component

ESP32-WROOM-32UE

Public Made by Adom

by adom

Espressif Systems RF and Wireless, 38-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentrf and wirelessesp32-wroom-32uefactory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
esp32-wroom-32ue / README.md
History Download
Ray Publish 0.1.1 cbe4d98 20h ago

ESP32-WROOM-32UE

Espressif Systems · RF and Wireless · 38-SMD Module

ESP32-WROOM-32UE from Espressif Systems, in a 38-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin of the module.
2 3V3 power_in Module power supply input; VDD33 recommended operating range is 3.0 V (min) to 3.3 V (typ) to 3.6 V (max), with at least 0.5 A supplied by the external source.
3 EN input High enables the chip and low shuts it down; the pin must not be left floating.
4 SENSOR_VP input GPIO36, ADC1_CH0, RTC_GPIO0; analog-enabled input usable for ADC1 channel 0 measurements.
5 SENSOR_VN input GPIO39, ADC1_CH3, RTC_GPIO3; analog-enabled input usable for ADC1 channel 3 measurements.
6 IO34 input GPIO34, ADC1_CH6, RTC_GPIO4; input-only analog-enabled GPIO.
7 IO35 input GPIO35, ADC1_CH7, RTC_GPIO5; input-only analog-enabled GPIO.
8 IO32 bidirectional GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9.
9 IO33 bidirectional GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8.
10 IO25 bidirectional GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0; DAC channel 1 output.
11 IO26 bidirectional GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1; DAC channel 2 output.
12 IO27 bidirectional GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV.
13 IO14 bidirectional GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2.
14 IO12 bidirectional GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3; must be kept low when the module is powered on.
15 GND power_in Ground pin of the module.
16 IO13 bidirectional GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER.
17 NC unconnected Not led out; the chip's GPIO6-GPIO11 pins that connect to the in-package SPI flash are not exposed on the module.
18 NC unconnected Not led out; the chip's GPIO6-GPIO11 pins that connect to the in-package SPI flash are not exposed on the module.
19 NC unconnected Not led out; the chip's GPIO6-GPIO11 pins that connect to the in-package SPI flash are not exposed on the module.
20 NC unconnected Not led out; the chip's GPIO6-GPIO11 pins that connect to the in-package SPI flash are not exposed on the module.
21 NC unconnected Not led out; the chip's GPIO6-GPIO11 pins that connect to the in-package SPI flash are not exposed on the module.
22 NC unconnected Not led out; the chip's GPIO6-GPIO11 pins that connect to the in-package SPI flash are not exposed on the module.
23 IO15 bidirectional GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3; strapping pin for U0TXD printing control, default pull-up.
24 IO2 bidirectional GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0; strapping pin for chip boot mode, default pull-down.
25 IO0 bidirectional GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK; strapping pin for chip boot mode, default pull-up.
26 IO4 bidirectional GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER.
27 IO16 bidirectional GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT; in variants with embedded QSPI PSRAM (ESP32-D0WDR2-V3) it is connected to the PSRAM and cannot be used for other functions.
28 IO17 bidirectional GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180.
29 IO5 bidirectional GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK; strapping pin for SDIO slave timing, default pull-up.
30 IO18 bidirectional GPIO18, VSPICLK, HS1_DATA7.
31 IO19 bidirectional GPIO19, VSPIQ, U0CTS, EMAC_TXD0.
32 NC unconnected Listed as NC in Table 3 with no function or note given.
33 IO21 bidirectional GPIO21, VSPIHD, EMAC_TX_EN.
34 RXD0 bidirectional GPIO3, U0RXD, CLK_OUT2; UART0 receive, used for firmware download and log output.
35 TXD0 bidirectional GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2; UART0 transmit, used for firmware download and log output.
36 IO22 bidirectional GPIO22, VSPIWP, U0RTS, EMAC_TXD1.
37 IO23 bidirectional GPIO23, VSPID, HS1_STROBE.
38 GND power_in Ground pin of the module.
39 GND passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 38-SMD Module
Category RF and Wireless
Pins 39

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 28
Storage temperature TSTORE -40 105 °C 28
Power supply voltage VDD33 3 3.3 3.6 V 28
Current delivered by external power supply IVDD 0.5 A 28
Operating ambient temperature T -40 85 °C 85 °C version 28
Operating ambient temperature T -40 105 °C 105 °C version 28
Low-level input voltage VIL -0.3 V 3.3 V, 25 °C 28
High-level input current IIH 50 nA 3.3 V, 25 °C 28
Low-level input current IIL 50 nA 3.3 V, 25 °C 28
Low-level input voltage of CHIP_PU to shut down the chip VIL_nRST 0.6 V 3.3 V, 25 °C 29
Power supply voltage (1.8 V) VCC 1.65 1.8 2 V 30
Power supply voltage (3.3 V) VCC 2.7 3.3 3.6 V 30
Maximum clock frequency (flash) FC 80 MHz 30
Program/erase cycles 100000 cycles 30
Data retention time TRET 20 years 30
Page program time TPP 0.8 5 ms 30
Sector erase time (4 KB) TSE 70 500 ms 30
Block erase time (32 KB) TBE1 0.2 2 s 30
Block erase time (64 KB) TBE2 0.3 3 s 30
Chip erase time (16 Mb) TCE 7 20 s 30
Chip erase time (32 Mb) TCE 20 60 s 30
Chip erase time (64 Mb) TCE 25 100 s 30
Chip erase time (128 Mb) TCE 60 200 s 30
Chip erase time (256 Mb) TCE 70 300 s 30
Differential nonlinearity (ADC) DNL -7 7 LSB RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off 25
Integral nonlinearity (ADC) INL -12 12 LSB RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off 25
Total error (ADC calibration) -23 23 mV Atten = 0, effective measurement range of 100 ∼ 950 mV 26
Total error (ADC calibration) -30 30 mV Atten = 1, effective measurement range of 100 ∼ 1250 mV 26
Total error (ADC calibration) -40 40 mV Atten = 2, effective measurement range of 150 ∼ 1750 mV 26
Total error (ADC calibration) -60 60 mV Atten = 3, effective measurement range of 150 ∼ 2450 mV 26
Center frequency range of operating channel (Wi-Fi) 2412 2484 MHz 31
Center frequency range of operating channel (Bluetooth LE) 2402 2480 MHz 33
RF transmit power range (Bluetooth LE) -12 9 dBm 33
Sensitivity (Basic Data Rate receiver) -90 -89 -88 dBm @0.1% BER 33
Adjacent channel selectivity C/I -6 dB F = F0 + 1 MHz 33
Adjacent channel selectivity C/I -25 dB F = F0 + 2 MHz 33
Adjacent channel selectivity C/I -33 dB F = F0, 2 MHz 33
Adjacent channel selectivity C/I -45 dB F = F0, 3 MHz 33
Out-of-band blocking performance -10 dBm 30 MHz ~ 2000 MHz 33
Out-of-band blocking performance -27 dBm 2000 MHz ~ 2400 MHz 33
RF power control range (Basic Data Rate transmitter) -12 9 dBm 34
∆f1avg ∆f1avg 155 kHz 34
∆f2max ∆f2max 127 kHz 34
Sensitivity (π/4 DQPSK, EDR receiver) -90 -89 -88 dBm π/4 DQPSK, @0.01% BER 34
Sensitivity (8DPSK, EDR receiver) -84 -83 -82 dBm 8DPSK, @0.01% BER 34
RF power control range (EDR transmitter) -12 9 dBm 35
In-band spurious emissions -53 dBm F = F0 +/- > 3 MHz 35
Sensitivity (Bluetooth LE receiver) -94 -93 -92 dBm @30.8% PER 35
Out-of-band blocking performance (Bluetooth LE) -10 dBm 30 MHz ~ 2000 MHz 36
Out-of-band blocking performance (Bluetooth LE) -27 dBm 2000 MHz ~ 2400 MHz 36
RF power control range (Bluetooth LE transmitter) -12 9 dBm 36
∆f1avg (Bluetooth LE) ∆f1avg 265 kHz 36
∆f2max (Bluetooth LE) ∆f2max 210 kHz 36

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Solder, Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 15: Reflow Profile 46

CAD (KiCad official)

  • Symbol: ESP32-WROOM-32UE
  • Footprint: PCM_Espressif:ESP32-WROOM-32UE
  • 3D model: 38-SMD Module (KiCad packages3D, STEP)
  • 3D model files: esp32-wroom-32ue-etched.step / esp32-wroom-32ue-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-wroom-32ue.step / esp32-wroom-32ue.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (52 pp, sha256 4c7a345d1c1bfec3, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF