component
ESPM3021-8
Public Made by Adomby adom
ElecSuper MOSFETs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 2h ago |
| viewers | 2h ago |
| espm3021-8-etched.glb | 2h ago |
| espm3021-8-etched.step | 2h ago |
| espm3021-8-hero.glb | 2h ago |
| espm3021-8-hero.overlay.json | 2h ago |
| espm3021-8.glb | 2h ago |
| espm3021-8.kicad_mod | 2h ago |
| espm3021-8.kicad_sym | 2h ago |
| espm3021-8.lbr | 2h ago |
| espm3021-8.step | 2h ago |
| package.json | 2h ago |
| page.json | 2h ago |
| README.md | 2h ago |
ESPM3021-8
ElecSuper · MOSFETs · SOP-8
ESPM3021-8 from ElecSuper, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Source | passive | Source terminal of the P-channel MOSFET; pins 1, 2 and 3 are all Source and are tied together on the package, rated for the -30 V BVDSS of the device. |
| 2 | Source | passive | Source terminal of the P-channel MOSFET; pins 1, 2 and 3 are all Source and are tied together on the package, rated for the -30 V BVDSS of the device. |
| 3 | Source | passive | Source terminal of the P-channel MOSFET; pins 1, 2 and 3 are all Source and are tied together on the package, rated for the -30 V BVDSS of the device. |
| 4 | Gate | input | Gate terminal of the MOSFET; gate-source voltage is limited to ±20 V per the absolute maximum ratings. |
| 5 | Drain | passive | Drain terminal of the MOSFET; pins 5, 6, 7 and 8 are all Drain, with continuous drain current of -12 A at TA=25°C. |
| 6 | Drain | passive | Drain terminal of the MOSFET; pins 5, 6, 7 and 8 are all Drain, with continuous drain current of -12 A at TA=25°C. |
| 7 | Drain | passive | Drain terminal of the MOSFET; pins 5, 6, 7 and 8 are all Drain, with continuous drain current of -12 A at TA=25°C. |
| 8 | Drain | passive | Drain terminal of the MOSFET; pins 5, 6, 7 and 8 are all Drain, with continuous drain current of -12 A at TA=25°C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ElecSuper |
| Package | SOP-8 |
| Category | Transistors/Thyristors |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | BVDSS | -30 | V | 2 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 2 | ||
| Continuous Drain Current | ID | -12 | A | TA=25°C | 2 | ||
| Continuous Drain Current | ID | -10 | A | TA=100°C | 2 | ||
| Maximum Power Dissipation | PD | 3.1 | W | TA=25°C | 2 | ||
| Maximum Power Dissipation | PD | 2 | W | TA=100°C | 2 | ||
| Pulsed Drain Current | IDM | -60 | A | 2 | |||
| Avalanche Current, Single Pulsed | IAS | -22 | A | 2 | |||
| Avalanche Energy, Single Pulsed | EAS | 72 | mJ | 2 | |||
| Operating Junction Temperature | TJ | 150 | °C | 2 | |||
| Storage Temperature Range | Tstg | -55 | 150 | °C | 2 | ||
| Junction-to-Ambient Thermal Resistance | RθJA | 32 | 40 | °C/W | t ≤ 10 s | 2 | |
| Junction-to-Case Thermal Resistance | RθJC | 17 | 24 | °C/W | Steady State | 2 | |
| Drain-to-Source Breakdown Voltage | BVDSS | -30 | V | VGS=0V, ID=-250uA | 3 | ||
| Zero Gate Voltage Drain Current | IDSS | -1 | uA | VDS=-30V, VGS=0V | 3 | ||
| Gate-to-source Leakage Current | IGSS | -100 | 100 | nA | VDS=0V, VGS=±20V | 3 | |
| Gate Threshold Voltage | VGS(TH) | -1 | -1.5 | -2 | V | VGS=VDS, ID=-250uA | 3 |
| Drain-to-source On-resistance | RDS(on) | 9.5 | 13 | mΩ | VGS=-10V, ID=-12A | 3 | |
| Drain-to-source On-resistance | RDS(on) | 14 | 17 | mΩ | VGS=-4.5V, ID=-7A | 3 | |
| Body Diode Forward Voltage | VSD | -0.7 | -1 | V | VGS=0V, IS=-1.0A | 3 |
CAD (KiCad official)
- Symbol:
ESPM3021-8 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
espm3021-8-etched.step/espm3021-8-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);espm3021-8.step/espm3021-8.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ElecSuper datasheet (10 pp, sha256
f6e373682df935ac, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).