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ESP32-S3-MINI-1U-N8

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Espressif Systems WiFi Modules, VFQFN-56-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-S3-MINI-1U-N8

Espressif Systems · WiFi Modules · VFQFN-56-EP

ESP32-S3-MINI-1U-N8 from Espressif Systems, in a VFQFN-56-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground.
2 GND power_in Ground.
3 3V3 power_in Module power supply, 3.0 to 3.6 V (3.3 V typ) with at least 0.5 A available from the external supply.
4 IO0 bidirectional GPIO0 / RTC_GPIO0; boot-mode strapping pin with weak pull-up (default 1, SPI Boot).
5 IO1 bidirectional General-purpose I/O with functions RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0.
6 IO2 bidirectional General-purpose I/O with functions RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1.
7 IO3 bidirectional General-purpose I/O with functions RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2; JTAG signal source strapping pin (floating by default, no internal pull).
8 IO4 bidirectional General-purpose I/O with functions RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3.
9 IO5 bidirectional General-purpose I/O with functions RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4.
10 IO6 bidirectional General-purpose I/O with functions RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5.
11 IO7 bidirectional General-purpose I/O with functions RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6.
12 IO8 bidirectional General-purpose I/O with functions RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7, SUBSPICS1.
13 IO9 bidirectional General-purpose I/O with functions RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD, SUBSPIHD.
14 IO10 bidirectional General-purpose I/O with functions RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4, SUBSPICS0.
15 IO11 bidirectional General-purpose I/O with functions RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5, SUBSPID.
16 IO12 bidirectional General-purpose I/O with functions RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6, SUBSPICLK.
17 IO13 bidirectional General-purpose I/O with functions RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7, SUBSPIQ.
18 IO14 bidirectional General-purpose I/O with functions RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS, SUBSPIWP.
19 IO15 bidirectional General-purpose I/O with functions RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P.
20 IO16 bidirectional General-purpose I/O with functions RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N.
21 IO17 bidirectional General-purpose I/O with functions RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6.
22 IO18 bidirectional General-purpose I/O with functions RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, CLK_OUT3.
23 IO19 bidirectional General-purpose I/O with functions RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB D- signal.
24 IO20 bidirectional General-purpose I/O with functions RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+.
25 IO21 bidirectional General-purpose I/O with functions RTC_GPIO21, GPIO21.
26 IO26 bidirectional General-purpose I/O with functions SPICS1, GPIO26; free for use on -N8 parts (connected to PSRAM only on -N4R2).
27 IO47 bidirectional General-purpose I/O with functions SPICLK_P_DIFF, GPIO47, SUBSPICLK_P_DIFF.
28 IO33 bidirectional General-purpose I/O with functions SPIIO4, GPIO33, FSPIHD, SUBSPIHD; default function decided by eFuse bit.
29 IO34 bidirectional General-purpose I/O with functions SPIIO5, GPIO34, FSPICS0, SUBSPICS0; default function decided by eFuse bit.
30 IO48 bidirectional General-purpose I/O with functions SPICLK_N_DIFF, GPIO48, SUBSPICLK_N_DIFF.
31 IO35 bidirectional General-purpose I/O with functions SPIIO6, GPIO35, FSPID, SUBSPID; default function decided by eFuse bit.
32 IO36 bidirectional General-purpose I/O with functions SPIIO7, GPIO36, FSPICLK, SUBSPICLK; default function decided by eFuse bit.
33 IO37 bidirectional General-purpose I/O with functions SPIDQS, GPIO37, FSPIQ, SUBSPIQ; default function decided by eFuse bit.
34 IO38 bidirectional General-purpose I/O with functions GPIO38, FSPIWP, SUBSPIWP.
35 IO39 bidirectional General-purpose I/O with functions MTCK (JTAG), GPIO39, CLK_OUT3, SUBSPICS1.
36 IO40 bidirectional General-purpose I/O with functions MTDO (JTAG), GPIO40, CLK_OUT2.
37 IO41 bidirectional General-purpose I/O with functions MTDI (JTAG), GPIO41, CLK_OUT1.
38 IO42 bidirectional General-purpose I/O with functions MTMS (JTAG), GPIO42.
39 TXD0 bidirectional UART0 transmit (U0TXD), also GPIO43 and CLK_OUT1.
40 RXD0 bidirectional UART0 receive (U0RXD), also GPIO44 and CLK_OUT2.
41 IO45 bidirectional GPIO45; VDD_SPI voltage strapping pin with weak pull-down (default 0).
42 GND power_in Ground.
43 GND power_in Ground.
44 IO46 bidirectional GPIO46; boot-mode and ROM message printing strapping pin with weak pull-down (default 0).
45 EN input Chip enable: high turns the chip on, low powers it off; must not be left floating.
46 GND power_in Ground.
47 GND power_in Ground.
48 GND power_in Ground.
49 GND power_in Ground.
50 GND power_in Ground.
51 GND power_in Ground.
52 GND power_in Ground.
53 GND power_in Ground.
54 GND power_in Ground.
55 GND power_in Ground.
56 GND power_in Ground.
57 GND power_in Ground.
58 GND power_in Ground.
59 GND power_in Ground.
60 GND power_in Ground.
61 GND power_in Ground pad (EPAD); soldering it to board ground is optional but improves thermal performance.
62 GND power_in Ground.
63 GND power_in Ground.
64 GND power_in Ground.
65 GND power_in Ground.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package VFQFN-56-EP
Category IoT/Communication Modules
Pins 65

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 27
Storage temperature TSTORE -40 105 °C 27
Power supply voltage VDD33 3 3.3 3.6 V 27
Current delivered by external power supply IVDD 0.5 A 27
Operating ambient temperature TA -40 85 °C 27
Low-level input voltage VIL -0.3 V 27
High-level input current IIH 50 nA 27
Low-level input current IIL 50 nA 27
Chip reset voltage VIL_nRST -0.3 V EN voltage is within the specified range 28
Center frequency range of operating channel (Wi-Fi) 2412 2484 MHz 32
Center frequency range of operating channel (Bluetooth LE) 2402 2480 MHz 34
RF transmit power range (Bluetooth LE) -24 20 dBm 34
TX EVM limit EVM -24.5 -10 dB 802.11b, 1 Mbps, @20.5 dBm 32
TX EVM limit EVM -23 -5 dB 802.11g, 6 Mbps, @20 dBm 32
TX EVM limit EVM -29.5 -25 dB 802.11g, 54 Mbps, @18 dBm 32
TX EVM limit EVM -24 -5 dB 802.11n, HT20, MCS 0, @19 dBm 33
TX EVM limit EVM -30.5 -27 dB 802.11n, HT20, MCS 7, @17.5 dBm 33
TX EVM limit EVM -25 -5 dB 802.11n, HT40, MCS 0, @18.5 dBm 33
TX EVM limit EVM -30 -27 dB 802.11n, HT40, MCS 7, @17 dBm 33
Maximum clock frequency (flash) FC 80 MHz 30
Program/erase cycles 100000 cycles 30
Data retention time TRET 20 years 30
Page program time TPP 0.8 5 ms 30
Sector erase time (4 KB) TSE 70 500 ms 30
Block erase time (32 KB) TBE1 0.2 2 s 30
Block erase time (64 KB) TBE2 0.3 3 s 30
Chip erase time (64 Mb) TCE 25 100 s 30
Input pin capacitance CIN 2 pF 27
High-level source current IOH 40 mA VDD1 = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3 27
Low-level sink current IOL 28 mA VDD1 = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3 27
Internal weak pull-up resistor RPU 45 kΩ 27
Internal weak pull-down resistor RPD 45 kΩ 27

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 43
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 43
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 43

CAD (KiCad official)

  • Symbol: ESP32-S3-MINI-1U-N8
  • Footprint: PCM_Espressif:ESP32-S3-MINI-1U
  • 3D model: VFQFN-56-EP (KiCad packages3D, STEP)
  • 3D model files: esp32-s3-mini-1u-n8-etched.step / esp32-s3-mini-1u-n8-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-s3-mini-1u-n8.step / esp32-s3-mini-1u-n8.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (53 pp, sha256 4d4b7f1c17b484c6, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF