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F1206HC30A0TM
Public Made by Adomby adom
AEM Disposable Fuses, 1206. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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F1206HC30A0TM
AEM · Disposable Fuses · 1206
F1206HC30A0TM from AEM, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | First terminal of the 30 A, 35 VDC fuse element (silver termination with nickel and tin plating); the device is non-polarized, so the two terminals are interchangeable. |
| 2 | 2 | passive | Second terminal of the 30 A, 35 VDC fuse element (silver termination with nickel and tin plating); the device is non-polarized, so the two terminals are interchangeable. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | AEM |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Voltage Rating | 35 | VDC | 1 | ||||
| Clearing time at 100% of current rating | 4 | hours | Clearing time at 25°C; 100% of current rating | 1 | |||
| Clearing time at 350% of current rating | 5 | seconds | Clearing time at 25°C; 350% of current rating | 1 | |||
| Nominal Cold DCR | DCR | 0.0012 | Ω | Measured at ≤10% rated current and 25°C ambient | 1 | ||
| Current Rating | 30 | A | 1 | ||||
| Nominal I2t | I2t | 180 | A2s | Melting I2t at 1000% of current rating | 1 | ||
| Voltage drop change after life test | 20 | % | 80% rated current (75% for <1 A fuses) for 2000 hours at ambient 20°C to 30°C; no electrical opens during testing | 4 | |||
| Operating temperature range | -55 | 150 | °C | With derating | 1 | ||
| Peak package body temperature (Tp) | Tp | 260 | °C | Pb-free reflow soldering profile | 6 | ||
| Preheat/soak temperature min | Tsmin | 150 | °C | Pb-free reflow preheat/soak | 6 | ||
| Preheat/soak temperature max | Tsmax | 200 | °C | Pb-free reflow preheat/soak | 6 | ||
| Preheat/soak time (ts) from Tsmin to Tsmax | ts | 60 | 120 | seconds | Pb-free reflow preheat/soak | 6 | |
| Time above liquidous (tL) | tL | 60 | 150 | seconds | Maintained above TL = 217°C | 6 | |
| Ramp-up rate (TL to Tp) | 3 | °C/second | TL to Tp | 6 | |||
| Ramp-down rate (Tp to TL) | 6 | °C/second | Tp to TL | 6 | |||
| Time 25°C to peak temperature | 8 | minutes | 25°C to peak | 6 |
CAD (KiCad official)
- Symbol:
F1206HC30A0TM - Footprint:
Fuse:Fuse_1206_3216Metric - 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files:
f1206hc30a0tm-etched.step/f1206hc30a0tm-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);f1206hc30a0tm.step/f1206hc30a0tm.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: AEM datasheet (7 pp, sha256
da2367792bbb3ac7, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# F1206HC30A0TM
**AEM** · Disposable Fuses · 1206
F1206HC30A0TM from AEM, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | First terminal of the 30 A, 35 VDC fuse element (silver termination with nickel and tin plating); the device is non-polarized, so the two terminals are interchangeable. |
| 2 | 2 | passive | Second terminal of the 30 A, 35 VDC fuse element (silver termination with nickel and tin plating); the device is non-polarized, so the two terminals are interchangeable. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | AEM |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Voltage Rating | | | | 35 | VDC | | 1 |
| Clearing time at 100% of current rating | | 4 | | | hours | Clearing time at 25°C; 100% of current rating | 1 |
| Clearing time at 350% of current rating | | | | 5 | seconds | Clearing time at 25°C; 350% of current rating | 1 |
| Nominal Cold DCR | DCR | | 0.0012 | | Ω | Measured at ≤10% rated current and 25°C ambient | 1 |
| Current Rating | | | 30 | | A | | 1 |
| Nominal I2t | I2t | | 180 | | A2s | Melting I2t at 1000% of current rating | 1 |
| Voltage drop change after life test | | | | 20 | % | 80% rated current (75% for <1 A fuses) for 2000 hours at ambient 20°C to 30°C; no electrical opens during testing | 4 |
| Operating temperature range | | -55 | | 150 | °C | With derating | 1 |
| Peak package body temperature (Tp) | Tp | | | 260 | °C | Pb-free reflow soldering profile | 6 |
| Preheat/soak temperature min | Tsmin | 150 | | | °C | Pb-free reflow preheat/soak | 6 |
| Preheat/soak temperature max | Tsmax | | | 200 | °C | Pb-free reflow preheat/soak | 6 |
| Preheat/soak time (ts) from Tsmin to Tsmax | ts | 60 | | 120 | seconds | Pb-free reflow preheat/soak | 6 |
| Time above liquidous (tL) | tL | 60 | | 150 | seconds | Maintained above TL = 217°C | 6 |
| Ramp-up rate (TL to Tp) | | | | 3 | °C/second | TL to Tp | 6 |
| Ramp-down rate (Tp to TL) | | | | 6 | °C/second | Tp to TL | 6 |
| Time 25°C to peak temperature | | | | 8 | minutes | 25°C to peak | 6 |
## CAD (KiCad official)
- Symbol: `F1206HC30A0TM`
- Footprint: `Fuse:Fuse_1206_3216Metric`
- 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files: `f1206hc30a0tm-etched.step` / `f1206hc30a0tm-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `f1206hc30a0tm.step` / `f1206hc30a0tm.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [AEM datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588885094040023041) (7 pp, sha256 `da2367792bbb3ac7`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/f1206hc30a0tm-datasheet.pdf)