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ESP32-S3-WROOM-1U-N8

Espressif Systems · WiFi Modules · ESP32-S3-WROOM-1U

ESP32-S3-WROOM-1U-N8 from Espressif Systems, in a ESP32-S3-WROOM-1U. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin of the module.
2 3V3 power_in Module power supply pin; Table 6-2 gives VDD33 as 3.0 V min, 3.3 V typical and 3.6 V max.
3 EN input Chip enable: high turns the chip on and low powers it off, and the pin must not be left floating.
4 IO4 bidirectional GPIO4 with RTC_GPIO4, TOUCH4 and ADC1_CH3 functions listed.
5 IO5 bidirectional GPIO5 with RTC_GPIO5, TOUCH5 and ADC1_CH4 functions listed.
6 IO6 bidirectional GPIO6 with RTC_GPIO6, TOUCH6 and ADC1_CH5 functions listed.
7 IO7 bidirectional GPIO7 with RTC_GPIO7, TOUCH7 and ADC1_CH6 functions listed.
8 IO15 bidirectional GPIO15 with RTC_GPIO15, U0RTS, ADC2_CH4 and XTAL_32K_P functions listed.
9 IO16 bidirectional GPIO16 with RTC_GPIO16, U0CTS, ADC2_CH5 and XTAL_32K_N functions listed.
10 IO17 bidirectional GPIO17 with RTC_GPIO17, U1TXD and ADC2_CH6 functions listed.
11 IO18 bidirectional GPIO18 with RTC_GPIO18, U1RXD, ADC2_CH7 and CLK_OUT3 functions listed.
12 IO8 bidirectional GPIO8 with RTC_GPIO8, TOUCH8, ADC1_CH7 and SUBSPICS1 functions listed.
13 IO19 bidirectional GPIO19 with RTC_GPIO19, U1RTS, ADC2_CH8, CLK_OUT2 and USB_D- functions listed.
14 IO20 bidirectional GPIO20 with RTC_GPIO20, U1CTS, ADC2_CH9, CLK_OUT1 and USB_D+ functions listed.
15 IO3 bidirectional GPIO3 with RTC_GPIO3, TOUCH3 and ADC1_CH2 functions listed.
16 IO46 bidirectional GPIO46 is listed with no alternate function in Table 3-1.
17 IO9 bidirectional GPIO9 with RTC_GPIO9, TOUCH9, ADC1_CH8, FSPIHD and SUBSPIHD functions listed.
18 IO10 bidirectional GPIO10 with RTC_GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4 and SUBSPICS0 functions listed.
19 IO11 bidirectional GPIO11 with RTC_GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5 and SUBSPID functions listed.
20 IO12 bidirectional GPIO12 with RTC_GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6 and SUBSPICLK functions listed.
21 IO13 bidirectional GPIO13 with RTC_GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7 and SUBSPIQ functions listed.
22 IO14 bidirectional GPIO14 with RTC_GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS and SUBSPIWP functions listed.
23 IO21 bidirectional GPIO21 with RTC_GPIO21 function listed.
24 IO47 bidirectional GPIO47 with SPICLK_P_DIFF and SUBSPICLK_P_DIFF functions listed; its working voltage is 1.8 V only on modules with ESP32-S3R16V.
25 IO48 bidirectional GPIO48 with SPICLK_N_DIFF and SUBSPICLK_N_DIFF functions listed; its working voltage is 1.8 V only on modules with ESP32-S3R16V.
26 IO45 bidirectional GPIO45 function listed with no alternate function in Table 3-1.
27 IO0 bidirectional RTC_GPIO0 and GPIO0 functions listed.
28 IO35 bidirectional SPIIO6, GPIO35, FSPID and SUBSPID functions listed; the default function is set by eFuse, and the pin is unavailable on modules with Octal SPI PSRAM.
29 IO36 bidirectional SPIIO7, GPIO36, FSPICLK and SUBSPICLK functions listed; the default function is set by eFuse, and the pin is unavailable on modules with Octal SPI PSRAM.
30 IO37 bidirectional SPIDQS, GPIO37, FSPIQ and SUBSPIQ functions listed; the default function is set by eFuse, and the pin is unavailable on modules with Octal SPI PSRAM.
31 IO38 bidirectional GPIO38, FSPIWP and SUBSPIWP functions listed.
32 IO39 bidirectional MTCK, GPIO39, CLK_OUT3 and SUBSPICS1 functions listed.
33 IO40 bidirectional MTDO, GPIO40 and CLK_OUT2 functions listed.
34 IO41 bidirectional MTDI, GPIO41 and CLK_OUT1 functions listed.
35 IO42 bidirectional MTMS and GPIO42 functions listed.
36 RXD0 bidirectional U0RXD, GPIO44 and CLK_OUT2 functions listed.
37 TXD0 bidirectional U0TXD, GPIO43 and CLK_OUT1 functions listed.
38 IO2 bidirectional RTC_GPIO2, GPIO2, TOUCH2 and ADC1_CH1 functions listed.
39 IO1 bidirectional RTC_GPIO1, GPIO1, TOUCH1 and ADC1_CH0 functions listed.
40 GND power_in Ground pin of the module.
41 EPAD power_in Ground thermal pad; soldering it to the base-board ground is optional but improves thermal performance, and excess solder paste can raise the module gap.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package ESP32-S3-WROOM-1U
Category IoT/Communication Modules
Pins 41

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 27
Storage temperature TSTORE -40 105 °C 27
Power supply voltage VDD33 3 3.3 3.6 V 27
Current delivered by external power supply IVDD 0.5 A 27
Operating ambient temperature TA -40 85 °C 85 °C version 27
High-level input current IIH 50 nA 27
Low-level input current IIL 50 nA 27
Current for Wi-Fi TX, 802.11b, 1 Mbps (Peak column) 355 mA Active (RF working), TX, 802.11b, 1 Mbps, @20.5 dBm 28
Current for Wi-Fi TX, 802.11g, 54 Mbps (Peak column) 297 mA Active (RF working), TX, 802.11g, 54 Mbps, @18 dBm 28
Current for Wi-Fi TX, 802.11n HT20 MCS 7 (Peak column) 286 mA Active (RF working), TX, 802.11n, HT20, MCS 7, @17.5 dBm 28
Current for Wi-Fi TX, 802.11n HT40 MCS 7 (Peak column) 285 mA Active (RF working), TX, 802.11n, HT40, MCS 7, @17 dBm 28
Current for Wi-Fi RX (Peak column) 95 mA Active (RF working), RX, 802.11b/g/n, HT20 28
Current for Wi-Fi RX (Peak column) 97 mA Active (RF working), RX, 802.11n, HT40 28
Current for Bluetooth LE TX (Peak column) 344 mA Active (RF working), TX, Bluetooth LE @ 20.0 dBm 28
Current for Bluetooth LE TX (Peak column) 202 mA Active (RF working), TX, Bluetooth LE @ 9.0 dBm 28
Current for Bluetooth LE TX (Peak column) 187 mA Active (RF working), TX, Bluetooth LE @ 0 dBm 28
Current for Bluetooth LE TX (Peak column) 119 mA Active (RF working), TX, Bluetooth LE @ -15.0 dBm 28
Current for Bluetooth LE RX (Peak column) 93 mA Active (RF working), RX, Bluetooth LE 28
Sensitivity -96.5 dBm Bluetooth LE 1 Mbps, @30.8% PER 36
Maximum received signal 8 dBm Bluetooth LE 1 Mbps, @30.8% PER 36
Sensitivity -92 dBm Bluetooth LE 2 Mbps, @30.8% PER 36
Maximum received signal 3 dBm Bluetooth LE 2 Mbps, @30.8% PER 37
Sensitivity -103.5 dBm Bluetooth LE 125 Kbps, @30.8% PER 37
Maximum received signal 8 dBm Bluetooth LE 125 Kbps, @30.8% PER 37
Sensitivity -100 dBm Bluetooth LE 500 Kbps, @30.8% PER 37
Center frequency range of operating channel (Wi-Fi) 2412 2484 MHz IEEE 802.11b/g/n 32
Center frequency range of operating channel (Bluetooth LE) 2402 2480 MHz 34
RF transmit power range (Bluetooth LE) -24 20 dBm 34
High-level source current IOH 40 mA VDD = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3 27
Low-level sink current IOL 28 mA VDD = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3 27
Internal weak pull-up resistor RPU 45 kΩ 27
Internal weak pull-down resistor RPD 45 kΩ 27
Pin capacitance CIN 2 pF 27
Current consumption in Modem-sleep, WAITI at 40 MHz (Typ1, all peripheral clocks disabled) 13.2 mA Modem-sleep, 40 MHz, WAITI (dual core idle) 29
Current consumption in Modem-sleep, WAITI at 40 MHz (Typ2, all peripheral clocks enabled) 18.8 mA Modem-sleep, 40 MHz, WAITI (dual core idle) 29
Current consumption in Modem-sleep, WAITI at 80 MHz (Typ1, all peripheral clocks disabled) 22 mA Modem-sleep, 80 MHz, WAITI 29
Current consumption in Modem-sleep, WAITI at 80 MHz (Typ2, all peripheral clocks enabled) 36.1 mA Modem-sleep, 80 MHz, WAITI 29
Current consumption in Modem-sleep, WAITI at 160 MHz (Typ1, all peripheral clocks disabled) 27.6 mA Modem-sleep, 160 MHz, WAITI 29
Current consumption in Modem-sleep, WAITI at 160 MHz (Typ2, all peripheral clocks enabled) 42.3 mA Modem-sleep, 160 MHz, WAITI 29
Current consumption in Modem-sleep, WAITI at 240 MHz (Typ1, all peripheral clocks disabled) 32.9 mA Modem-sleep, 240 MHz, WAITI 29
Current consumption in Modem-sleep, WAITI at 240 MHz (Typ2, all peripheral clocks enabled) 47.6 mA Modem-sleep, 240 MHz, WAITI 29
TX power 802.11b, 1 Mbps 20.5 dBm 802.11b, 1 Mbps 32
TX power 802.11g, 54 Mbps 18 dBm 802.11g, 54 Mbps 32
TX power 802.11n HT20 MCS 7 17.5 dBm 802.11n, HT20, MCS 7 32
TX power 802.11n HT40 MCS 7 17 dBm 802.11n, HT40, MCS 7 32
RX sensitivity 802.11b, 1 Mbps -98.2 dBm 802.11b, 1 Mbps 33
RX sensitivity 802.11n HT40 MCS 7 -71.2 dBm 802.11n, HT40, MCS 7 34
Modulation characteristics ∆ f1avg (Bluetooth LE 1 Mbps) 249 kHz Bluetooth LE 1 Mbps 35
Modulation characteristics ∆ f1avg (Bluetooth LE 2 Mbps) 499 kHz Bluetooth LE 2 Mbps 35

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Solder: Sn-Ag-Cu (SAC305) lead-free solder Temperature (°C) 47

CAD (KiCad official)

  • Symbol: ESP32-S3-WROOM-1U-N8
  • Footprint: PCM_Espressif:ESP32-S3-WROOM-1U
  • 3D model: ESP32-S3-WROOM-1U (KiCad packages3D, STEP)
  • 3D model files: esp32-s3-wroom-1u-n8-etched.step / esp32-s3-wroom-1u-n8-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-s3-wroom-1u-n8.step / esp32-s3-wroom-1u-n8.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (53 pp, sha256 27d71971da07c280, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF