component
ESP32-S3-MINI-1-N4R2
Public Made by Adomby adom
Espressif Systems WiFi Modules, ESP32-S3-MINI-1. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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ESP32-S3-MINI-1-N4R2
Espressif Systems · WiFi Modules · ESP32-S3-MINI-1
ESP32-S3-MINI-1-N4R2 from Espressif Systems, in a ESP32-S3-MINI-1. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground connection. |
| 2 | GND | power_in | Ground connection. |
| 3 | 3V3 | power_in | Module supply input; VDD33 must be 3.0-3.6 V (3.3 V typical), with an external supply able to provide at least 0.5 A. |
| 4 | IO0 | bidirectional | RTC_GPIO0 / GPIO0; weak pull-up at reset, and together with GPIO46 it selects the boot mode (both low gives Joint Download Boot). |
| 5 | IO1 | bidirectional | RTC_GPIO1 / GPIO1 with TOUCH1 and ADC1_CH0 functions. |
| 6 | IO2 | bidirectional | RTC_GPIO2 / GPIO2 with TOUCH2 and ADC1_CH1 functions. |
| 7 | IO3 | bidirectional | RTC_GPIO3 / GPIO3 with no internal pull resistors; its level sets the JTAG signal source at startup and must be driven by a circuit not in high impedance. |
| 8 | IO4 | bidirectional | RTC_GPIO4 / GPIO4 with TOUCH4 and ADC1_CH3 functions. |
| 9 | IO5 | bidirectional | RTC_GPIO5 / GPIO5 with TOUCH5 and ADC1_CH4 functions. |
| 10 | IO6 | bidirectional | RTC_GPIO6 / GPIO6 with TOUCH6 and ADC1_CH5 functions. |
| 11 | IO7 | bidirectional | RTC_GPIO7 / GPIO7 with TOUCH7 and ADC1_CH6 functions. |
| 12 | IO8 | bidirectional | RTC_GPIO8 / GPIO8 with TOUCH8, ADC1_CH7 and SUBSPICS1 functions. |
| 13 | IO9 | bidirectional | RTC_GPIO9 / GPIO9 with TOUCH9, ADC1_CH8, FSPIHD and SUBSPIHD functions. |
| 14 | IO10 | bidirectional | RTC_GPIO10 / GPIO10 with TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4 and SUBSPICS0 functions. |
| 15 | IO11 | bidirectional | RTC_GPIO11 / GPIO11 with TOUCH11, ADC2_CH0, FSPID, FSPIIO5 and SUBSPID functions. |
| 16 | IO12 | bidirectional | RTC_GPIO12 / GPIO12 with TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6 and SUBSPICLK functions. |
| 17 | IO13 | bidirectional | RTC_GPIO13 / GPIO13 with TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7 and SUBSPIQ functions. |
| 18 | IO14 | bidirectional | RTC_GPIO14 / GPIO14 with TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS and SUBSPIWP functions. |
| 19 | IO15 | bidirectional | RTC_GPIO15 / GPIO15 with U0RTS, ADC2_CH4 and XTAL_32K_P functions. |
| 20 | IO16 | bidirectional | RTC_GPIO16 / GPIO16 with U0CTS, ADC2_CH5 and XTAL_32K_N functions. |
| 21 | IO17 | bidirectional | RTC_GPIO17 / GPIO17 with U1TXD and ADC2_CH6 functions. |
| 22 | IO18 | bidirectional | RTC_GPIO18 / GPIO18 with U1RXD, ADC2_CH7 and CLK_OUT3 functions. |
| 23 | IO19 | bidirectional | RTC_GPIO19 / GPIO19 with U1RTS, ADC2_CH8, CLK_OUT2 and USB_D- functions. |
| 24 | IO20 | bidirectional | RTC_GPIO20 / GPIO20 with U1CTS, ADC2_CH9, CLK_OUT1 and USB_D+ functions. |
| 25 | IO21 | bidirectional | RTC_GPIO21 / GPIO21 general-purpose I/O. |
| 26 | IO26 | bidirectional | SPICS1 / GPIO26; on the -N4R2 variant this pin connects to the embedded PSRAM and cannot be used for other functions. |
| 27 | IO47 | bidirectional | SPICLK_P_DIFF / GPIO47 / SUBSPICLK_P_DIFF general-purpose I/O. |
| 28 | IO33 | bidirectional | SPIIO4 / GPIO33 with FSPIHD and SUBSPIHD functions; default function is set by eFuse bits for pins 28-29 and 31-33. |
| 29 | IO34 | bidirectional | SPIIO5 / GPIO34 with FSPICS0 and SUBSPICS0 functions; default function is set by eFuse bits for pins 28-29 and 31-33. |
| 30 | IO48 | bidirectional | SPICLK_N_DIFF / GPIO48 / SUBSPICLK_N_DIFF general-purpose I/O. |
| 31 | IO35 | bidirectional | SPIIO6 / GPIO35 with FSPID and SUBSPID functions; default function is set by eFuse bits for pins 28-29 and 31-33. |
| 32 | IO36 | bidirectional | SPIIO7 / GPIO36 with FSPICLK and SUBSPICLK functions; default function is set by eFuse bits for pins 28-29 and 31-33. |
| 33 | IO37 | bidirectional | SPIDQS / GPIO37 with FSPIQ and SUBSPIQ functions; default function is set by eFuse bits for pins 28-29 and 31-33. |
| 34 | IO38 | bidirectional | GPIO38 with FSPIWP and SUBSPIWP functions. |
| 35 | IO39 | bidirectional | MTCK / GPIO39 with CLK_OUT3 and SUBSPICS1 functions (JTAG clock by default). |
| 36 | IO40 | bidirectional | MTDO / GPIO40 with CLK_OUT2 function (JTAG data output by default). |
| 37 | IO41 | bidirectional | MTDI / GPIO41 with CLK_OUT1 function (JTAG data input by default). |
| 38 | IO42 | bidirectional | MTMS / GPIO42 general-purpose I/O (JTAG mode select by default). |
| 39 | TXD0 | bidirectional | U0TXD / GPIO43 / CLK_OUT1; UART0 transmit pin that can be set to high impedance. |
| 40 | RXD0 | bidirectional | U0RXD / GPIO44 / CLK_OUT2; UART0 receive pin that can be set to high impedance. |
| 41 | IO45 | bidirectional | GPIO45; strapping pin sampled at reset (internal pull-down, default 0) that selects the VDD_SPI voltage. |
| 42 | GND | power_in | Ground connection. |
| 43 | GND | power_in | Ground connection. |
| 44 | IO46 | bidirectional | GPIO46; strapping pin sampled at reset (internal pull-down, default 0) that together with GPIO0 sets the boot mode and controls ROM log printing. |
| 45 | EN | input | Chip enable: high enables the chip, low shuts it down; EN must not be left floating, with reset-release threshold 0.75 × VDD to VDD + 0.3 V and reset threshold up to 0.25 × VDD. |
| 46 | GND | power_in | Ground connection (group of GND pads 46-65, including the thermal pad at pin 61). |
| 47 | GND | power_in | Ground connection. |
| 48 | GND | power_in | Ground connection. |
| 49 | GND | power_in | Ground connection. |
| 50 | GND | power_in | Ground connection. |
| 51 | GND | power_in | Ground connection. |
| 52 | GND | power_in | Ground connection. |
| 53 | GND | power_in | Ground connection. |
| 54 | GND | power_in | Ground connection. |
| 55 | GND | power_in | Ground connection. |
| 56 | GND | power_in | Ground connection. |
| 57 | GND | power_in | Ground connection. |
| 58 | GND | power_in | Ground connection. |
| 59 | GND | power_in | Ground connection. |
| 60 | GND | power_in | Ground connection. |
| 61 | GND | power_in | Ground connection; labelled EPAD in the schematic and may be soldered to the host board GND for better heat dissipation. |
| 62 | GND | power_in | Ground connection. |
| 63 | GND | power_in | Ground connection. |
| 64 | GND | power_in | Ground connection. |
| 65 | GND | power_in | Ground connection. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Espressif Systems |
| Package | ESP32-S3-MINI-1 |
| Category | IoT/Communication Modules |
| Pins | 65 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| 电源管脚电压 | VDD33 | -0.3 | 3.6 | V | 16 | ||
| 存储温度 | TSTORE | -40 | 105 | °C | 16 | ||
| 电源管脚电压 | VDD33 | 3 | 3.3 | 3.6 | V | 16 | |
| 外部电源的供电电流 | IVDD | 0.5 | A | 16 | |||
| 工作环境温度 | TA | -40 | 85 | °C | 16 | ||
| 高电平输入电流 | IIH | 50 | nA | 16 | |||
| 低电平输入电流 | IIL | 50 | nA | 16 | |||
| 管脚电容 | CIN | 2 | pF | 16 | |||
| 高电平拉电流 | IOH | 40 | mA | VDD1= 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3 | 16 | ||
| 低电平灌电流 | IOL | 28 | mA | VDD1= 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3 | 16 | ||
| 内部弱上拉电阻 | RPU | 45 | kΩ | 16 | |||
| 内部弱下拉电阻 | RPD | 45 | kΩ | 16 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | THERMOPLASTIC | HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; | 32 | |
| contacts | COPPER ALLOY | gold | CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 32 |
| shell | COPPER ALLOY | gold | SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 32 |
CAD (KiCad official)
- Symbol:
ESP32-S3-MINI-1-N4R2 - Footprint:
PCM_Espressif:ESP32-S3-MINI-1 - 3D model: ESP32-S3-MINI-1 (KiCad packages3D, STEP)
- 3D model files:
esp32-s3-mini-1-n4r2-etched.step/esp32-s3-mini-1-n4r2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esp32-s3-mini-1-n4r2.step/esp32-s3-mini-1-n4r2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Espressif Systems datasheet (37 pp, sha256
71142b72ce76c5d0, retrieved 2026-10-28, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ESP32-S3-MINI-1-N4R2
**Espressif Systems** · WiFi Modules · ESP32-S3-MINI-1
ESP32-S3-MINI-1-N4R2 from Espressif Systems, in a ESP32-S3-MINI-1. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground connection. |
| 2 | GND | power_in | Ground connection. |
| 3 | 3V3 | power_in | Module supply input; VDD33 must be 3.0-3.6 V (3.3 V typical), with an external supply able to provide at least 0.5 A. |
| 4 | IO0 | bidirectional | RTC_GPIO0 / GPIO0; weak pull-up at reset, and together with GPIO46 it selects the boot mode (both low gives Joint Download Boot). |
| 5 | IO1 | bidirectional | RTC_GPIO1 / GPIO1 with TOUCH1 and ADC1_CH0 functions. |
| 6 | IO2 | bidirectional | RTC_GPIO2 / GPIO2 with TOUCH2 and ADC1_CH1 functions. |
| 7 | IO3 | bidirectional | RTC_GPIO3 / GPIO3 with no internal pull resistors; its level sets the JTAG signal source at startup and must be driven by a circuit not in high impedance. |
| 8 | IO4 | bidirectional | RTC_GPIO4 / GPIO4 with TOUCH4 and ADC1_CH3 functions. |
| 9 | IO5 | bidirectional | RTC_GPIO5 / GPIO5 with TOUCH5 and ADC1_CH4 functions. |
| 10 | IO6 | bidirectional | RTC_GPIO6 / GPIO6 with TOUCH6 and ADC1_CH5 functions. |
| 11 | IO7 | bidirectional | RTC_GPIO7 / GPIO7 with TOUCH7 and ADC1_CH6 functions. |
| 12 | IO8 | bidirectional | RTC_GPIO8 / GPIO8 with TOUCH8, ADC1_CH7 and SUBSPICS1 functions. |
| 13 | IO9 | bidirectional | RTC_GPIO9 / GPIO9 with TOUCH9, ADC1_CH8, FSPIHD and SUBSPIHD functions. |
| 14 | IO10 | bidirectional | RTC_GPIO10 / GPIO10 with TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4 and SUBSPICS0 functions. |
| 15 | IO11 | bidirectional | RTC_GPIO11 / GPIO11 with TOUCH11, ADC2_CH0, FSPID, FSPIIO5 and SUBSPID functions. |
| 16 | IO12 | bidirectional | RTC_GPIO12 / GPIO12 with TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6 and SUBSPICLK functions. |
| 17 | IO13 | bidirectional | RTC_GPIO13 / GPIO13 with TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7 and SUBSPIQ functions. |
| 18 | IO14 | bidirectional | RTC_GPIO14 / GPIO14 with TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS and SUBSPIWP functions. |
| 19 | IO15 | bidirectional | RTC_GPIO15 / GPIO15 with U0RTS, ADC2_CH4 and XTAL_32K_P functions. |
| 20 | IO16 | bidirectional | RTC_GPIO16 / GPIO16 with U0CTS, ADC2_CH5 and XTAL_32K_N functions. |
| 21 | IO17 | bidirectional | RTC_GPIO17 / GPIO17 with U1TXD and ADC2_CH6 functions. |
| 22 | IO18 | bidirectional | RTC_GPIO18 / GPIO18 with U1RXD, ADC2_CH7 and CLK_OUT3 functions. |
| 23 | IO19 | bidirectional | RTC_GPIO19 / GPIO19 with U1RTS, ADC2_CH8, CLK_OUT2 and USB_D- functions. |
| 24 | IO20 | bidirectional | RTC_GPIO20 / GPIO20 with U1CTS, ADC2_CH9, CLK_OUT1 and USB_D+ functions. |
| 25 | IO21 | bidirectional | RTC_GPIO21 / GPIO21 general-purpose I/O. |
| 26 | IO26 | bidirectional | SPICS1 / GPIO26; on the -N4R2 variant this pin connects to the embedded PSRAM and cannot be used for other functions. |
| 27 | IO47 | bidirectional | SPICLK_P_DIFF / GPIO47 / SUBSPICLK_P_DIFF general-purpose I/O. |
| 28 | IO33 | bidirectional | SPIIO4 / GPIO33 with FSPIHD and SUBSPIHD functions; default function is set by eFuse bits for pins 28-29 and 31-33. |
| 29 | IO34 | bidirectional | SPIIO5 / GPIO34 with FSPICS0 and SUBSPICS0 functions; default function is set by eFuse bits for pins 28-29 and 31-33. |
| 30 | IO48 | bidirectional | SPICLK_N_DIFF / GPIO48 / SUBSPICLK_N_DIFF general-purpose I/O. |
| 31 | IO35 | bidirectional | SPIIO6 / GPIO35 with FSPID and SUBSPID functions; default function is set by eFuse bits for pins 28-29 and 31-33. |
| 32 | IO36 | bidirectional | SPIIO7 / GPIO36 with FSPICLK and SUBSPICLK functions; default function is set by eFuse bits for pins 28-29 and 31-33. |
| 33 | IO37 | bidirectional | SPIDQS / GPIO37 with FSPIQ and SUBSPIQ functions; default function is set by eFuse bits for pins 28-29 and 31-33. |
| 34 | IO38 | bidirectional | GPIO38 with FSPIWP and SUBSPIWP functions. |
| 35 | IO39 | bidirectional | MTCK / GPIO39 with CLK_OUT3 and SUBSPICS1 functions (JTAG clock by default). |
| 36 | IO40 | bidirectional | MTDO / GPIO40 with CLK_OUT2 function (JTAG data output by default). |
| 37 | IO41 | bidirectional | MTDI / GPIO41 with CLK_OUT1 function (JTAG data input by default). |
| 38 | IO42 | bidirectional | MTMS / GPIO42 general-purpose I/O (JTAG mode select by default). |
| 39 | TXD0 | bidirectional | U0TXD / GPIO43 / CLK_OUT1; UART0 transmit pin that can be set to high impedance. |
| 40 | RXD0 | bidirectional | U0RXD / GPIO44 / CLK_OUT2; UART0 receive pin that can be set to high impedance. |
| 41 | IO45 | bidirectional | GPIO45; strapping pin sampled at reset (internal pull-down, default 0) that selects the VDD_SPI voltage. |
| 42 | GND | power_in | Ground connection. |
| 43 | GND | power_in | Ground connection. |
| 44 | IO46 | bidirectional | GPIO46; strapping pin sampled at reset (internal pull-down, default 0) that together with GPIO0 sets the boot mode and controls ROM log printing. |
| 45 | EN | input | Chip enable: high enables the chip, low shuts it down; EN must not be left floating, with reset-release threshold 0.75 × VDD to VDD + 0.3 V and reset threshold up to 0.25 × VDD. |
| 46 | GND | power_in | Ground connection (group of GND pads 46-65, including the thermal pad at pin 61). |
| 47 | GND | power_in | Ground connection. |
| 48 | GND | power_in | Ground connection. |
| 49 | GND | power_in | Ground connection. |
| 50 | GND | power_in | Ground connection. |
| 51 | GND | power_in | Ground connection. |
| 52 | GND | power_in | Ground connection. |
| 53 | GND | power_in | Ground connection. |
| 54 | GND | power_in | Ground connection. |
| 55 | GND | power_in | Ground connection. |
| 56 | GND | power_in | Ground connection. |
| 57 | GND | power_in | Ground connection. |
| 58 | GND | power_in | Ground connection. |
| 59 | GND | power_in | Ground connection. |
| 60 | GND | power_in | Ground connection. |
| 61 | GND | power_in | Ground connection; labelled EPAD in the schematic and may be soldered to the host board GND for better heat dissipation. |
| 62 | GND | power_in | Ground connection. |
| 63 | GND | power_in | Ground connection. |
| 64 | GND | power_in | Ground connection. |
| 65 | GND | power_in | Ground connection. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Espressif Systems |
| Package | ESP32-S3-MINI-1 |
| Category | IoT/Communication Modules |
| Pins | 65 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| 电源管脚电压 | VDD33 | -0.3 | | 3.6 | V | | 16 |
| 存储温度 | TSTORE | -40 | | 105 | °C | | 16 |
| 电源管脚电压 | VDD33 | 3 | 3.3 | 3.6 | V | | 16 |
| 外部电源的供电电流 | IVDD | 0.5 | | | A | | 16 |
| 工作环境温度 | TA | -40 | | 85 | °C | | 16 |
| 高电平输入电流 | IIH | | | 50 | nA | | 16 |
| 低电平输入电流 | IIL | | | 50 | nA | | 16 |
| 管脚电容 | CIN | | 2 | | pF | | 16 |
| 高电平拉电流 | IOH | | 40 | | mA | VDD1= 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3 | 16 |
| 低电平灌电流 | IOL | | 28 | | mA | VDD1= 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3 | 16 |
| 内部弱上拉电阻 | RPU | | 45 | | kΩ | | 16 |
| 内部弱下拉电阻 | RPD | | 45 | | kΩ | | 16 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | THERMOPLASTIC | | HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; | 32 |
| contacts | COPPER ALLOY | gold | CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 32 |
| shell | COPPER ALLOY | gold | SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 32 |
## CAD (KiCad official)
- Symbol: `ESP32-S3-MINI-1-N4R2`
- Footprint: `PCM_Espressif:ESP32-S3-MINI-1`
- 3D model: ESP32-S3-MINI-1 (KiCad packages3D, STEP)
- 3D model files: `esp32-s3-mini-1-n4r2-etched.step` / `esp32-s3-mini-1-n4r2-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esp32-s3-mini-1-n4r2.step` / `esp32-s3-mini-1-n4r2.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Espressif Systems datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589837995731165184) (37 pp, sha256 `71142b72ce76c5d0`, retrieved 2026-10-28, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/esp32-s3-mini-1-n4r2-datasheet.pdf)