Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity

main

Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20251024

Name	Last commit message	Last updated
docs	Publish 0.1.0 · Ray	7d ago
viewers	esp32-s3-mini-1u-n4r2: viewers · Ray	7d ago
esp32-s3-mini-1u-n4r2-etched.glb	Publish 0.1.0 · Ray	7d ago
esp32-s3-mini-1u-n4r2-etched.step	esp32-s3-mini-1u-n4r2: factory component page (tier=lcsc) · Ray	7d ago
esp32-s3-mini-1u-n4r2-hero.glb	esp32-s3-mini-1u-n4r2: hero GLB from the etched model (keeps the MPN mark) · Ray	7d ago
esp32-s3-mini-1u-n4r2-hero.overlay.json	Publish 0.1.0 · Ray	7d ago
esp32-s3-mini-1u-n4r2.glb	Publish 0.1.0 · Ray	7d ago
esp32-s3-mini-1u-n4r2.kicad_mod	Publish 0.1.0 · Ray	7d ago
esp32-s3-mini-1u-n4r2.kicad_sym	Publish 0.1.0 · Ray	7d ago
esp32-s3-mini-1u-n4r2.lbr	Publish 0.1.0 · Ray	7d ago
esp32-s3-mini-1u-n4r2.step	esp32-s3-mini-1u-n4r2: factory component page (tier=lcsc) · Ray	7d ago
package.json	Publish 0.1.0 · Ray	7d ago
page.json	Set visibility: public · Ray	7d ago
README.md	Publish 0.1.0 · Ray	7d ago

ESP32-S3-MINI-1U-N4R2

Espressif Systems · WiFi Modules · ESP32-S3-MINI-1U

ESP32-S3-MINI-1U-N4R2 from Espressif Systems, in a ESP32-S3-MINI-1U. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
2	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
3	3V3	power_in	Module supply pin; VDD33 must be kept within 3.0-3.6 V (typical 3.3 V, absolute maximum -0.3 to 3.6 V), and the external supply must provide at least 0.5 A.
4	IO0	bidirectional	RTC_GPIO0 / GPIO0; strapping pin sampled at reset with a weak internal pull-up (default 1) that selects boot mode together with GPIO46 (both low selects Joint Download Boot).
5	IO1	bidirectional	RTC_GPIO1 / GPIO1 with TOUCH1 and ADC1_CH0 functions.
6	IO2	bidirectional	RTC_GPIO2 / GPIO2 with TOUCH2 and ADC1_CH1 functions.
7	IO3	bidirectional	RTC_GPIO3 / GPIO3 with TOUCH3 and ADC1_CH2 functions; strapping pin for JTAG signal source selection during early boot, has no internal pull resistor and must be driven by an external circuit that is not high-impedance.
8	IO4	bidirectional	RTC_GPIO4 / GPIO4 with TOUCH4 and ADC1_CH3 functions.
9	IO5	bidirectional	RTC_GPIO5 / GPIO5 with TOUCH5 and ADC1_CH4 functions.
10	IO6	bidirectional	RTC_GPIO6 / GPIO6 with TOUCH6 and ADC1_CH5 functions.
11	IO7	bidirectional	RTC_GPIO7 / GPIO7 with TOUCH7 and ADC1_CH6 functions.
12	IO8	bidirectional	RTC_GPIO8 / GPIO8 with TOUCH8, ADC1_CH7 and SUBSPICS1 functions.
13	IO9	bidirectional	RTC_GPIO9 / GPIO9 with TOUCH9, ADC1_CH8, FSPIHD and SUBSPIHD functions.
14	IO10	bidirectional	RTC_GPIO10 / GPIO10 with TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4 and SUBSPICS0 functions.
15	IO11	bidirectional	RTC_GPIO11 / GPIO11 with TOUCH11, ADC2_CH0, FSPID, FSPIIO5 and SUBSPID functions.
16	IO12	bidirectional	RTC_GPIO12 / GPIO12 with TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6 and SUBSPICLK functions.
17	IO13	bidirectional	RTC_GPIO13 / GPIO13 with TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7 and SUBSPIQ functions.
18	IO14	bidirectional	RTC_GPIO14 / GPIO14 with TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS and SUBSPIWP functions.
19	IO15	bidirectional	RTC_GPIO15 / GPIO15 with U0RTS, ADC2_CH4 and XTAL_32K_P functions.
20	IO16	bidirectional	RTC_GPIO16 / GPIO16 with U0CTS, ADC2_CH5 and XTAL_32K_N functions.
21	IO17	bidirectional	RTC_GPIO17 / GPIO17 with U1TXD and ADC2_CH6 functions.
22	IO18	bidirectional	RTC_GPIO18 / GPIO18 with U1RXD, ADC2_CH7 and CLK_OUT3 functions.
23	IO19	bidirectional	RTC_GPIO19 / GPIO19 with U1RTS, ADC2_CH8, CLK_OUT2 and USB_D- functions.
24	IO20	bidirectional	RTC_GPIO20 / GPIO20 with U1CTS, ADC2_CH9, CLK_OUT1 and USB_D+ functions.
25	IO21	bidirectional	RTC_GPIO21 / GPIO21 general-purpose I/O with RTC function.
26	IO26	bidirectional	SPICS1 / GPIO26; on modules ordered with the -N4R2 suffix this pin is used to connect the embedded PSRAM and cannot be used for other functions.
27	IO47	bidirectional	SPICLK_P_DIFF / GPIO47 with SUBSPICLK_P_DIFF function.
28	IO33	bidirectional	SPIIO4 / GPIO33 with FSPIHD and SUBSPIHD functions; default function is determined by an eFuse bit.
29	IO34	bidirectional	SPIIO5 / GPIO34 with FSPICS0 and SUBSPICS0 functions; default function is determined by an eFuse bit.
30	IO48	bidirectional	SPICLK_N_DIFF / GPIO48 with SUBSPICLK_N_DIFF function.
31	IO35	bidirectional	SPIIO6 / GPIO35 with FSPID and SUBSPID functions; default function is determined by an eFuse bit.
32	IO36	bidirectional	SPIIO7 / GPIO36 with FSPICLK and SUBSPICLK functions; default function is determined by an eFuse bit.
33	IO37	bidirectional	SPIDQS / GPIO37 with FSPIQ and SUBSPIQ functions; default function is determined by an eFuse bit.
34	IO38	bidirectional	GPIO38 with FSPIWP and SUBSPIWP functions.
35	IO39	bidirectional	MTCK / GPIO39 with CLK_OUT3 and SUBSPICS1 functions (JTAG clock).
36	IO40	bidirectional	MTDO / GPIO40 with CLK_OUT2 function (JTAG data out).
37	IO41	bidirectional	MTDI / GPIO41 with CLK_OUT1 function (JTAG data in).
38	IO42	bidirectional	MTMS / GPIO42 (JTAG mode select).
39	TXD0	bidirectional	U0TXD / GPIO43 with CLK_OUT1 function; UART0 transmit, default function of this pad.
40	RXD0	bidirectional	U0RXD / GPIO44 with CLK_OUT2 function; UART0 receive, default function of this pad.
41	IO45	bidirectional	GPIO45; strapping pin sampled at reset with weak internal pull-down (default 0) that sets the VDD_SPI voltage.
44	IO46	bidirectional	GPIO46; strapping pin sampled at reset with weak internal pull-down (default 0) that selects boot mode and ROM log output.
45	EN	input	Chip enable: high enables the chip and low shuts it down; EN must not be left floating, and an RC delay circuit is recommended (typically 10 kΩ / 1 µF, to be tuned to power-up timing).
42	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
43	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
46	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
47	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
48	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
49	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
50	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
51	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
52	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
53	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
54	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
55	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
56	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
57	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
58	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
59	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
60	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
61	GND	power_in	Ground connection of the module; this is the exposed thermal pad (EPAD) which may be soldered to the base board GND for better heat dissipation.
62	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
63	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
64	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).
65	GND	power_in	Ground connection of the module (one of the GND pins listed in Table 2).

Key specifications

Parameter	Value
Manufacturer	Espressif Systems
Package	ESP32-S3-MINI-1U
Category	IoT/Communication Modules
Pins	65

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Power pin voltage	VDD33	3	3.3	3.6	V		16
External power supply current	IVDD	0.5			A		16
Operating ambient temperature	TA	-40		85	°C		16
Power pin voltage	VDD33	-0.3		3.6	V		16
Storage temperature	TSTORE	-40		105	°C		16
Strapping pin setup time	tSU	0			ms	Time for power rails to stabilise before CHIP_PU is pulled high	13
Strapping pin hold time	tH	3			ms	Time after CHIP_PU is pulled high during which strapping pin value can be read	13
Crystal frequency tolerance		-10		10	ppm	40 MHz crystal Y1, as printed on schematic	26
Input leakage current high	IIH			50	nA		16
Input leakage current low	IIL			50	nA		16
Crystal frequency			40		MHz	40 MHz integrated crystal, as printed on schematic	26
Pin capacitance	CIN		2		pF		16
High-level source current	IOH		40		mA	VDD1= 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3	16
Low-level sink current	IOL		28		mA	VDD1= 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3	16
Internal weak pull-up resistance	RPU		45		kΩ		16
Internal weak pull-down resistance	RPD		45		kΩ		16

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
housing	THERMOPLASTIC		HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0;	32
contacts	COPPER ALLOY	gold	CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;	32
shell	COPPER ALLOY	gold	SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;	32

CAD (KiCad official)

Symbol: ESP32-S3-MINI-1U-N4R2
Footprint: PCM_Espressif:ESP32-S3-MINI-1U
3D model: ESP32-S3-MINI-1U (KiCad packages3D, STEP)
3D model files: esp32-s3-mini-1u-n4r2-etched.step / esp32-s3-mini-1u-n4r2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-s3-mini-1u-n4r2.step / esp32-s3-mini-1u-n4r2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Espressif Systems datasheet (37 pp, sha256 71142b72ce76c5d0, retrieved 2026-10-28, tier: lcsc)
Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF