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ESP32-WROVER-E-N16R8

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Espressif Systems WiFi Modules, ESP32-WROVER-E. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-WROVER-E-N16R8

Espressif Systems · WiFi Modules · ESP32-WROVER-E

ESP32-WROVER-E-N16R8 from Espressif Systems, in a ESP32-WROVER-E. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground.
2 3V3 power_in Module power supply; VDD33 operating range is 3.0 V min, 3.3 V typ, 3.6 V max (Table 14).
3 EN input Module-enable signal, active high.
4 SENSOR_VP input GPIO36 with ADC1_CH0 and RTC_GPIO0 alternate functions.
5 SENSOR_VN input GPIO39 with ADC1_CH3 and RTC_GPIO3 alternate functions.
6 IO34 input GPIO34 with ADC1_CH6 and RTC_GPIO4 alternate functions.
7 IO35 input GPIO35 with ADC1_CH7 and RTC_GPIO5 alternate functions.
8 IO32 bidirectional GPIO32 with XTAL_32K_P (32.768 kHz crystal input), ADC1_CH4, TOUCH9 and RTC_GPIO9 functions.
9 IO33 bidirectional GPIO33 with XTAL_32K_N (32.768 kHz crystal output), ADC1_CH5, TOUCH8 and RTC_GPIO8 functions.
10 IO25 bidirectional GPIO25 with DAC_1, ADC2_CH8, RTC_GPIO6 and EMAC_RXD0 functions.
11 IO26 bidirectional GPIO26 with DAC_2, ADC2_CH9, RTC_GPIO7 and EMAC_RXD1 functions.
12 IO27 bidirectional GPIO27 with ADC2_CH7, TOUCH7, RTC_GPIO17 and EMAC_RX_DV functions.
13 IO14 bidirectional GPIO14 with ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK and EMAC_TXD2 functions.
14 IO12 bidirectional GPIO12 with ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2 and EMAC_TXD3 functions; the schematic note says it should be kept low at power-on.
15 GND power_in Ground.
16 IO13 bidirectional GPIO13 with ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3 and EMAC_RX_ER functions.
17 NC unconnected Not led out; Table 3 refers to note 2 (GPIO6 to GPIO11 are tied to the in-package flash and not exposed).
18 NC unconnected Not led out; Table 3 refers to note 2 (GPIO6 to GPIO11 are tied to the in-package flash and not exposed).
19 NC unconnected Not led out; Table 3 refers to note 2 (GPIO6 to GPIO11 are tied to the in-package flash and not exposed).
20 NC unconnected Not led out; Table 3 refers to note 2 (GPIO6 to GPIO11 are tied to the in-package flash and not exposed).
21 NC unconnected Not led out; Table 3 refers to note 2 (GPIO6 to GPIO11 are tied to the in-package flash and not exposed).
22 NC unconnected Not led out; Table 3 refers to note 2 (GPIO6 to GPIO11 are tied to the in-package flash and not exposed).
23 IO15 bidirectional GPIO15 with ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD and EMAC_RXD3 functions.
24 IO2 bidirectional GPIO2 with ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0 and SD_DATA0 functions; it is a boot strapping pin.
25 IO0 bidirectional GPIO0 with ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1 and EMAC_TX_CLK functions; it is a boot strapping pin.
26 IO4 bidirectional GPIO4 with ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1 and EMAC_TX_ER functions.
27 NC unconnected No function listed in Table 3.
28 NC unconnected No function listed in Table 3.
29 IO5 bidirectional GPIO5 with VSPICS0, HS1_DATA6 and EMAC_RX_CLK functions; it is a boot strapping pin.
30 IO18 bidirectional GPIO18 with VSPICLK and HS1_DATA7 functions.
31 IO19 bidirectional GPIO19 with VSPIQ, U0CTS and EMAC_TXD0 functions.
32 NC unconnected No function listed in Table 3.
33 IO21 bidirectional GPIO21 with VSPIHD and EMAC_TX_EN functions.
34 RXD0 bidirectional GPIO3 with U0RXD (UART0 receive, used for firmware download and log output) and CLK_OUT2 functions.
35 TXD0 bidirectional GPIO1 with U0TXD (UART0 transmit, used for firmware download and log output), CLK_OUT3 and EMAC_RXD2 functions.
36 IO22 bidirectional GPIO22 with VSPIWP, U0RTS and EMAC_TXD1 functions.
37 IO23 bidirectional GPIO23 with VSPID and HS1_STROBE functions.
38 GND power_in Ground.
39 GND power_in Exposed thermal pad labelled Pin 39 and P_GND; soldering it to base-board ground is optional and improves thermal performance, but excess solder paste can raise the module gap.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package ESP32-WROVER-E
Category IoT/Communication Modules
Pins 39

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 29
Storage temperature Tstore -40 105 °C 29
Power supply voltage VDD33 3 3.3 3.6 V 29
Current delivered by external power supply IV DD 0.5 A 29
Operating temperature T -40 85 °C 29
Low-level input voltage VIL -0.3 V 28
High-level input current IIH 50 nA 28
Low-level input current IIL 50 nA 28
Differential nonlinearity DNL -7 7 LSB RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off 27
Integral nonlinearity INL -12 12 LSB RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off 27
ADC total error -23 23 mV Atten = 0, effective measurement range of 100 ∼ 950 mV 27
ADC total error -30 30 mV Atten = 1, effective measurement range of 100 ∼ 1250 mV 27
ADC total error -40 40 mV Atten = 2, effective measurement range of 150 ∼ 1750 mV 27
ADC total error -60 60 mV Atten = 3, effective measurement range of 150 ∼ 2450 mV 27
Flash power supply voltage (3.3 V) VCC 2.7 3.3 3.6 V 30
PSRAM power supply voltage (3.3 V) VCC 2.7 3.3 3.6 V 30
Flash maximum clock frequency FC 80 MHz 30
PSRAM maximum clock frequency FC 80 MHz 30
Flash program/erase cycles 100000 cycles 30
Flash data retention time TRET 20 years 30
Flash page program time TPP 0.8 5 ms 30
Crystal frequency tolerance -10 10 ppm 40 MHz crystal U1 (module schematic) 37
Crystal frequency 40 MHz 40 MHz crystal oscillator U1 (module schematic) 37

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Solder, Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 16: Reflow Profile 47

CAD (KiCad official)

  • Symbol: ESP32-WROVER-E-N16R8
  • Footprint: PCM_Espressif:ESP32-WROVER-E
  • 3D model: ESP32-WROVER-E (KiCad packages3D, STEP)
  • 3D model files: esp32-wrover-e-n16r8-etched.step / esp32-wrover-e-n16r8-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-wrover-e-n16r8.step / esp32-wrover-e-n16r8.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (53 pp, sha256 611e8506f352225e, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF