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ESP32-S3-WROOM-1-N8

Espressif Systems · WiFi Modules · ESP32-S3-WROOM-1

ESP32-S3-WROOM-1-N8 from Espressif Systems, in a ESP32-S3-WROOM-1. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	GND	power_in	Ground reference pin of the module.
2	3V3	power_in	Module power supply pin; Table 6-2 gives VDD33 as 3.0 V min, 3.3 V typ, 3.6 V max.
3	EN	input	High enables the chip and low powers it off; do not leave EN floating.
4	IO4	bidirectional	I/O with functions RTC_GPIO4, GPIO4, TOUCH4 and ADC1_CH3.
5	IO5	bidirectional	I/O with functions RTC_GPIO5, GPIO5, TOUCH5 and ADC1_CH4.
6	IO6	bidirectional	I/O with functions RTC_GPIO6, GPIO6, TOUCH6 and ADC1_CH5.
7	IO7	bidirectional	I/O with functions RTC_GPIO7, GPIO7, TOUCH7 and ADC1_CH6.
8	IO15	bidirectional	I/O with functions RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4 and XTAL_32K_P.
9	IO16	bidirectional	I/O with functions RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5 and XTAL_32K_N.
10	IO17	bidirectional	I/O with functions RTC_GPIO17, GPIO17, U1TXD and ADC2_CH6.
11	IO18	bidirectional	I/O with functions RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7 and CLK_OUT3.
12	IO8	bidirectional	I/O with functions RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7 and SUBSPICS1.
13	IO19	bidirectional	I/O with functions RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2 and USB_D-.
14	IO20	bidirectional	I/O with functions RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1 and USB_D+.
15	IO3	bidirectional	I/O with functions RTC_GPIO3, GPIO3, TOUCH3 and ADC1_CH2; GPIO3 is a JTAG strapping pin (floating at reset).
16	IO46	bidirectional	GPIO46 I/O; it is a chip boot mode and ROM message strapping pin with a weak pull-down.
17	IO9	bidirectional	I/O with functions RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD and SUBSPIHD.
18	IO10	bidirectional	I/O with functions RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4 and SUBSPICS0.
19	IO11	bidirectional	I/O with functions RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5 and SUBSPID.
20	IO12	bidirectional	I/O with functions RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6 and SUBSPICLK.
21	IO13	bidirectional	I/O with functions RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7 and SUBSPIQ.
22	IO14	bidirectional	I/O with functions RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS and SUBSPIWP.
23	IO21	bidirectional	I/O with functions RTC_GPIO21 and GPIO21.
24	IO47	bidirectional	I/O with functions SPICLK_P_DIFF, GPIO47 and SUBSPICLK_P_DIFF; on modules with ESP32-S3R16V its working voltage is 1.8 V.
25	IO48	bidirectional	I/O with functions SPICLK_N_DIFF, GPIO48 and SUBSPICLK_N_DIFF; on modules with ESP32-S3R16V its working voltage is 1.8 V.
26	IO45	bidirectional	GPIO45 I/O; it is a VDD_SPI voltage strapping pin with a weak pull-down.
27	IO0	bidirectional	I/O with functions RTC_GPIO0 and GPIO0; it is a chip boot mode strapping pin with a weak pull-up.
28	IO35	bidirectional	I/O with functions SPIIO6, GPIO35, FSPID and SUBSPID; default function is set by eFuse, and on R8/R16V modules it is tied to Octal PSRAM.
29	IO36	bidirectional	I/O with functions SPIIO7, GPIO36, FSPICLK and SUBSPICLK; default function is set by eFuse, and on R8/R16V modules it is tied to Octal PSRAM.
30	IO37	bidirectional	I/O with functions SPIDQS, GPIO37, FSPIQ and SUBSPIQ; default function is set by eFuse, and on R8/R16V modules it is tied to Octal PSRAM.
31	IO38	bidirectional	I/O with functions GPIO38, FSPIWP and SUBSPIWP.
32	IO39	bidirectional	I/O with functions MTCK, GPIO39, CLK_OUT3 and SUBSPICS1.
33	IO40	bidirectional	I/O with functions MTDO, GPIO40 and CLK_OUT2.
34	IO41	bidirectional	I/O with functions MTDI, GPIO41 and CLK_OUT1.
35	IO42	bidirectional	I/O with functions MTMS and GPIO42.
36	RXD0	bidirectional	UART0 receive (U0RXD) with alternate functions GPIO44 and CLK_OUT2.
37	TXD0	bidirectional	UART0 transmit (U0TXD) with alternate functions GPIO43 and CLK_OUT1.
38	IO2	bidirectional	I/O with functions RTC_GPIO2, GPIO2, TOUCH2 and ADC1_CH1.
39	IO1	bidirectional	I/O with functions RTC_GPIO1, GPIO1, TOUCH1 and ADC1_CH0.
40	GND	power_in	Ground reference pin of the module.
41	EPAD	power_in	Exposed thermal pad tied to GND; soldering it to the base board ground is optional and improves thermal performance, but excess paste can lift the module.

Key specifications

Parameter	Value
Manufacturer	Espressif Systems
Package	ESP32-S3-WROOM-1
Category	IoT/Communication Modules
Pins	41

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Power supply voltage	VDD33	-0.3		3.6	V		27
Storage temperature	TSTORE	-40		105	°C		27
Power supply voltage	VDD33	3	3.3	3.6	V		27
Current delivered by external power supply	IVDD	0.5			A	Current delivered by external power supply	27
Operating ambient temperature	TA	-40		85	°C	85 °C version	27
High-level input current	IIH			50	nA		27
Low-level input current	IIL			50	nA		27
Maximum received signal @30.8% PER (Bluetooth LE 1 Mbps)				8	dBm	Bluetooth LE 1 Mbps, @30.8% PER	36
Sensitivity @30.8% PER (Bluetooth LE 1 Mbps)				-96.5	dBm	Bluetooth LE 1 Mbps, @30.8% PER	36
Pin capacitance	CIN		2		pF		27
High-level source current	IOH		40		mA	VDD = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3	27
Low-level sink current	IOL		28		mA	VDD = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3	27
Internal weak pull-up resistor	RPU		45		kΩ		27
Internal weak pull-down resistor	RPD		45		kΩ		27
TX power 802.11b 1 Mbps			20.5		dBm	802.11b, 1 Mbps	32
RX sensitivity 802.11b 1 Mbps			-98.2		dBm	802.11b, 1 Mbps	33
Peak current TX 802.11b 1 Mbps			355		mA	Wi-Fi TX 802.11b, 1 Mbps, @20.5 dBm	28
Peak current RX 802.11b/g/n HT20			95		mA	Wi-Fi RX 802.11b/g/n, HT20	28
Peak current Bluetooth LE RX			93		mA	Bluetooth LE RX	28
Modem-sleep current, WAITI dual core idle, 240 MHz			32.9		mA	Modem-sleep, 240 MHz, WAITI (dual core idle), all peripheral clocks disabled	29
Modem-sleep current, WAITI dual core idle, 240 MHz			47.6		mA	Modem-sleep, 240 MHz, WAITI (dual core idle), all peripheral clocks enabled	29

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts		tin	Solder: Sn-Ag-Cu (SAC305) lead-free solder Temperature (°C)	47

CAD (KiCad official)

Symbol: ESP32-S3-WROOM-1-N8
Footprint: PCM_Espressif:ESP32-S3-WROOM-1
3D model: ESP32-S3-WROOM-1 (KiCad packages3D, STEP)
3D model files: esp32-s3-wroom-1-n8-etched.step / esp32-s3-wroom-1-n8-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-s3-wroom-1-n8.step / esp32-s3-wroom-1-n8.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Espressif Systems datasheet (53 pp, sha256 27d71971da07c280, retrieved 2026-10-28, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF