component

ESP32-S2-MINI-1U-N4R2

Public Made by Adom

by adom

Espressif Systems RF and Wireless, 65-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentrf and wirelessesp32-s2-mini-1u-n4r2factory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
esp32-s2-mini-1u-n4r2 / README.md
History Download
Ray Publish 0.1.0 2df9522 20h ago

ESP32-S2-MINI-1U-N4R2

Espressif Systems · RF and Wireless · 65-SMD Module

ESP32-S2-MINI-1U-N4R2 from Espressif Systems, in a 65-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground.
2 GND power_in Ground.
3 3V3 power_in Power supply; recommended VDD33 range is 3.0 V to 3.6 V (typ. 3.3 V) with an absolute maximum of 3.6 V.
4 IO0 bidirectional RTC_GPIO0, GPIO0; strapping pin for chip boot mode, default pull-up (bit value 1).
5 IO1 bidirectional RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0.
6 IO2 bidirectional RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1.
7 IO3 bidirectional RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2.
8 IO4 bidirectional RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3.
9 IO5 bidirectional RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4.
10 IO6 bidirectional RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5.
11 IO7 bidirectional RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6.
12 IO8 bidirectional RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7.
13 IO9 bidirectional RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD.
14 IO10 bidirectional RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4.
15 IO11 bidirectional RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5.
16 IO12 bidirectional RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6.
17 IO13 bidirectional RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7.
18 IO14 bidirectional RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS.
19 IO15 bidirectional RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P.
20 IO16 bidirectional RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N.
21 IO17 bidirectional RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6, DAC_1; DAC_1 is also the alternative output for ROM messages when eFuse EFUSE_UART_PRINT_CONTROL is 1.
22 IO18 bidirectional RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, DAC_2, CLK_OUT3.
23 IO19 bidirectional RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D-.
24 IO20 bidirectional RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+.
25 IO21 bidirectional RTC_GPIO21, GPIO21.
26 IO26 bidirectional SPICS1, GPIO26; used by the embedded PSRAM on the ESP32-S2-MINI-1-N4R2 and cannot be used for other purposes.
27 NC unconnected No connection (NC).
28 IO33 bidirectional SPIIO4, GPIO33, FSPIHD.
29 IO34 bidirectional SPIIO5, GPIO34, FSPICS0.
30 GND power_in Ground.
31 IO35 bidirectional SPIIO6, GPIO35, FSPID.
32 IO36 bidirectional SPIIO7, GPIO36, FSPICLK.
33 IO37 bidirectional SPIDQS, GPIO37, FSPIQ.
34 IO38 bidirectional GPIO38, FSPIWP.
35 IO39 bidirectional MTCK, GPIO39, CLK_OUT3.
36 IO40 bidirectional MTDO, GPIO40, CLK_OUT2.
37 IO41 bidirectional MTDI, GPIO41, CLK_OUT1.
38 IO42 bidirectional MTMS, GPIO42.
39 TXD0 bidirectional U0TXD, GPIO43, CLK_OUT1; default output for ROM boot messages (U0TXD).
40 RXD0 bidirectional U0RXD, GPIO44, CLK_OUT2.
41 IO45 bidirectional GPIO45; strapping pin that selects VDD_SPI voltage, default pull-down (bit value 0).
42 GND power_in Ground.
43 GND power_in Ground.
44 IO46 input GPIO46; strapping pin for chip boot mode and ROM message printing, default pull-down (bit value 0).
45 EN input High: chip enabled (on); Low: chip powered off; do not leave the EN pin floating.
46 GND power_in Ground.
47 GND power_in Ground.
48 GND power_in Ground.
49 GND power_in Ground.
50 GND power_in Ground.
51 GND power_in Ground.
52 GND power_in Ground.
53 GND power_in Ground.
54 GND power_in Ground.
55 GND power_in Ground.
56 GND power_in Ground.
57 GND power_in Ground.
58 GND power_in Ground.
59 GND power_in Ground.
60 GND power_in Ground.
61 GND power_in Ground; this is the EPAD, and soldering it to the base-board ground is optional for thermal performance.
62 GND power_in Ground.
63 GND power_in Ground.
64 GND power_in Ground.
65 GND power_in Ground.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 65-SMD Module
Category RF and Wireless
Pins 65

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 3 3.3 3.6 V 15
Operating ambient temperature (85 °C version) TA -40 85 °C 85 °C version 15
Current delivered by external power supply IVDD 0.5 A 15
Power supply voltage (absolute maximum) VDD33 -0.3 3.6 V 15
Storage temperature TSTORE -40 105 °C 15
High-level input current IIH 50 nA 15
Low-level input current IIL 50 nA 15
TX EVM limit 802.11b 1 Mbps DSSS EVM -10 dB 802.11b, 1 Mbps, DSSS 18
TX EVM limit 802.11b 11 Mbps CCK EVM -10 dB 802.11b, 11 Mbps, CCK 18
TX EVM limit 802.11g 6 Mbps OFDM EVM -5 dB 802.11g, 6 Mbps, OFDM 18
TX EVM limit 802.11g 54 Mbps OFDM EVM -25 dB 802.11g, 54 Mbps, OFDM 18
TX EVM limit 802.11n HT20 MCS0 EVM -5 dB 802.11n, HT20, MCS0 18
TX EVM limit 802.11n HT20 MCS7 EVM -27 dB 802.11n, HT20, MCS7 18
TX EVM limit 802.11n HT40 MCS0 EVM -5 dB 802.11n, HT40, MCS0 18
TX EVM limit 802.11n HT40 MCS7 EVM -27 dB 802.11n, HT40, MCS7 18
Crystal oscillator frequency tolerance (40 MHz) -10 10 ppm 40 MHz crystal Y1 (schematic) 21

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 27
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 27
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 27

CAD (KiCad official)

  • Symbol: ESP32-S2-MINI-1U-N4R2
  • Footprint: PCM_Espressif:ESP32-S2-MINI-1U
  • 3D model: 65-SMD Module (KiCad packages3D, STEP)
  • 3D model files: esp32-s2-mini-1u-n4r2-etched.step / esp32-s2-mini-1u-n4r2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-s2-mini-1u-n4r2.step / esp32-s2-mini-1u-n4r2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (34 pp, sha256 06999476c9d1dede, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF