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ESP32-WROOM-32E-N8R2

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Espressif Systems WiFi Modules, LCC-38(18x25.5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentiot-communication modulesesp32-wroom-32e-n8r2factory-2.0.0extractor-text
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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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ESP32-WROOM-32E-N8R2

Espressif Systems · WiFi Modules · LCC-38(18x25.5)

ESP32-WROOM-32E-N8R2 from Espressif Systems, in a LCC-38(18x25.5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground connection for the module.
2 3V3 power_in Power supply input; VDD33 is recommended at 3.0 V to 3.6 V (3.3 V typ.) with an external supply capable of at least 0.5 A.
3 EN input Chip enable: high enables the chip and low shuts it down, and the pin must not be left floating.
4 SENSOR_VP input Input-only pin for GPIO36, also usable as ADC1_CH0 and RTC_GPIO0.
5 SENSOR_VN input Input-only pin for GPIO39, also usable as ADC1_CH3 and RTC_GPIO3.
6 IO34 input Input-only pin for GPIO34, also usable as ADC1_CH6 and RTC_GPIO4.
7 IO35 input Input-only pin for GPIO35, also usable as ADC1_CH7 and RTC_GPIO5.
8 IO32 bidirectional GPIO32 that can also serve as the 32.768 kHz crystal oscillator input (XTAL_32K_P), ADC1_CH4, TOUCH9 and RTC_GPIO9.
9 IO33 bidirectional GPIO33 that can also serve as the 32.768 kHz crystal oscillator output (XTAL_32K_N), ADC1_CH5, TOUCH8 and RTC_GPIO8.
10 IO25 bidirectional GPIO25 that can also serve as DAC_1, ADC2_CH8, RTC_GPIO6 and EMAC_RXD0.
11 IO26 bidirectional GPIO26 that can also serve as DAC_2, ADC2_CH9, RTC_GPIO7 and EMAC_RXD1.
12 IO27 bidirectional GPIO27 that can also serve as ADC2_CH7, TOUCH7, RTC_GPIO17 and EMAC_RX_DV.
13 IO14 bidirectional GPIO14 that can also serve as ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK and EMAC_TXD2.
14 IO12 bidirectional GPIO12 (MTDI strapping function, also ADC2_CH5, TOUCH5, RTC_GPIO15, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3); the schematic notes it should be kept low at power-on.
15 GND power_in Ground connection for the module.
16 IO13 bidirectional GPIO13 that can also serve as ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3 and EMAC_RX_ER.
17 NC unconnected Not connected; Table 3 gives no function and refers to note 2 (GPIO6 to GPIO11 are tied to the in-package flash and not led out).
18 NC unconnected Not connected; Table 3 gives no function and refers to note 2 (GPIO6 to GPIO11 are tied to the in-package flash and not led out).
19 NC unconnected Not connected; Table 3 gives no function and refers to note 2 (GPIO6 to GPIO11 are tied to the in-package flash and not led out).
20 NC unconnected Not connected; Table 3 gives no function and refers to note 2 (GPIO6 to GPIO11 are tied to the in-package flash and not led out).
21 NC unconnected Not connected; Table 3 gives no function and refers to note 2 (GPIO6 to GPIO11 are tied to the in-package flash and not led out).
22 NC unconnected Not connected; Table 3 gives no function and refers to note 2 (GPIO6 to GPIO11 are tied to the in-package flash and not led out).
23 IO15 bidirectional GPIO15 that can also serve as ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD and EMAC_RXD3; it is a boot strapping pin (MTDO, U0TXD printing control).
24 IO2 bidirectional GPIO2 that is a boot-mode strapping pin (default pull-down) and can also serve as ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0 and SD_DATA0.
25 IO0 bidirectional GPIO0 that is a boot-mode strapping pin (default pull-up) and can also serve as ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1 and EMAC_TX_CLK.
26 IO4 bidirectional GPIO4 that can also serve as ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1 and EMAC_TX_ER.
27 IO16 bidirectional GPIO16 (HS1_DATA4, U2RXD, EMAC_CLK_OUT); in module variants embedding the ESP32-D0WDR2-V3 it is tied to the embedded PSRAM and cannot be used for other functions.
28 IO17 bidirectional GPIO17 that can also serve as HS1_DATA5, U2TXD and EMAC_CLK_OUT_180.
29 IO5 bidirectional GPIO5 that is a boot strapping pin (SDIO slave timing, default pull-up) and can also serve as VSPICS0, HS1_DATA6 and EMAC_RX_CLK.
30 IO18 bidirectional GPIO18 that can also serve as VSPICLK and HS1_DATA7.
31 IO19 bidirectional GPIO19 that can also serve as VSPIQ, U0CTS and EMAC_TXD0.
32 NC unconnected No function is listed for this pin in Table 3.
33 IO21 bidirectional GPIO21 that can also serve as VSPIHD and EMAC_TX_EN.
34 RXD0 bidirectional GPIO3 used as UART0 receive (U0RXD), which is used for firmware download and log output, and can also serve as CLK_OUT2.
35 TXD0 bidirectional GPIO1 used as UART0 transmit (U0TXD), which is used for firmware download and log output, and can also serve as CLK_OUT3 and EMAC_RXD2.
36 IO22 bidirectional GPIO22 that can also serve as VSPIWP, U0RTS and EMAC_TXD1.
37 IO23 bidirectional GPIO23 that can also serve as VSPID and HS1_STROBE.
38 GND power_in Ground connection for the module.
39 GND power_in Ground thermal pad (labelled P_GND in the schematic); soldering it to the base-board ground is optional but improves thermal performance, and too much solder paste can degrade adhesion of the other pins.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package LCC-38(18x25.5)
Category IoT/Communication Modules
Pins 39

