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Ray Publish 0.1.0 a12584a 20d ago

F12T10

TLC Electronic · Disposable Fuses · 1206

F12T10 from TLC Electronic, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Fuse terminal 1 (end cap, 0.50 mm wide); the fuse is non-polarized, rated 10 A, 32 V DC, with 150 A breaking capacity at 32 Vdc.
2 2 passive Fuse terminal 2 (end cap, 0.50 mm wide); the fuse is non-polarized, rated 10 A, 32 V DC, with 150 A breaking capacity at 32 Vdc.

Key specifications

Parameter Value
Manufacturer TLC Electronic
Package 1206
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Time at 1.0In (rated current 100%) 4 hour Time-current row, 1.0In column (column mapping inferred from garbled text) 2
Time at 3.5In 5 sec Time-current row, 3.5In column (column mapping inferred from garbled text) 2
Time at 10.0In 0.2 10 ms Time-current row, 10.0In column (column mapping inferred from garbled text) 2
Operating temperature -55 125 ℃ With proper correction factor applied 6
Rated current In 10 A Part No. F12T10, Rated Current column 2
Rated voltage 32 V Rated voltage (DC) as printed for F12T10 2
DC breaking capacity 150 A @32Vdc; DC interrupting rating measured at rated voltage, time constant less than 50 microseconds, battery source 2
Typical cold resistance 6.5 mOhms Measured at <10% of rated current, ambient 25℃ 2
Typical voltage drop 110 mV Printed without test conditions 2
Typical pre-arcing I2t I2t 22 A2Sec Measured at 10In current 2
Wave solder reservoir temperature 260 ℃ Wave solder, reservoir temperature 5
Wave solder time in reservoir 10 sec Wave solder, time in reservoir, maximum 5
Infrared reflow temperature 260 ℃ Infrared reflow 5
Infrared reflow time 30 sec Infrared reflow, maximum 5
Preheat and soak temperature (Tsmin to Tsmax) Tsmin, Tsmax 150 200 ℃ Lead-free solder reflow profile, preheat and soak 5
Average ramp-up rate (Tsmax to Tp) 3 ℃/Second Lead-free solder reflow profile, maximum 5
Time at liquidous (tL) tL 60 150 Seconds Lead-free solder reflow profile, liquidous temperature TL 217℃ 5
Peak package body temperature (TP) TP 260 ℃ Lead-free solder reflow profile 5
Average ramp-down rate (TP to Tsmax) 6 ℃/Second Lead-free solder reflow profile, maximum 5
Time (25℃ to peak temperature) 8 Minutes Lead-free solder reflow profile, maximum 5

CAD (KiCad official)

  • Symbol: F12T10
  • Footprint: Fuse:Fuse_1206_3216Metric
  • 3D model: 1206 (KiCad packages3D, STEP)
  • 3D model files: f12t10-etched.step / f12t10-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); f12t10.step / f12t10.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TLC Electronic datasheet (6 pp, sha256 2d3b9d4afab1268b, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF