component
F12F3
Public Made by Adomby adom
TLC Electronic Disposable Fuses, 1206. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownF12F3
TLC Electronic · Disposable Fuses · 1206
F12F3 from TLC Electronic, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One end-cap terminal of the non-polarized 3A fast-acting fuse (72V DC rated, 50A breaking capacity at 72Vdc, 48 mOhm typical cold resistance). |
| 2 | 2 | passive | Other end-cap terminal of the non-polarized 3A fast-acting fuse (72V DC rated, 50A breaking capacity at 72Vdc, 48 mOhm typical cold resistance). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TLC Electronic |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Opening time at rated current 1.0In (min) | 4 | hour | Rated Current 1.0In, 3A part | 2 | |||
| Opening time at rated current 2.5In (max) | 5 | sec | Rated Current 2.5In, 3A part | 2 | |||
| Rated voltage DC | 72 | V | Part No F12F3 | 2 | |||
| Operating temperature | -55 | 125 | ℃ | with proper correction factor applied | 5 | ||
| Wave solder reservoir temperature | 260 | ℃ | Wave solder, reservoir temperature | 4 | |||
| Wave solder time in reservoir | 10 | seconds | Wave solder, time in reservoir | 4 | |||
| Infrared reflow temperature | 260 | ℃ | Infrared reflow | 4 | |||
| Infrared reflow time | 30 | seconds | Infrared reflow, time | 4 | |||
| Preheat and soak temperature min (Tsmin) | Tsmin | 150 | ℃ | Lead (Pb) free solder reflow profile | 4 | ||
| Preheat and soak temperature max (Tsmax) | Tsmax | 200 | ℃ | Lead (Pb) free solder reflow profile | 4 | ||
| Preheat and soak time (Tsmin to Tsmax) | tS | 60 | 120 | Seconds | Lead (Pb) free solder reflow profile | 4 | |
| Average ramp up rate Tsmax to Tp | 3 | ℃ / Second | Lead (Pb) free solder reflow profile | 5 | |||
| Time at liquidous | tL | 60 | 150 | Seconds | Lead (Pb) free solder reflow profile | 5 | |
| Peak package body temperature | TP | 260 | ℃ | Lead (Pb) free solder reflow profile | 5 | ||
| Time (tP) within 5℃ of classification temperature (TC) | tP | 30 | Seconds | within 5℃ of the specified classification temperature (TC) | 5 | ||
| Average ramp-down rate (TP to Tsmax) | 6 | ℃ / Second | Lead (Pb) free solder reflow profile | 5 | |||
| Time from 25℃ to peak temperature | 8 | Minutes | Lead (Pb) free solder reflow profile | 5 | |||
| Rated current | 3 | A | Part No F12F3 (3A rating) | 2 | |||
| DC breaking capacity | 50 | A | @72Vdc; measured at rated voltage, time constant of less than 50 microseconds, battery source | 2 | |||
| Typical cold resistance | 48 | mOhms | measured at <10% of rated current in ambient temperature of 25℃ | 2 | |||
| Typical voltage drop | 187 | mV | 2 | ||||
| Typical pre-arcing I2t | I2t | 1.39 | A2Sec | measured at 10In current | 2 |
CAD (KiCad official)
- Symbol:
F12F3 - Footprint:
Fuse:Fuse_1206_3216Metric - 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files:
f12f3-etched.step/f12f3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);f12f3.step/f12f3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TLC Electronic datasheet (5 pp, sha256
c2cfcade5bcf6391, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).