 72Vdc with 50A breaking capacity at 72Vdc; terminals are interchangeable (non-polarized).
2 2 passive Other end-cap terminal of the 1206 slow blow fuse, rated 3A and 72Vdc with 50A breaking capacity at 72Vdc; terminals are interchangeable (non-polarized).

Key specifications

Parameter Value
Manufacturer TLC Electronic
Package 1206
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Time to open at rated current 1.0In (no-open hold time) 4 hour Rated Current 1.0In 2
Time to open at rated current 2.5In 5 sec Rated Current 2.5In 2
Time to open at rated current 3.0In 0.1 3 sec Rated Current 3.0In 2
Time to open at rated current 10.0In 0.2 20 ms Rated Current 10.0In 2
DC breaking capacity (interrupting rating) 50 A @72Vdc; DC interrupting rating measured at rated voltage, time constant < 50 microseconds, battery source 2
Rated voltage 72 V DC 2
Operating temperature -55 125 ℃ With proper correction factor applied 6
Infrared reflow peak temperature 260 ℃ Infrared reflow; temperature 260℃ 5
Infrared reflow time 30 s Infrared reflow; time 30 seconds maximum 5
Wave solder time in reservoir 10 s Wave solder; time in reservoir 10 seconds maximum 5
Preheat and soak temperature min (Tsmin) Tsmin 150 ℃ Lead-free solder reflow profile 5
Preheat and soak temperature max (Tsmax) Tsmax 200 ℃ Lead-free solder reflow profile 5
Time Tsmin to Tsmax tS 60 120 Seconds Lead-free solder reflow profile, preheat and soak 5
Average ramp up rate Tsmax to Tp 3 ℃ / Second Lead-free solder reflow profile, maximum 5
Time at liquidous tL 60 150 Seconds Lead-free solder reflow profile; liquidous temperature TL 217℃ 5
Liquidous temperature TL 217 ℃ Lead-free solder reflow profile; maximum liquidous temperature 5
Peak package body temperature TP 260 ℃ Lead-free solder reflow profile 5
Time within 5℃ of classification temperature tP 30 Seconds Within 5℃ of the specified classification temperature (TC) 5
Average ramp-down rate (TP to Tsmax) 6 ℃ / Second Lead-free solder reflow profile, maximum 5
Time from 25℃ to peak temperature 8 Minutes Lead-free solder reflow profile, maximum 5
Rated current 3 A Part No. F12T3 2
DC cold resistance 47 mOhms Measured at <10% of rated current, ambient 25℃ 2
Typical voltage drop 187 mV 2
Typical pre-arcing I2t I2t 1.5 A2Sec Measured at 10In current 2
Wave solder reservoir temperature 260 ℃ Wave solder; reservoir temperature 5

CAD (KiCad official)

  • Symbol: F12T3
  • Footprint: Fuse:Fuse_1206_3216Metric
  • 3D model: 1206 (KiCad packages3D, STEP)
  • 3D model files: f12t3-etched.step / f12t3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); f12t3.step / f12t3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TLC Electronic datasheet (6 pp, sha256 4421e44f03777df1, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF