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ESP32-S2-SOLO-U-N4

Espressif Systems · RF and Wireless · 40-SMD Module

ESP32-S2-SOLO-U-N4 from Espressif Systems, in a 40-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground.
2 3V3 power_in Power supply input; the recommended VDD33 range is 3.0 V to 3.6 V with 3.3 V typical.
3 EN input Chip enable: high turns the chip on and low powers it off; the pin must not be left floating.
4 IO4 bidirectional Multifunction I/O: RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3.
5 IO5 bidirectional Multifunction I/O: RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4.
6 IO6 bidirectional Multifunction I/O: RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5.
7 IO7 bidirectional Multifunction I/O: RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6.
8 IO15 bidirectional Multifunction I/O: RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P.
9 IO16 bidirectional Multifunction I/O: RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N.
10 IO17 bidirectional Multifunction I/O: RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6, DAC_1.
11 IO18 bidirectional Multifunction I/O: RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, DAC_2, CLK_OUT3.
12 IO8 bidirectional Multifunction I/O: RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7.
13 IO19 bidirectional Multifunction I/O: RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D-.
14 IO20 bidirectional Multifunction I/O: RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+.
15 IO3 bidirectional Multifunction I/O: RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2.
16 IO46 input Input-only GPIO46; also a strapping pin that selects the chip boot mode and ROM message printing at reset.
17 IO9 bidirectional Multifunction I/O: RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD.
18 IO10 bidirectional Multifunction I/O: RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4.
19 IO11 bidirectional Multifunction I/O: RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5.
20 IO12 bidirectional Multifunction I/O: RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6.
21 IO13 bidirectional Multifunction I/O: RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7.
22 IO14 bidirectional Multifunction I/O: RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS.
23 IO21 bidirectional Multifunction I/O: RTC_GPIO21, GPIO21.
24 IO33 bidirectional Multifunction I/O: SPIIO4, GPIO33, FSPIHD.
25 IO34 bidirectional Multifunction I/O: SPIIO5, GPIO34, FSPICS0.
26 IO45 bidirectional GPIO45; also a strapping pin that selects the VDD_SPI voltage source at reset.
27 IO0 bidirectional RTC_GPIO0, GPIO0; strapping pin for chip boot mode with a default internal pull-up.
28 IO35 bidirectional Multifunction I/O: SPIIO6, GPIO35, FSPID.
29 IO36 bidirectional Multifunction I/O: SPIIO7, GPIO36, FSPICLK.
30 IO37 bidirectional Multifunction I/O: SPIDQS, GPIO37, FSPIQ.
31 IO38 bidirectional Multifunction I/O: GPIO38, FSPIWP.
32 IO39 bidirectional Multifunction I/O: MTCK, GPIO39, CLK_OUT3.
33 IO40 bidirectional Multifunction I/O: MTDO, GPIO40, CLK_OUT2.
34 IO41 bidirectional Multifunction I/O: MTDI, GPIO41, CLK_OUT1.
35 IO42 bidirectional Multifunction I/O: MTMS, GPIO42.
36 RXD0 bidirectional UART0 receive (U0RXD), also GPIO44 and CLK_OUT2.
37 TXD0 bidirectional UART0 transmit (U0TXD), also GPIO43 and CLK_OUT1; the default output for ROM boot messages.
38 IO2 bidirectional Multifunction I/O: RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1.
39 IO1 bidirectional Multifunction I/O: RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0.
40 GND power_in Ground.
41 EPAD power_in Ground exposed pad; soldering it to the base board ground is optional but optimizes thermal performance.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 40-SMD Module
Category RF and Wireless
Pins 41

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 15
Storage temperature TSTORE -40 105 °C 15
Power supply voltage VDD33 3 3.3 3.6 V 15
Current delivered by external power supply IVDD 0.5 A 15
Operating ambient temperature TA -40 85 °C 85 °C version 15
Low-level input voltage VIL -0.3 V 15
Chip reset voltage VIL_nRST -0.3 V 15
High-level input current IIH 50 nA 15
Low-level input current IIL 50 nA 15
TX EVM limit -10 dB 802.11b, 1 Mbps, DSSS 18
TX EVM limit -5 dB 802.11g, 6 Mbps, OFDM 18
TX EVM limit -25 dB 802.11g, 54 Mbps, OFDM 18
TX EVM limit -27 dB 802.11n, HT20, MCS7 18

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Solder, Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 13: Reflow Profile 28

CAD (KiCad official)

  • Symbol: ESP32-S2-SOLO-U-N4
  • Footprint: PCM_Espressif:ESP32-S2-SOLO
  • 3D model: 40-SMD Module (KiCad packages3D, STEP)
  • 3D model files: esp32-s2-solo-u-n4-etched.step / esp32-s2-solo-u-n4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-s2-solo-u-n4.step / esp32-s2-solo-u-n4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (34 pp, sha256 dbfee97a9809455c, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF