# F12F7

**TLC Electronic** · Disposable Fuses · 1206

F12F7 from TLC Electronic, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Fuse terminal 1 (end cap, 0.50 mm wide on a 3.20 mm body); non-polarized, 7A rated current, 32V DC rated voltage, 150A@32Vdc breaking capacity. |
| 2 | 2 | passive | Fuse terminal 2 (end cap, 0.50 mm wide on a 3.20 mm body); non-polarized, interchangeable with terminal 1, typical cold resistance 12 mOhms. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TLC Electronic |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating temperature |  | -55 |  |  | ℃ | With proper correction factor applied | 5 |
| Operating temperature |  |  |  | 125 | ℃ | With proper correction factor applied | 5 |
| Time at 3.5In (6A~40A rated current) |  |  |  | 5 | sec | Rated current 6A~40A, 3.5In; column alignment in the extracted table is ambiguous | 2 |
| Infrared reflow time |  |  |  | 30 | sec | Infrared reflow, temperature 260℃ | 4 |
| Infrared reflow temperature |  |  |  | 260 | ℃ | Infrared reflow, time 30 seconds maximum | 4 |
| Wave solder time in reservoir |  |  |  | 10 | seconds | Wave solder, reservoir temperature 260℃ | 4 |
| Wave solder reservoir temperature |  |  |  | 260 | ℃ | Wave solder | 4 |
| Time from 25℃ to peak temperature |  |  |  | 8 | Minutes | Solder reflow profile, Pb-free | 5 |
| Rated voltage (DC) |  |  | 32 |  | V | DC rated voltage | 2 |
| Rated current |  |  | 7 |  | A |  | 2 |
| Breaking capacity (DC interrupting rating) |  |  | 150 |  | A | @32Vdc, measured at rated voltage, time constant <50 µs, battery source | 2 |
| Typical cold resistance |  |  | 12 |  | mOhms | Measured at <10% of rated current, ambient 25℃ | 2 |
| Typical voltage drop |  |  | 140 |  | mV |  | 2 |
| Typical pre-arcing I2t | I2t |  | 12.5 |  | A2Sec | Measured at 10In current | 2 |

## CAD (KiCad official)

- Symbol: `F12F7`
- Footprint: `Fuse:Fuse_1206_3216Metric`
- 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files: `f12f7-etched.step` / `f12f7-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `f12f7.step` / `f12f7.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TLC Electronic datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590207890981089280) (5 pp, sha256 `cbb8d36f7b6b4d9c`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/f12f7-datasheet.pdf)