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 28
Storage temperature TSTORE -40 105 °C 28
Power supply voltage VDD33 3 3.3 3.6 V 28
Current delivered by external power supply IVDD 0.5 A 28
Operating ambient temperature T -40 85 °C 85 °C version 28
Low-level input voltage VIL -0.3 V VDD1 = 3.3 V, 25 °C 28
High-level input current IIH 50 nA 28
Low-level input current IIL 50 nA 28
Low-level input voltage of CHIP_PU to shut down the chip VIL_nRST 0.6 V 29
Flash power supply voltage (1.8 V) VCC 1.65 1.8 2 V 30
Flash power supply voltage (3.3 V) VCC 2.7 3.3 3.6 V 30
Flash maximum clock frequency FC 80 MHz 30
Flash program/erase cycles 100000 cycles 30
Flash data retention time TRET 20 years 30
Flash page program time TPP 0.8 5 ms 30
Flash sector erase time (4 KB) TSE 70 500 ms 30
Flash block erase time (32 KB) TBE1 0.2 2 s 30
Flash block erase time (64 KB) TBE2 0.3 3 s 30
Flash chip erase time (64 Mb) TCE 25 100 s 30
PSRAM power supply voltage (1.8 V) VCC 1.62 1.8 1.98 V 30
PSRAM power supply voltage (3.3 V) VCC 2.7 3.3 3.6 V 30
PSRAM maximum clock frequency FC 80 MHz 30
ADC differential nonlinearity DNL -7 7 LSB RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off 25
ADC integral nonlinearity INL -12 12 LSB RTC controller; ADC connected to an external 100 nF capacitor; DC signal input; ambient temperature at 25 °C; Wi-Fi&Bluetooth off 25
ADC total error -23 23 mV Atten = 0, effective measurement range of 100 ∼ 950 mV 26
ADC total error -30 30 mV Atten = 1, effective measurement range of 100 ∼ 1250 mV 26
ADC total error -40 40 mV Atten = 2, effective measurement range of 150 ∼ 1750 mV 26
ADC total error -60 60 mV Atten = 3, effective measurement range of 150 ∼ 2450 mV 26
Center frequency range of operating channel (Wi-Fi) 2412 2484 MHz 31
RF transmit power range (Bluetooth LE) -12 9 dBm 33
Center frequency range of operating channel (Bluetooth LE) 2402 2480 MHz 33
Receiver sensitivity, basic data rate -90 -89 -88 dBm @0.1% BER 33
Maximum received signal, basic data rate 0 dBm @0.1% BER 33
Receiver sensitivity, π/4 DQPSK (EDR) -90 -89 -88 dBm π/4 DQPSK @0.01% BER 34
Receiver sensitivity, 8DPSK (EDR) -84 -83 -82 dBm 8DPSK @0.01% BER 34
Maximum received signal, 8DPSK (EDR) -5 dBm 8DPSK @0.01% BER 34
Δf2max, basic data rate Δf2max 127 kHz 34
Δf1avg, basic data rate Δf1avg 155 kHz 34
Receiver sensitivity, Bluetooth LE -94 -93 -92 dBm @30.8% PER 35
Maximum received signal, Bluetooth LE 0 dBm @30.8% PER 35
Δf1avg, Bluetooth LE Δf1avg 265 kHz 36
Δf2max, Bluetooth LE Δf2max 210 kHz 36

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Solder, Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 15: Reflow Profile 46

CAD (KiCad official)

  • Symbol: ESP32-WROOM-32E-N8R2
  • Footprint: PCM_Espressif:ESP32-WROOM-32E
  • 3D model: LCC-38(18x25.5) (KiCad packages3D, STEP)
  • 3D model files: esp32-wroom-32e-n8r2-etched.step / esp32-wroom-32e-n8r2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-wroom-32e-n8r2.step / esp32-wroom-32e-n8r2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (52 pp, sha256 4c7a345d1c1bfec3, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF