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Contents

README

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ESP8285H16

Espressif Systems · RF Transceiver ICs · QFN-32-EP(5x5)

ESP8285H16 from Espressif Systems, in a QFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDDA power_in Analog power supply, 2.5 V to 3.6 V.
2 LNA bidirectional RF antenna interface with chip output impedance of 39 + j6 Ω; a π-type matching network is suggested to match the antenna.
3 VDD3P3 power_in Amplifier power supply, 2.5 V to 3.6 V.
4 VDD3P3 power_in Amplifier power supply, 2.5 V to 3.6 V.
5 VDD_RTC unconnected Listed as NC (1.1 V) in Table 2-1.
6 TOUT input ADC pin that measures either the VDD3P3 supply or the external TOUT input voltage (0 to 1.0 V), but not both at the same time.
7 CHIP_EN input Chip enable: high turns the chip on so it works properly, low turns it off with small current consumed.
8 XPD_DCDC bidirectional Deep-sleep wakeup pin that needs to be connected to EXT_RSTB; also GPIO16.
9 MTMS bidirectional GPIO14, also used for HSPI_CLK, I2C_SCL, PWM2 and IR TX.
10 MTDI bidirectional GPIO12, also used for HSPI_MISO and PWM0.
11 VDDPST power_in Digital/IO power supply, 2.7 V to 3.6 V.
12 MTCK bidirectional GPIO13, also used for HSPI_MOSI and UART0_CTS.
13 MTDO bidirectional GPIO15, also used for boot mode selection, HSPI_CS and UART0_RTS.
14 GPIO2 bidirectional UART TX during flash programming and used for boot mode selection; also GPIO2 and I2C_SDA.
15 GPIO0 bidirectional GPIO0, used for boot mode selection, also SPI_CS2.
16 GPIO4 bidirectional GPIO4, also used for PWM3.
17 VDDPST power_in Digital/IO power supply, 2.7 V to 3.6 V.
18 SDIO_DATA_2 bidirectional Connect to SD_D2 through a 200 Ω series resistor; also GPIO9 and SPIHD.
19 SDIO_DATA_3 bidirectional Connect to SD_D3 through a 200 Ω series resistor; also GPIO10 and SPIWP.
20 SDIO_CMD bidirectional Connect to SD_CMD through a 200 Ω series resistor; used for the embedded flash and not recommended for other uses.
21 SDIO_CLK bidirectional Connect to SD_CLK through a 200 Ω series resistor; used for the embedded flash and not recommended for other uses.
22 SDIO_DATA_0 bidirectional Connect to SD_D0 through a 200 Ω series resistor; used for the embedded flash and not recommended for other uses.
23 SDIO_DATA_1 bidirectional Connect to SD_D1 through a 200 Ω series resistor; used for the embedded flash and not recommended for other uses.
24 GPIO5 bidirectional GPIO5, also used for IR Rx.
25 U0RXD bidirectional UART Rx during flash programming; also GPIO3.
26 U0TXD bidirectional UART TX during flash programming; should not be pulled externally to a low logic level during power-up; also GPIO1 and SPI_CS1.
27 XTAL_OUT bidirectional Crystal oscillator output, which can also provide a BT clock input.
28 XTAL_IN bidirectional Crystal oscillator input.
29 VDDD power_in Analog power supply, 2.5 V to 3.6 V.
30 VDDA power_in Analog power supply, 2.5 V to 3.6 V.
31 RES12K input Connect in series with a 12 kΩ resistor to ground.
32 EXT_RSTB input External reset signal, active at low voltage level.
33 GND power_in Ground (exposed pad), shown as pin 33 in the pin layout figure.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package QFN-32-EP(5x5)
Category RF And Wireless
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working Voltage 2.7 3.3 3.6 V 23
Operating Temperature (ESP8285H16 model) -40 105 °C ESP8285H16 model, Table 1-1 6
Input low voltage VIL -0.3 0.25 V 23
Input high voltage VIH 0.75 3.6 V 23
Output low voltage VOL 0.1 V 23
Output high voltage VOH 0.8 V 23
Maximum I/O current IMAX 12 mA 23
Maximum Soldering Temperature 260 ℃ IPC/JEDEC J-STD-020 23
Electrostatic Discharge (HBM) 2 KV TAMB = 25 ℃ 23
Electrostatic Discharge (CDM) 0.5 KV TAMB = 25 ℃ 23
Input frequency 2412 2483.5 MHz 24
Output power of PA for 72.2 Mbps 13 14 15 dBm 24
Output power of PA for 11b mode 18 19 20 dBm 24
Rise-time of VDD33 t1 10 2000 μs 24
Rise-time of EXT_RSTB t2 0 2 ms 24
EXT_RSTB goes high after VDD33 t3 0.1 ms 24
Rise-time of CHIP_EN t4 0 2 ms 24
CHIP_EN goes high after EXT_RSTB t5 0.1 ms 24

CAD (KiCad official)

  • Symbol: ESP8285H16
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm
  • 3D model: QFN-32-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: esp8285h16-etched.step / esp8285h16-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp8285h16.step / esp8285h16.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (30 pp, sha256 dce7d19cb67c8ef9, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF