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ESP32-WROVER-E-N16R2
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Espressif Systems RF and Wireless, 38-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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ESP32-WROVER-E-N16R2
Espressif Systems · RF and Wireless · 38-SMD Module
ESP32-WROVER-E-N16R2 from Espressif Systems, in a 38-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin of the module. |
| 2 | 3V3 | power_in | Module power supply input; VDD33 is specified at 3.0 V to 3.6 V (3.3 V typical), with an external supply able to deliver at least 0.5 A. |
| 3 | EN | input | Module-enable signal, active high; an RC delay (about 10 kΩ and 1 µF) at this pin is recommended to keep chip power-up stable. |
| 4 | SENSOR_VP | input | Input-only GPIO36 that can also serve as ADC1_CH0 and RTC_GPIO0. |
| 5 | SENSOR_VN | input | Input-only GPIO39 that can also serve as ADC1_CH3 and RTC_GPIO3. |
| 6 | IO34 | input | Input-only GPIO34 that can also serve as ADC1_CH6 and RTC_GPIO4. |
| 7 | IO35 | input | Input-only GPIO35 that can also serve as ADC1_CH7 and RTC_GPIO5. |
| 8 | IO32 | bidirectional | GPIO32 that can also serve as the 32.768 kHz crystal oscillator input XTAL_32K_P, ADC1_CH4, TOUCH9 and RTC_GPIO9. |
| 9 | IO33 | bidirectional | GPIO33 that can also serve as the 32.768 kHz crystal oscillator output XTAL_32K_N, ADC1_CH5, TOUCH8 and RTC_GPIO8. |
| 10 | IO25 | bidirectional | GPIO25 that can also serve as DAC_1, ADC2_CH8, RTC_GPIO6 and EMAC_RXD0. |
| 11 | IO26 | bidirectional | GPIO26 that can also serve as DAC_2, ADC2_CH9, RTC_GPIO7 and EMAC_RXD1. |
| 12 | IO27 | bidirectional | GPIO27 that can also serve as ADC2_CH7, TOUCH7, RTC_GPIO17 and EMAC_RX_DV. |
| 13 | IO14 | bidirectional | GPIO14 that can also serve as ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK and EMAC_TXD2. |
| 14 | IO12 | bidirectional | GPIO12 (MTDI) that is a strapping pin controlling the internal LDO (VDD_SDIO) voltage, and the datasheet states it should be kept low when the module is powered on; also ADC2_CH5, TOUCH5, RTC_GPIO15, HSPIQ, HS2_DATA2, SD_DATA2 and EMAC_TXD3. |
| 15 | GND | power_in | Ground pin of the module. |
| 16 | IO13 | bidirectional | GPIO13 that can also serve as ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3 and EMAC_RX_ER. |
| 17 | NC | unconnected | Not led out on the module; per note 2, the chip's GPIO6 to GPIO11 connect internally to the in-package SPI flash and are not exposed. |
| 18 | NC | unconnected | Not led out on the module; per note 2, the chip's GPIO6 to GPIO11 connect internally to the in-package SPI flash and are not exposed. |
| 19 | NC | unconnected | Not led out on the module; per note 2, the chip's GPIO6 to GPIO11 connect internally to the in-package SPI flash and are not exposed. |
| 20 | NC | unconnected | Not led out on the module; per note 2, the chip's GPIO6 to GPIO11 connect internally to the in-package SPI flash and are not exposed. |
| 21 | NC | unconnected | Not led out on the module; per note 2, the chip's GPIO6 to GPIO11 connect internally to the in-package SPI flash and are not exposed. |
| 22 | NC | unconnected | Not led out on the module; per note 2, the chip's GPIO6 to GPIO11 connect internally to the in-package SPI flash and are not exposed. |
| 23 | IO15 | bidirectional | GPIO15 (MTDO) that is a strapping pin controlling U0TXD printing, default pull-up; also ADC2_CH3, TOUCH3, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD and EMAC_RXD3. |
| 24 | IO2 | bidirectional | GPIO2 that is a strapping pin for chip boot mode together with GPIO0, default pull-down; also ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0 and SD_DATA0. |
| 25 | IO0 | bidirectional | GPIO0 that is a strapping pin for chip boot mode together with GPIO2, default pull-up; also ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1 and EMAC_TX_CLK. |
| 26 | IO4 | bidirectional | GPIO4 that can also serve as ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1 and EMAC_TX_ER. |
| 27 | NC | unconnected | Listed as not connected on the module with no function given in the pin table. |
| 28 | NC | unconnected | Listed as not connected on the module with no function given in the pin table. |
| 29 | IO5 | bidirectional | GPIO5 that is a strapping pin for SDIO slave timing together with MTDO, default pull-up; also VSPICS0, HS1_DATA6 and EMAC_RX_CLK. |
| 30 | IO18 | bidirectional | GPIO18 that can also serve as VSPICLK and HS1_DATA7. |
| 31 | IO19 | bidirectional | GPIO19 that can also serve as VSPIQ, U0CTS and EMAC_TXD0. |
| 32 | NC | unconnected | Listed as not connected on the module with no function given in the pin table. |
| 33 | IO21 | bidirectional | GPIO21 that can also serve as VSPIHD and EMAC_TX_EN. |
| 34 | RXD0 | bidirectional | GPIO3 that serves as the UART0 receive pin U0RXD, also CLK_OUT2, used for firmware download and log output. |
| 35 | TXD0 | bidirectional | GPIO1 that serves as the UART0 transmit pin U0TXD, also CLK_OUT3 and EMAC_RXD2, used for firmware download and log output. |
| 36 | IO22 | bidirectional | GPIO22 that can also serve as VSPIWP, U0RTS and EMAC_TXD1. |
| 37 | IO23 | bidirectional | GPIO23 that can also serve as VSPID and HS1_STROBE. |
| 38 | GND | power_in | Ground pin of the module. |
| 39 | GND | power_in | Exposed thermal pad (EPAD) tied to ground; soldering it to the base-board ground is optional but improves thermal performance, and too much solder paste can degrade the adhesion of other pins. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Espressif Systems |
| Package | 38-SMD Module |
| Category | RF and Wireless |
| Pins | 39 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage | VDD33 | -0.3 | 3.6 | V | 29 | ||
| Storage temperature | Tstore | -40 | 105 | °C | 29 | ||
| Power supply voltage | VDD33 | 3 | 3.3 | 3.6 | V | 29 | |
| Current delivered by external power supply | IV DD | 0.5 | A | 29 | |||
| Operating temperature | T | -40 | 85 | °C | 29 | ||
| Flash power supply voltage (1.8 V) | VCC | 1.65 | 1.8 | 2 | V | 31 | |
| Flash power supply voltage (3.3 V) | VCC | 2.7 | 3.3 | 3.6 | V | 31 | |
| Flash maximum clock frequency | FC | 80 | MHz | 31 | |||
| Flash program/erase cycles | 100000 | cycles | 31 | ||||
| Flash data retention time | TRET | 20 | years | 31 | |||
| Flash page program time | TPP | 0.8 | 5 | ms | 31 | ||
| Flash sector erase time (4 KB) | TSE | 70 | 500 | ms | 31 | ||
| Flash block erase time (32 KB) | TBE1 | 0.2 | 2 | s | 31 | ||
| Flash block erase time (64 KB) | TBE2 | 0.3 | 3 | s | 31 | ||
| Flash chip erase time (16 Mb) | TCE | 7 | 20 | s | 31 | ||
| PSRAM power supply voltage (1.8 V) | VCC | 1.62 | 1.8 | 1.98 | V | 31 | |
| PSRAM power supply voltage (3.3 V) | VCC | 2.7 | 3.3 | 3.6 | V | 31 | |
| PSRAM maximum clock frequency | FC | 80 | MHz | 31 | |||
| Differential nonlinearity (DNL) | -7 | 7 | LSB | RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off | 27 | ||
| Integral nonlinearity (INL) | -12 | 12 | LSB | RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off | 27 | ||
| ADC total error after calibration | -23 | 23 | mV | Atten = 0, effective measurement range of 100 ∼ 950 mV | 27 | ||
| ADC total error after calibration | -30 | 30 | mV | Atten = 1, effective measurement range of 100 ∼ 1250 mV | 27 | ||
| ADC total error after calibration | -40 | 40 | mV | Atten = 2, effective measurement range of 150 ∼ 1750 mV | 27 | ||
| ADC total error after calibration | -60 | 60 | mV | Atten = 3, effective measurement range of 150 ∼ 2450 mV | 27 | ||
| High-level input current | IIH | 50 | nA | 29 | |||
| Low-level input current | IIL | 50 | nA | 29 | |||
| Low-level input voltage of CHIP_PU to shut down the chip | VIL_nRST | 0.6 | V | 30 | |||
| Low-level sink current | IOL | 28 | mA | VDD1 = 3.3 V, VOL = 0.495 V, output drive strength set to the maximum | 29 | ||
| High-level source current, VDD3P3_CPU power domain | IOH | 40 | mA | VDD1 = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum | 29 | ||
| High-level source current, VDD3P3_RTC power domain | IOH | 40 | mA | VDD1 = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum | 30 | ||
| High-level source current, VDD_SDIO power domain | IOH | 20 | mA | VDD1 = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum | 30 | ||
| Pin capacitance | CIN | 2 | pF | 28 | |||
| Resistance of internal pull-up resistor | RPU | 45 | kΩ | 30 | |||
| Resistance of internal pull-down resistor | RPD | 45 | kΩ | 30 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Solder, Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 16: Reflow Profile | 47 |
CAD (KiCad official)
- Symbol:
ESP32-WROVER-E-N16R2 - Footprint:
PCM_Espressif:ESP32-WROVER-E - 3D model: 38-SMD Module (KiCad packages3D, STEP)
- 3D model files:
esp32-wrover-e-n16r2-etched.step/esp32-wrover-e-n16r2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esp32-wrover-e-n16r2.step/esp32-wrover-e-n16r2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Espressif Systems datasheet (53 pp, sha256
611e8506f352225e, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ESP32-WROVER-E-N16R2
**Espressif Systems** · RF and Wireless · 38-SMD Module
ESP32-WROVER-E-N16R2 from Espressif Systems, in a 38-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin of the module. |
| 2 | 3V3 | power_in | Module power supply input; VDD33 is specified at 3.0 V to 3.6 V (3.3 V typical), with an external supply able to deliver at least 0.5 A. |
| 3 | EN | input | Module-enable signal, active high; an RC delay (about 10 kΩ and 1 µF) at this pin is recommended to keep chip power-up stable. |
| 4 | SENSOR_VP | input | Input-only GPIO36 that can also serve as ADC1_CH0 and RTC_GPIO0. |
| 5 | SENSOR_VN | input | Input-only GPIO39 that can also serve as ADC1_CH3 and RTC_GPIO3. |
| 6 | IO34 | input | Input-only GPIO34 that can also serve as ADC1_CH6 and RTC_GPIO4. |
| 7 | IO35 | input | Input-only GPIO35 that can also serve as ADC1_CH7 and RTC_GPIO5. |
| 8 | IO32 | bidirectional | GPIO32 that can also serve as the 32.768 kHz crystal oscillator input XTAL_32K_P, ADC1_CH4, TOUCH9 and RTC_GPIO9. |
| 9 | IO33 | bidirectional | GPIO33 that can also serve as the 32.768 kHz crystal oscillator output XTAL_32K_N, ADC1_CH5, TOUCH8 and RTC_GPIO8. |
| 10 | IO25 | bidirectional | GPIO25 that can also serve as DAC_1, ADC2_CH8, RTC_GPIO6 and EMAC_RXD0. |
| 11 | IO26 | bidirectional | GPIO26 that can also serve as DAC_2, ADC2_CH9, RTC_GPIO7 and EMAC_RXD1. |
| 12 | IO27 | bidirectional | GPIO27 that can also serve as ADC2_CH7, TOUCH7, RTC_GPIO17 and EMAC_RX_DV. |
| 13 | IO14 | bidirectional | GPIO14 that can also serve as ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK and EMAC_TXD2. |
| 14 | IO12 | bidirectional | GPIO12 (MTDI) that is a strapping pin controlling the internal LDO (VDD_SDIO) voltage, and the datasheet states it should be kept low when the module is powered on; also ADC2_CH5, TOUCH5, RTC_GPIO15, HSPIQ, HS2_DATA2, SD_DATA2 and EMAC_TXD3. |
| 15 | GND | power_in | Ground pin of the module. |
| 16 | IO13 | bidirectional | GPIO13 that can also serve as ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3 and EMAC_RX_ER. |
| 17 | NC | unconnected | Not led out on the module; per note 2, the chip's GPIO6 to GPIO11 connect internally to the in-package SPI flash and are not exposed. |
| 18 | NC | unconnected | Not led out on the module; per note 2, the chip's GPIO6 to GPIO11 connect internally to the in-package SPI flash and are not exposed. |
| 19 | NC | unconnected | Not led out on the module; per note 2, the chip's GPIO6 to GPIO11 connect internally to the in-package SPI flash and are not exposed. |
| 20 | NC | unconnected | Not led out on the module; per note 2, the chip's GPIO6 to GPIO11 connect internally to the in-package SPI flash and are not exposed. |
| 21 | NC | unconnected | Not led out on the module; per note 2, the chip's GPIO6 to GPIO11 connect internally to the in-package SPI flash and are not exposed. |
| 22 | NC | unconnected | Not led out on the module; per note 2, the chip's GPIO6 to GPIO11 connect internally to the in-package SPI flash and are not exposed. |
| 23 | IO15 | bidirectional | GPIO15 (MTDO) that is a strapping pin controlling U0TXD printing, default pull-up; also ADC2_CH3, TOUCH3, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD and EMAC_RXD3. |
| 24 | IO2 | bidirectional | GPIO2 that is a strapping pin for chip boot mode together with GPIO0, default pull-down; also ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0 and SD_DATA0. |
| 25 | IO0 | bidirectional | GPIO0 that is a strapping pin for chip boot mode together with GPIO2, default pull-up; also ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1 and EMAC_TX_CLK. |
| 26 | IO4 | bidirectional | GPIO4 that can also serve as ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1 and EMAC_TX_ER. |
| 27 | NC | unconnected | Listed as not connected on the module with no function given in the pin table. |
| 28 | NC | unconnected | Listed as not connected on the module with no function given in the pin table. |
| 29 | IO5 | bidirectional | GPIO5 that is a strapping pin for SDIO slave timing together with MTDO, default pull-up; also VSPICS0, HS1_DATA6 and EMAC_RX_CLK. |
| 30 | IO18 | bidirectional | GPIO18 that can also serve as VSPICLK and HS1_DATA7. |
| 31 | IO19 | bidirectional | GPIO19 that can also serve as VSPIQ, U0CTS and EMAC_TXD0. |
| 32 | NC | unconnected | Listed as not connected on the module with no function given in the pin table. |
| 33 | IO21 | bidirectional | GPIO21 that can also serve as VSPIHD and EMAC_TX_EN. |
| 34 | RXD0 | bidirectional | GPIO3 that serves as the UART0 receive pin U0RXD, also CLK_OUT2, used for firmware download and log output. |
| 35 | TXD0 | bidirectional | GPIO1 that serves as the UART0 transmit pin U0TXD, also CLK_OUT3 and EMAC_RXD2, used for firmware download and log output. |
| 36 | IO22 | bidirectional | GPIO22 that can also serve as VSPIWP, U0RTS and EMAC_TXD1. |
| 37 | IO23 | bidirectional | GPIO23 that can also serve as VSPID and HS1_STROBE. |
| 38 | GND | power_in | Ground pin of the module. |
| 39 | GND | power_in | Exposed thermal pad (EPAD) tied to ground; soldering it to the base-board ground is optional but improves thermal performance, and too much solder paste can degrade the adhesion of other pins. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Espressif Systems |
| Package | 38-SMD Module |
| Category | RF and Wireless |
| Pins | 39 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage | VDD33 | -0.3 | | 3.6 | V | | 29 |
| Storage temperature | Tstore | -40 | | 105 | °C | | 29 |
| Power supply voltage | VDD33 | 3 | 3.3 | 3.6 | V | | 29 |
| Current delivered by external power supply | IV DD | 0.5 | | | A | | 29 |
| Operating temperature | T | -40 | | 85 | °C | | 29 |
| Flash power supply voltage (1.8 V) | VCC | 1.65 | 1.8 | 2 | V | | 31 |
| Flash power supply voltage (3.3 V) | VCC | 2.7 | 3.3 | 3.6 | V | | 31 |
| Flash maximum clock frequency | FC | 80 | | | MHz | | 31 |
| Flash program/erase cycles | | 100000 | | | cycles | | 31 |
| Flash data retention time | TRET | 20 | | | years | | 31 |
| Flash page program time | TPP | | 0.8 | 5 | ms | | 31 |
| Flash sector erase time (4 KB) | TSE | | 70 | 500 | ms | | 31 |
| Flash block erase time (32 KB) | TBE1 | | 0.2 | 2 | s | | 31 |
| Flash block erase time (64 KB) | TBE2 | | 0.3 | 3 | s | | 31 |
| Flash chip erase time (16 Mb) | TCE | | 7 | 20 | s | | 31 |
| PSRAM power supply voltage (1.8 V) | VCC | 1.62 | 1.8 | 1.98 | V | | 31 |
| PSRAM power supply voltage (3.3 V) | VCC | 2.7 | 3.3 | 3.6 | V | | 31 |
| PSRAM maximum clock frequency | FC | 80 | | | MHz | | 31 |
| Differential nonlinearity (DNL) | | -7 | | 7 | LSB | RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off | 27 |
| Integral nonlinearity (INL) | | -12 | | 12 | LSB | RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off | 27 |
| ADC total error after calibration | | -23 | | 23 | mV | Atten = 0, effective measurement range of 100 ∼ 950 mV | 27 |
| ADC total error after calibration | | -30 | | 30 | mV | Atten = 1, effective measurement range of 100 ∼ 1250 mV | 27 |
| ADC total error after calibration | | -40 | | 40 | mV | Atten = 2, effective measurement range of 150 ∼ 1750 mV | 27 |
| ADC total error after calibration | | -60 | | 60 | mV | Atten = 3, effective measurement range of 150 ∼ 2450 mV | 27 |
| High-level input current | IIH | | | 50 | nA | | 29 |
| Low-level input current | IIL | | | 50 | nA | | 29 |
| Low-level input voltage of CHIP_PU to shut down the chip | VIL_nRST | | | 0.6 | V | | 30 |
| Low-level sink current | IOL | | 28 | | mA | VDD1 = 3.3 V, VOL = 0.495 V, output drive strength set to the maximum | 29 |
| High-level source current, VDD3P3_CPU power domain | IOH | | 40 | | mA | VDD1 = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum | 29 |
| High-level source current, VDD3P3_RTC power domain | IOH | | 40 | | mA | VDD1 = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum | 30 |
| High-level source current, VDD_SDIO power domain | IOH | | 20 | | mA | VDD1 = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum | 30 |
| Pin capacitance | CIN | | 2 | | pF | | 28 |
| Resistance of internal pull-up resistor | RPU | | 45 | | kΩ | | 30 |
| Resistance of internal pull-down resistor | RPD | | 45 | | kΩ | | 30 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | Solder, Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 16: Reflow Profile | 47 |
## CAD (KiCad official)
- Symbol: `ESP32-WROVER-E-N16R2`
- Footprint: `PCM_Espressif:ESP32-WROVER-E`
- 3D model: 38-SMD Module (KiCad packages3D, STEP)
- 3D model files: `esp32-wrover-e-n16r2-etched.step` / `esp32-wrover-e-n16r2-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esp32-wrover-e-n16r2.step` / `esp32-wrover-e-n16r2.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Espressif Systems datasheet](https://www.espressif.com/sites/default/files/documentation/esp32-wrover-e_esp32-wrover-ie_datasheet_en.pdf) (53 pp, sha256 `611e8506f352225e`, retrieved 2026-10-28, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/esp32-wrover-e-n16r2-datasheet.pdf)