# F06T0.5

**TLC Electronic** · Disposable Fuses · 0603

F06T0.5 from TLC Electronic, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Fuse terminal 1 (non-polarized); 500mA rated current, 32V DC rated voltage, 50A DC breaking capacity. |
| 2 | 2 | passive | Fuse terminal 2 (non-polarized); 500mA rated current, 32V DC rated voltage, 50A DC breaking capacity. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TLC Electronic |
| Package | 0603 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating temperature |  | -55 |  | 125 | ℃ | With proper correction factor applied (temperature derating curve) | 5 |
| Rated voltage (DC) |  |  |  | 32 | V | DC rating for the 0.5 A part | 2 |
| Minimum hold time at rated current |  | 4 |  |  | hour | 500mA row, 1.0In column (column mapping is garbled in source) | 2 |
| Maximum opening time |  |  |  | 5 | sec | 500mA row, higher-current column (exact column, 2.5In/3.0In/4.0In, is not legible in source) | 2 |
| Rated current |  |  | 0.5 |  | A |  | 2 |
| Breaking capacity (DC) |  |  | 50 |  | A | DC interrupting rating, measured at rated voltage, time constant less than 50 microseconds, battery source | 2 |
| Cold resistance |  |  | 580 |  | mOhms | Measured at <10% of rated current, ambient 25 degrees | 2 |
| Voltage drop |  |  | 460 |  | mV |  | 2 |
| Pre-arcing I2t | I2t |  | 0.003 |  | A2Sec | Measured at 10In current | 2 |
| Peak package body temperature (reflow) | TP |  |  | 260 | ℃ | Lead-free solder reflow profile | 5 |
| Infrared reflow temperature |  |  |  | 260 | ℃ | Infrared reflow | 4 |
| Infrared reflow time |  |  |  | 30 | sec | Infrared reflow, temperature 260℃ | 4 |
| Wave solder reservoir temperature |  |  |  | 260 | ℃ | Wave solder | 4 |
| Wave solder time in reservoir |  |  |  | 10 | sec | Wave solder, reservoir temperature 260℃ | 4 |

## CAD (KiCad official)

- Symbol: `F06T0.5`
- Footprint: `Fuse:Fuse_0603_1608Metric`
- 3D model: 0603 (KiCad packages3D, STEP)
- 3D model files: `f06t0-5-etched.step` / `f06t0-5-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `f06t0-5.step` / `f06t0-5.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TLC Electronic datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590210084383842304) (5 pp, sha256 `dedf80289c789749`, retrieved 2026-10-16, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/f06t0-5-datasheet.pdf)