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ESP32-S2-MINI-1U-N4

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Espressif Systems RF and Wireless, 65-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-S2-MINI-1U-N4

Espressif Systems · RF and Wireless · 65-SMD Module

ESP32-S2-MINI-1U-N4 from Espressif Systems, in a 65-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
2 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
3 3V3 power_in Module power supply; the power supply voltage (VDD33) is 3.0 V minimum, 3.3 V typical and 3.6 V maximum.
4 IO0 bidirectional GPIO0 (also RTC_GPIO0); strapping pin for boot mode with GPIO46, with an internal pull-up that defaults to 1.
5 IO1 bidirectional GPIO1 (also RTC_GPIO1, TOUCH1, ADC1_CH0).
6 IO2 bidirectional GPIO2 (also RTC_GPIO2, TOUCH2, ADC1_CH1).
7 IO3 bidirectional GPIO3 (also RTC_GPIO3, TOUCH3, ADC1_CH2).
8 IO4 bidirectional GPIO4 (also RTC_GPIO4, TOUCH4, ADC1_CH3).
9 IO5 bidirectional GPIO5 (also RTC_GPIO5, TOUCH5, ADC1_CH4).
10 IO6 bidirectional GPIO6 (also RTC_GPIO6, TOUCH6, ADC1_CH5).
11 IO7 bidirectional GPIO7 (also RTC_GPIO7, TOUCH7, ADC1_CH6).
12 IO8 bidirectional GPIO8 (also RTC_GPIO8, TOUCH8, ADC1_CH7).
13 IO9 bidirectional GPIO9 (also RTC_GPIO9, TOUCH9, ADC1_CH8, FSPIHD).
14 IO10 bidirectional GPIO10 (also RTC_GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4).
15 IO11 bidirectional GPIO11 (also RTC_GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5).
16 IO12 bidirectional GPIO12 (also RTC_GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6).
17 IO13 bidirectional GPIO13 (also RTC_GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7).
18 IO14 bidirectional GPIO14 (also RTC_GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS).
19 IO15 bidirectional GPIO15 (also RTC_GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P).
20 IO16 bidirectional GPIO16 (also RTC_GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N).
21 IO17 bidirectional GPIO17 (also RTC_GPIO17, U1TXD, ADC2_CH6, DAC_1); DAC_1 is also the alternate ROM message output when EFUSE_UART_PRINT_CONTROL is 1.
22 IO18 bidirectional GPIO18 (also RTC_GPIO18, U1RXD, ADC2_CH7, DAC_2, CLK_OUT3).
23 IO19 bidirectional GPIO19 (also RTC_GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D-).
24 IO20 bidirectional GPIO20 (also RTC_GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+).
25 IO21 bidirectional GPIO21 (also RTC_GPIO21).
26 IO26 bidirectional GPIO26 (also SPICS1); used by the embedded PSRAM on the N4R2 variants and cannot be used for other purposes there, and the N4 variant has no PSRAM.
27 NC unconnected Not connected.
28 IO33 bidirectional GPIO33 (also SPIIO4, FSPIHD).
29 IO34 bidirectional GPIO34 (also SPIIO5, FSPICS0).
30 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
31 IO35 bidirectional GPIO35 (also SPIIO6, FSPID).
32 IO36 bidirectional GPIO36 (also SPIIO7, FSPICLK).
33 IO37 bidirectional GPIO37 (also SPIDQS, FSPIQ).
34 IO38 bidirectional GPIO38 (also FSPIWP).
35 IO39 bidirectional GPIO39 (also MTCK, CLK_OUT3).
36 IO40 bidirectional GPIO40 (also MTDO, CLK_OUT2).
37 IO41 bidirectional GPIO41 (also MTDI, CLK_OUT1).
38 IO42 bidirectional GPIO42 (also MTMS).
39 TXD0 bidirectional UART0 transmit (U0TXD, also GPIO43, CLK_OUT1); default output for ROM boot messages.
40 RXD0 bidirectional UART0 receive (U0RXD, also GPIO44, CLK_OUT2).
41 IO45 bidirectional GPIO45; strapping pin controlling VDD_SPI voltage at reset, with an internal pull-down that defaults to 0.
42 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
43 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
44 IO46 input GPIO46 input; strapping pin that, with GPIO0, controls boot mode and ROM message printing at reset, with an internal pull-down that defaults to 0.
45 EN input Chip enable: high enables the chip, low powers it off; do not leave the EN pin floating.
46 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
47 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
48 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
49 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
50 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
51 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
52 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
53 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
54 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
55 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
56 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
57 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
58 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
59 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
60 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
61 GND power_in Ground pin (the EPAD thermal pad position in the schematic); soldering it to the base board ground is optional and improves thermal performance.
62 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
63 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
64 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.
65 GND power_in Ground pin; pins 1, 2, 30, 42, 43 and 46-65 are all ground.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 65-SMD Module
Category RF and Wireless
Pins 65

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 3 3.3 3.6 V 15
Power supply voltage VDD33 -0.3 3.6 V 15
Storage temperature TSTORE -40 105 °C 15
Current delivered by external power supply IVDD 0.5 A 15
Operating ambient temperature TA -40 85 °C 85 °C version 15
High-level input current IIH 50 nA 15
Low-level input current IIL 50 nA 15
Pin capacitance CIN 2 pF 15
High-level source current IOH 40 mA VDD1 = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3 15
Low-level sink current IOL 28 mA VDD1 = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3 15
Pull-up resistor RPU 45 kΩ 15
Pull-down resistor RPD 45 kΩ 15
Current consumption for Wi-Fi TX peak 328 mA 802.11b, 1 Mbps, DSSS, @19.0 dBm 16
Current consumption for Wi-Fi TX peak 295 mA 802.11g, 54 Mbps, OFDM, @17.5 dBm 16
Current consumption for Wi-Fi TX peak 276 mA 802.11n, HT20, MCS7, @17.0 dBm 16
Current consumption for Wi-Fi TX peak 254 mA 802.11n, HT40, MCS7, @16.0 dBm 16
Current consumption for Wi-Fi RX 75 mA 802.11b/g/n, HT20 16
Current consumption for Wi-Fi RX 83 mA 802.11n, HT40 16
Modem-sleep current, CPU idle, all peripherals clocks disabled 20 mA CPU frequency 240 MHz 16
Modem-sleep current, CPU idle, all peripherals clocks enabled 28 mA CPU frequency 240 MHz 16
Modem-sleep current, CPU running, all peripherals clocks disabled 23 mA CPU frequency 240 MHz 16
Modem-sleep current, CPU running, all peripherals clocks enabled 32 mA CPU frequency 240 MHz 16
Light-sleep current 750 µA VDD_SPI and Wi-Fi powered down, all GPIOs high-impedance 17
Deep-sleep current, ULP-FSM 170 µA ULP co-processor powered on 17
Deep-sleep current, ULP-RISC-V 190 µA ULP co-processor powered on 17
Deep-sleep current, RTC timer + RTC memory 25 µA 17
Deep-sleep current, RTC timer only 20 µA 17
Power-off current 1 µA CHIP_PU set to low level 17

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 27
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 27
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 27

CAD (KiCad official)

  • Symbol: ESP32-S2-MINI-1U-N4
  • Footprint: PCM_Espressif:ESP32-S2-MINI-1U
  • 3D model: 65-SMD Module (KiCad packages3D, STEP)
  • 3D model files: esp32-s2-mini-1u-n4-etched.step / esp32-s2-mini-1u-n4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-s2-mini-1u-n4.step / esp32-s2-mini-1u-n4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (34 pp, sha256 06999476c9d1dede, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF