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ESP32-WROOM-32UE-N8

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Espressif Systems WiFi Modules, ESP32-WROOM-32UE. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-WROOM-32UE-N8

Espressif Systems · WiFi Modules · ESP32-WROOM-32UE

ESP32-WROOM-32UE-N8 from Espressif Systems, in a ESP32-WROOM-32UE. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference pin for the module.
2 3V3 power_in Module 3.3 V power supply input; Table 14 gives a recommended VDD33 range of 3.0-3.6 V with 3.3 V typical.
3 EN input Chip enable: high enables the chip, low shuts it down; the pin must not be left floating.
4 SENSOR_VP input Input-only pin GPIO36, also ADC1_CH0 and RTC_GPIO0.
5 SENSOR_VN input Input-only pin GPIO39, also ADC1_CH3 and RTC_GPIO3.
6 IO34 input Input-only pin GPIO34, also ADC1_CH6 and RTC_GPIO4.
7 IO35 input Input-only pin GPIO35, also ADC1_CH7 and RTC_GPIO5.
8 IO32 bidirectional GPIO32, also XTAL_32K_P (32.768 kHz crystal input), ADC1_CH4, TOUCH9 and RTC_GPIO9.
9 IO33 bidirectional GPIO33, also XTAL_32K_N (32.768 kHz crystal output), ADC1_CH5, TOUCH8 and RTC_GPIO8.
10 IO25 bidirectional GPIO25, also DAC_1, ADC2_CH8, RTC_GPIO6 and EMAC_RXD0.
11 IO26 bidirectional GPIO26, also DAC_2, ADC2_CH9, RTC_GPIO7 and EMAC_RXD1.
12 IO27 bidirectional GPIO27, also ADC2_CH7, TOUCH7, RTC_GPIO17 and EMAC_RX_DV.
13 IO14 bidirectional GPIO14, also ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK and EMAC_TXD2.
14 IO12 bidirectional GPIO12, also ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2 and EMAC_TXD3; the module schematic notes it should be kept low at power-on.
15 GND power_in Ground pin.
16 IO13 bidirectional GPIO13, also ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3 and EMAC_RX_ER.
17 NC unconnected No connection on this module; note 2 states GPIO6-GPIO11 are tied to the in-package SPI flash and not led out.
18 NC unconnected No connection on this module; note 2 states GPIO6-GPIO11 are tied to the in-package SPI flash and not led out.
19 NC unconnected No connection on this module; note 2 states GPIO6-GPIO11 are tied to the in-package SPI flash and not led out.
20 NC unconnected No connection on this module; note 2 states GPIO6-GPIO11 are tied to the in-package SPI flash and not led out.
21 NC unconnected No connection on this module; note 2 states GPIO6-GPIO11 are tied to the in-package SPI flash and not led out.
22 NC unconnected No connection on this module; note 2 states GPIO6-GPIO11 are tied to the in-package SPI flash and not led out.
23 IO15 bidirectional GPIO15, also ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD and EMAC_RXD3; MTDO is a boot strapping pin.
24 IO2 bidirectional GPIO2, also ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0 and SD_DATA0; it is a chip boot mode strapping pin with default pull-down.
25 IO0 bidirectional GPIO0, also ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1 and EMAC_TX_CLK; it is a chip boot mode strapping pin with default pull-up.
26 IO4 bidirectional GPIO4, also ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1 and EMAC_TX_ER.
27 IO16 bidirectional GPIO16, also HS1_DATA4, U2RXD and EMAC_CLK_OUT; in variants that embed PSRAM it is connected to the PSRAM and cannot be used for other functions.
28 IO17 bidirectional GPIO17, also HS1_DATA5, U2TXD and EMAC_CLK_OUT_180.
29 IO5 bidirectional GPIO5, also VSPICS0, HS1_DATA6 and EMAC_RX_CLK; it is a strapping pin with default pull-up.
30 IO18 bidirectional GPIO18, also VSPICLK and HS1_DATA7.
31 IO19 bidirectional GPIO19, also VSPIQ, U0CTS and EMAC_TXD0.
32 NC unconnected No connection on this pin.
33 IO21 bidirectional GPIO21, also VSPIHD and EMAC_TX_EN.
34 RXD0 bidirectional GPIO3, also U0RXD (UART0 receive, used for firmware download and log output) and CLK_OUT2.
35 TXD0 bidirectional GPIO1, also U0TXD (UART0 transmit, used for firmware download and log output), CLK_OUT3 and EMAC_RXD2.
36 IO22 bidirectional GPIO22, also VSPIWP, U0RTS and EMAC_TXD1.
37 IO23 bidirectional GPIO23, also VSPID and HS1_STROBE.
38 GND power_in Ground pin.
39 GND power_in Exposed ground pad (EPAD, labelled P_GND); soldering it to base-board ground is optional and improves thermal performance.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package ESP32-WROOM-32UE
Category IoT/Communication Modules
Pins 39

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 28
Storage temperature TSTORE -40 105 °C 28
Power supply voltage VDD33 3 3.3 3.6 V 28
Operating ambient temperature (85 °C version) T -40 85 °C 85 °C version 28
Current delivered by external power supply IVDD 0.5 A 28
Low-level input voltage VIL -0.3 0.25 V min -0.3; max 0.25×VDD1 28
High-level input current IIH 50 nA 28
Low-level input current IIL 50 nA 28
High-level output voltage VOH 0.8 V min 0.8×VDD1 28
Low-level output voltage VOL 0.1 V max 0.1×VDD1 28
Low-level input voltage of CHIP_PU to shut down the chip VIL_nRST 0.6 V 28
Chip erase time (64 Mb) TCE 25 100 s 30
Block erase time (32 KB) TBE1 0.2 2 s 30
Block erase time (64 KB) TBE2 0.3 3 s 30
Page program time TPP 0.8 5 ms 30
Sector erase time (4 KB) TSE 70 500 ms 30
Power supply voltage (3.3 V) VCC 2.7 3.3 3.6 V Flash, 3.3 V 30
Maximum clock frequency FC 80 MHz 30
Program/erase cycles 100000 cycles 30
Data retention time TRET 20 years 30
Differential nonlinearity (DNL) -7 7 LSB RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off 25
Integral nonlinearity (INL) -12 12 LSB RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off 25
Total error, effective measurement range 100 to 950 mV -23 23 mV Atten = 0 after eFuse Vref calibration 26
Total error, effective measurement range 100 to 1250 mV -30 30 mV Atten = 1 after eFuse Vref calibration 26
Total error, effective measurement range 150 to 1750 mV -40 40 mV Atten = 2 after eFuse Vref calibration 26
Total error, effective measurement range 150 to 2450 mV -60 60 mV Atten = 3 after eFuse Vref calibration 26
TX current, 802.11b, 20 MHz, 1 Mbps, @19.5 dBm 239 379 mA 3.3 V supply, 25 °C; typ = average, max = peak 29
TX current, 802.11g, 20 MHz, 54 Mbps, @15 dBm 190 276 mA 3.3 V supply, 25 °C; typ = average, max = peak 29
TX current, 802.11n, 20 MHz, MCS7, @13 dBm 183 258 mA 3.3 V supply, 25 °C; typ = average, max = peak 29
TX current, 802.11n, 40 MHz, MCS7, @13 dBm 165 211 mA 3.3 V supply, 25 °C; typ = average, max = peak 29
RX current, 802.11b/g/n, 20 MHz 112 112 mA 3.3 V supply, 25 °C; peripherals disabled, CPU idle 29
RX current, 802.11n, 40 MHz 118 118 mA 3.3 V supply, 25 °C; peripherals disabled, CPU idle 29
Crystal frequency tolerance -10 10 ppm Reference design schematic, U1 40 MHz crystal 37
Pin capacitance CIN 2 pF 28
High-level source current, VDD3P3_CPU power domain IOH 40 mA VDD1 = 3.3 V, VOH >= 2.64 V, output drive strength at maximum 29
High-level source current, VDD3P3_RTC power domain IOH 40 mA VDD1 = 3.3 V, VOH >= 2.64 V, output drive strength at maximum 29
High-level source current, VDD_SDIO power domain IOH 20 mA VDD1 = 3.3 V, VOH >= 2.64 V, output drive strength at maximum 29
Low-level sink current IOL 28 mA VDD1 = 3.3 V, VOL = 0.495 V, output drive strength at maximum 29
Resistance of internal pull-up resistor RPU 45 kΩ 29
Resistance of internal pull-down resistor RPD 45 kΩ 29
Crystal frequency 40 MHz Reference design schematic, U1 40 MHz crystal 37

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Solder, Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 15: Reflow Profile 46

CAD (KiCad official)

  • Symbol: ESP32-WROOM-32UE-N8
  • Footprint: PCM_Espressif:ESP32-WROOM-32UE
  • 3D model: ESP32-WROOM-32UE (KiCad packages3D, STEP)
  • 3D model files: esp32-wroom-32ue-n8-etched.step / esp32-wroom-32ue-n8-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-wroom-32ue-n8.step / esp32-wroom-32ue-n8.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (52 pp, sha256 4c7a345d1c1bfec3, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF