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ESP32-WROOM-32UE-N8R2

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Espressif Systems RF and Wireless, 38-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-WROOM-32UE-N8R2

Espressif Systems · RF and Wireless · 38-SMD Module

ESP32-WROOM-32UE-N8R2 from Espressif Systems, in a 38-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground.
2 3V3 power_in Power supply; recommended 3.0 V to 3.6 V (3.3 V typ) with at least 0.5 A deliverable.
3 EN input Chip enable: high = on, low = chip shuts down; do not leave the pin floating.
4 SENSOR_VP input GPIO36, ADC1_CH0, RTC_GPIO0 (input only).
5 SENSOR_VN input GPIO39, ADC1_CH3, RTC_GPIO3 (input only).
6 IO34 input GPIO34, ADC1_CH6, RTC_GPIO4 (input only).
7 IO35 input GPIO35, ADC1_CH7, RTC_GPIO5 (input only).
8 IO32 bidirectional GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9.
9 IO33 bidirectional GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8.
10 IO25 bidirectional GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0.
11 IO26 bidirectional GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1.
12 IO27 bidirectional GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV.
13 IO14 bidirectional GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2.
14 IO12 bidirectional GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI (strapping pin for VDD_SDIO voltage, default pull-down), HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3; keep low at power-on.
15 GND power_in Ground.
16 IO13 bidirectional GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER.
17 NC unconnected No connection; GPIO6 to GPIO11 are connected to the on-module SPI flash and not led out.
18 NC unconnected No connection; GPIO6 to GPIO11 are connected to the on-module SPI flash and not led out.
19 NC unconnected No connection; GPIO6 to GPIO11 are connected to the on-module SPI flash and not led out.
20 NC unconnected No connection; GPIO6 to GPIO11 are connected to the on-module SPI flash and not led out.
21 NC unconnected No connection; GPIO6 to GPIO11 are connected to the on-module SPI flash and not led out.
22 NC unconnected No connection; GPIO6 to GPIO11 are connected to the on-module SPI flash and not led out.
23 IO15 bidirectional GPIO15, ADC2_CH3, TOUCH3, MTDO (strapping pin, default pull-up), HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3.
24 IO2 bidirectional GPIO2 (boot-mode strapping pin, default pull-down), ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0.
25 IO0 bidirectional GPIO0 (boot-mode strapping pin, default pull-up), ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK.
26 IO4 bidirectional GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER.
27 IO16 bidirectional GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT; on variants with embedded PSRAM it is connected to the PSRAM and cannot be used for other functions.
28 IO17 bidirectional GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180.
29 IO5 bidirectional GPIO5 (strapping pin, default pull-up), VSPICS0, HS1_DATA6, EMAC_RX_CLK.
30 IO18 bidirectional GPIO18, VSPICLK, HS1_DATA7.
31 IO19 bidirectional GPIO19, VSPIQ, U0CTS, EMAC_TXD0.
32 NC unconnected No connection.
33 IO21 bidirectional GPIO21, VSPIHD, EMAC_TX_EN.
34 RXD0 bidirectional GPIO3, U0RXD, CLK_OUT2.
35 TXD0 bidirectional GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2.
36 IO22 bidirectional GPIO22, VSPIWP, U0RTS, EMAC_TXD1.
37 IO23 bidirectional GPIO23, VSPID, HS1_STROBE.
38 GND power_in Ground.
39 GND power_in Exposed ground pad (P_GND); soldering to base-board ground is optional but optimizes thermal performance.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 38-SMD Module
Category RF and Wireless
Pins 39

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 3 3.3 3.6 V 28
Current delivered by external power supply IVDD 0.5 A 28
Operating ambient temperature T -40 85 °C 85 °C version 28
Power supply voltage VDD33 -0.3 3.6 V 28
Storage temperature TSTORE -40 105 °C 28
Low-level input voltage VIL -0.3 V 28
High-level input current IIH 50 nA 28
Low-level input current IIL 50 nA 28
Low-level input voltage of CHIP_PU to shut down the chip VIL_nRST 0.6 V 29
Differential nonlinearity (DNL) -7 7 LSB RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off 25
Integral nonlinearity (INL) -12 12 LSB RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off 25
ADC total error -23 23 mV Atten = 0, effective measurement range of 100 ∼ 950 mV 26
ADC total error -30 30 mV Atten = 1, effective measurement range of 100 ∼ 1250 mV 26
ADC total error -40 40 mV Atten = 2, effective measurement range of 150 ∼ 1750 mV 26
ADC total error -60 60 mV Atten = 3, effective measurement range of 150 ∼ 2450 mV 26
Flash power supply voltage (1.8 V) VCC 1.65 1.8 2 V 30
Flash power supply voltage (3.3 V) VCC 2.7 3.3 3.6 V 30
Flash maximum clock frequency FC 80 MHz 30
Flash program/erase cycles 100000 cycles 30
Flash data retention time TRET 20 years 30
Flash page program time TPP 0.8 5 ms 30
Flash sector erase time (4 KB) TSE 70 500 ms 30
Flash block erase time (32 KB) TBE1 0.2 2 s 30
Flash block erase time (64 KB) TBE2 0.3 3 s 30
Flash chip erase time (64 Mb) TCE 25 100 s 30
PSRAM power supply voltage (1.8 V) VCC 1.62 1.8 1.98 V 30
PSRAM power supply voltage (3.3 V) VCC 2.7 3.3 3.6 V 30
PSRAM maximum clock frequency FC 80 MHz 30
Bluetooth BR receiver sensitivity -90 -89 -88 dBm @0.1% BER 33
Bluetooth BR out-of-band blocking -10 dBm 30 MHz ~ 2000 MHz 33
Bluetooth BR out-of-band blocking -27 dBm 2000 MHz ~ 2400 MHz 33
Bluetooth BR intermodulation -36 dBm 33
Bluetooth BR ∆f1avg ∆f1avg 155 kHz 34
Bluetooth BR ∆f2max ∆f2max 127 kHz 34
Bluetooth EDR π/4 DQPSK receiver sensitivity -90 -89 -88 dBm @0.01% BER 34
Bluetooth EDR 8DPSK receiver sensitivity -84 -83 -82 dBm @0.01% BER 34
Bluetooth EDR in-band spurious emissions -53 dBm F = F0 +/- > 3 MHz 35
Bluetooth LE receiver sensitivity -94 -93 -92 dBm @30.8% PER 35
Bluetooth LE out-of-band blocking -10 dBm 30 MHz ~ 2000 MHz 36
Bluetooth LE out-of-band blocking -27 dBm 2000 MHz ~ 2400 MHz 36
Bluetooth LE intermodulation -36 dBm 36
Bluetooth LE ∆f1avg ∆f1avg 265 kHz 36
Bluetooth LE ∆f2max ∆f2max 210 kHz 36

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Solder, Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 15: Reflow Profile 46

CAD (KiCad official)

  • Symbol: ESP32-WROOM-32UE-N8R2
  • Footprint: PCM_Espressif:ESP32-WROOM-32UE
  • 3D model: 38-SMD Module (KiCad packages3D, STEP)
  • 3D model files: esp32-wroom-32ue-n8r2-etched.step / esp32-wroom-32ue-n8r2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-wroom-32ue-n8r2.step / esp32-wroom-32ue-n8r2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (52 pp, sha256 4c7a345d1c1bfec3, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF