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ESP32-WROOM-32UE-H4

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Espressif Systems WiFi Modules, ESP32-WROOM-32UE. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-WROOM-32UE-H4

Espressif Systems · WiFi Modules · ESP32-WROOM-32UE

ESP32-WROOM-32UE-H4 from Espressif Systems, in a ESP32-WROOM-32UE. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin of the module.
2 3V3 power_in Module supply pin; the datasheet gives 3.0 to 3.6 V with 3.3 V typical and an absolute maximum of 3.6 V.
3 EN input Chip enable: high enables the chip and low shuts it down; EN must not be left floating.
4 SENSOR_VP input GPIO36, ADC1_CH0 and RTC_GPIO0 function pin.
5 SENSOR_VN input GPIO39, ADC1_CH3 and RTC_GPIO3 function pin.
6 IO34 input GPIO34, ADC1_CH6 and RTC_GPIO4 function pin.
7 IO35 input GPIO35, ADC1_CH7 and RTC_GPIO5 function pin.
8 IO32 bidirectional GPIO32 with 32.768 kHz crystal input (XTAL_32K_P), ADC1_CH4, TOUCH9 and RTC_GPIO9 functions.
9 IO33 bidirectional GPIO33 with 32.768 kHz crystal output (XTAL_32K_N), ADC1_CH5, TOUCH8 and RTC_GPIO8 functions.
10 IO25 bidirectional GPIO25 with DAC_1, ADC2_CH8, RTC_GPIO6 and EMAC_RXD0 functions.
11 IO26 bidirectional GPIO26 with DAC_2, ADC2_CH9, RTC_GPIO7 and EMAC_RXD1 functions.
12 IO27 bidirectional GPIO27 with ADC2_CH7, TOUCH7, RTC_GPIO17 and EMAC_RX_DV functions.
13 IO14 bidirectional GPIO14 with ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK and EMAC_TXD2 functions.
14 IO12 bidirectional GPIO12 with ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2 and EMAC_TXD3 functions; the datasheet says it should be kept low at power-on.
15 GND power_in Ground pin of the module.
16 IO13 bidirectional GPIO13 with ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3 and EMAC_RX_ER functions.
17 NC unconnected Not connected; this pin is not brought out, and the related chip GPIO6 to GPIO11 are used for the integrated SPI flash.
18 NC unconnected Not connected; this pin is not brought out, and the related chip GPIO6 to GPIO11 are used for the integrated SPI flash.
19 NC unconnected Not connected; this pin is not brought out, and the related chip GPIO6 to GPIO11 are used for the integrated SPI flash.
20 NC unconnected Not connected; this pin is not brought out, and the related chip GPIO6 to GPIO11 are used for the integrated SPI flash.
21 NC unconnected Not connected; this pin is not brought out, and the related chip GPIO6 to GPIO11 are used for the integrated SPI flash.
22 NC unconnected Not connected; this pin is not brought out, and the related chip GPIO6 to GPIO11 are used for the integrated SPI flash.
23 IO15 bidirectional GPIO15 with ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD and EMAC_RXD3 functions; it is a strapping pin.
24 IO2 bidirectional GPIO2 with ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0 and SD_DATA0 functions; it is a strapping pin.
25 IO0 bidirectional GPIO0 with ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1 and EMAC_TX_CLK functions; it is a strapping pin.
26 IO4 bidirectional GPIO4 with ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1 and EMAC_TX_ER functions.
27 IO16 bidirectional GPIO16 with HS1_DATA4, U2RXD and EMAC_CLK_OUT functions; on modules with embedded QSPI PSRAM it is used for the PSRAM and cannot be used for other functions.
28 IO17 bidirectional GPIO17 with HS1_DATA5, U2TXD and EMAC_CLK_OUT_180 functions.
29 IO5 bidirectional GPIO5 with VSPICS0, HS1_DATA6 and EMAC_RX_CLK functions; it is a strapping pin.
30 IO18 bidirectional GPIO18 with VSPICLK and HS1_DATA7 functions.
31 IO19 bidirectional GPIO19 with VSPIQ, U0CTS and EMAC_TXD0 functions.
32 NC unconnected Listed as NC in the pin definition table with no function given.
33 IO21 bidirectional GPIO21 with VSPIHD and EMAC_TX_EN functions.
34 RXD0 bidirectional GPIO3 used as the U0RXD receive function, also with CLK_OUT2.
35 TXD0 bidirectional GPIO1 used as the U0TXD transmit function, also with CLK_OUT3 and EMAC_RXD2.
36 IO22 bidirectional GPIO22 with VSPIWP, U0RTS and EMAC_TXD1 functions.
37 IO23 bidirectional GPIO23 with VSPID and HS1_STROBE functions.
38 GND power_in Ground pin of the module.
39 GND power_in Exposed ground pad (EPAD); it may be left unsoldered to the host board, and if soldered, excess solder paste should be avoided.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package ESP32-WROOM-32UE
Category IoT/Communication Modules
Pins 39

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (absolute maximum rating) VDD33 -0.3 3.6 V 26
Storage temperature TSTORE -40 105 °C 26
Power supply pin voltage (recommended) VDD33 3 3.3 3.6 V 26
External power supply current IVDD 0.5 A 26
Operating ambient temperature, 85 °C version T -40 85 °C 85 °C version 26
Operating ambient temperature, 105 °C version T 105 °C 105 °C version 26
Low-level input voltage VIL -0.3 V 26
High-level input current IIH 50 nA 26
Low-level input current IIL 50 nA 26
Low-level input voltage for CHIP_PU shutdown of chip VIL_nRST 0.6 V 27
High-level source current, VDD3P3_CPU power domain IOH 40 mA VDD1 = 3.3 V, VOH >= 2.64 V, pin output strength set to maximum 27
High-level source current, VDD3P3_RTC power domain IOH 40 mA VDD1 = 3.3 V, VOH >= 2.64 V, pin output strength set to maximum 27
High-level source current, VDD_SDIO power domain IOH 20 mA VDD1 = 3.3 V, VOH >= 2.64 V, pin output strength set to maximum 27
Low-level sink current IOL 28 mA VDD1 = 3.3 V, VOL = 0.495 V, pin output strength set to maximum 27
Pull-up resistor RPU 45 kΩ 27
Pull-down resistor RPD 45 kΩ 27
Pin capacitance CIN 2 pF 26

CAD (KiCad official)

  • Symbol: ESP32-WROOM-32UE-H4
  • Footprint: PCM_Espressif:ESP32-WROOM-32UE
  • 3D model: ESP32-WROOM-32UE (KiCad packages3D, STEP)
  • 3D model files: esp32-wroom-32ue-h4-etched.step / esp32-wroom-32ue-h4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-wroom-32ue-h4.step / esp32-wroom-32ue-h4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (48 pp, sha256 0ac83c833dabfd12, retrieved 2026-10-28, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF