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ESP32-S2-MINI-1-N4R2

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Espressif Systems RF and Wireless, 65-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-S2-MINI-1-N4R2

Espressif Systems · RF and Wireless · 65-SMD Module

ESP32-S2-MINI-1-N4R2 from Espressif Systems, in a 65-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin; the datasheet lists GND on pins 1, 2, 30, 42, 43 and 46-65 as the module ground.
2 GND power_in Ground pin; the datasheet lists GND on pins 1, 2, 30, 42, 43 and 46-65 as the module ground.
3 3V3 power_in Module supply input; VDD33 is 3.0 V min, 3.3 V typ and 3.6 V max, and the external supply must deliver at least 0.5 A.
4 IO0 bidirectional RTC_GPIO0 / GPIO0; strapping pin for boot mode with GPIO46, pulled up by default at reset.
5 IO1 bidirectional RTC_GPIO1, GPIO1, TOUCH1 and ADC1_CH0 multifunction I/O.
6 IO2 bidirectional RTC_GPIO2, GPIO2, TOUCH2 and ADC1_CH1 multifunction I/O.
7 IO3 bidirectional RTC_GPIO3, GPIO3, TOUCH3 and ADC1_CH2 multifunction I/O.
8 IO4 bidirectional RTC_GPIO4, GPIO4, TOUCH4 and ADC1_CH3 multifunction I/O.
9 IO5 bidirectional RTC_GPIO5, GPIO5, TOUCH5 and ADC1_CH4 multifunction I/O.
10 IO6 bidirectional RTC_GPIO6, GPIO6, TOUCH6 and ADC1_CH5 multifunction I/O.
11 IO7 bidirectional RTC_GPIO7, GPIO7, TOUCH7 and ADC1_CH6 multifunction I/O.
12 IO8 bidirectional RTC_GPIO8, GPIO8, TOUCH8 and ADC1_CH7 multifunction I/O.
13 IO9 bidirectional RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8 and FSPIHD multifunction I/O.
14 IO10 bidirectional RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0 and FSPIIO4 multifunction I/O.
15 IO11 bidirectional RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID and FSPIIO5 multifunction I/O.
16 IO12 bidirectional RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK and FSPIIO6 multifunction I/O.
17 IO13 bidirectional RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ and FSPIIO7 multifunction I/O.
18 IO14 bidirectional RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP and FSPIDQS multifunction I/O.
19 IO15 bidirectional RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4 and XTAL_32K_P multifunction I/O.
20 IO16 bidirectional RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5 and XTAL_32K_N multifunction I/O.
21 IO17 bidirectional RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6 and DAC_1 multifunction I/O.
22 IO18 bidirectional RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, DAC_2 and CLK_OUT3 multifunction I/O.
23 IO19 bidirectional RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2 and USB_D- multifunction I/O.
24 IO20 bidirectional RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1 and USB_D+ multifunction I/O.
25 IO21 bidirectional RTC_GPIO21 and GPIO21 multifunction I/O.
26 IO26 bidirectional SPICS1 and GPIO26; used by the embedded PSRAM on ESP32-S2-MINI-1-N4R2 and cannot be used for other purposes.
27 NC unconnected No connection; listed as NC in the pin definitions.
28 IO33 bidirectional SPIIO4, GPIO33 and FSPIHD multifunction I/O.
29 IO34 bidirectional SPIIO5, GPIO34 and FSPICS0 multifunction I/O.
30 GND power_in Ground pin; part of the module ground set (pins 1, 2, 30, 42, 43 and 46-65).
31 IO35 bidirectional SPIIO6, GPIO35 and FSPID multifunction I/O.
32 IO36 bidirectional SPIIO7, GPIO36 and FSPICLK multifunction I/O.
33 IO37 bidirectional SPIDQS, GPIO37 and FSPIQ multifunction I/O.
34 IO38 bidirectional GPIO38 and FSPIWP multifunction I/O.
35 IO39 bidirectional MTCK, GPIO39 and CLK_OUT3 multifunction I/O.
36 IO40 bidirectional MTDO, GPIO40 and CLK_OUT2 multifunction I/O.
37 IO41 bidirectional MTDI, GPIO41 and CLK_OUT1 multifunction I/O.
38 IO42 bidirectional MTMS and GPIO42 multifunction I/O.
39 TXD0 bidirectional U0TXD, GPIO43 and CLK_OUT1; default pin for ROM message printing during boot.
40 RXD0 bidirectional U0RXD, GPIO44 and CLK_OUT2 multifunction I/O.
41 IO45 bidirectional GPIO45; strapping pin for VDD_SPI voltage, with an internal pull-down at reset.
42 GND power_in Ground pin; part of the module ground set (pins 1, 2, 30, 42, 43 and 46-65).
43 GND power_in Ground pin; part of the module ground set (pins 1, 2, 30, 42, 43 and 46-65).
44 IO46 input GPIO46 input; strapping pin that controls boot mode and ROM message printing, with an internal pull-down at reset.
45 EN input Chip enable: High turns the chip on, Low powers it off, and the pin must not be left floating.
46 GND power_in Ground pin; part of the module ground set (pins 46-65).
47 GND power_in Ground pin; part of the module ground set (pins 46-65).
48 GND power_in Ground pin; part of the module ground set (pins 46-65).
49 GND power_in Ground pin; part of the module ground set (pins 46-65).
50 GND power_in Ground pin; part of the module ground set (pins 46-65).
51 GND power_in Ground pin; part of the module ground set (pins 46-65).
52 GND power_in Ground pin; part of the module ground set (pins 46-65).
53 GND power_in Ground pin; part of the module ground set (pins 46-65).
54 GND power_in Ground pin; part of the module ground set (pins 46-65).
55 GND power_in Ground pin; part of the module ground set (pins 46-65).
56 GND power_in Ground pin; part of the module ground set (pins 46-65).
57 GND power_in Ground pin; part of the module ground set (pins 46-65).
58 GND power_in Ground pin; part of the module ground set (pins 46-65).
59 GND power_in Ground pin; part of the module ground set (pins 46-65).
60 GND power_in Ground pin; part of the module ground set (pins 46-65).
61 GND power_in Exposed thermal pad tied to ground; soldering it to the base board ground is optional and should use the correct amount of paste.
62 GND power_in Ground pin; part of the module ground set (pins 46-65).
63 GND power_in Ground pin; part of the module ground set (pins 46-65).
64 GND power_in Ground pin; part of the module ground set (pins 46-65).
65 GND power_in Ground pin; part of the module ground set (pins 46-65).

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 65-SMD Module
Category RF and Wireless
Pins 65

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 15
Storage temperature TSTORE -40 105 °C 15
Power supply voltage VDD33 3 3.3 3.6 V 15
Current delivered by external power supply IVDD 0.5 A 15
Operating ambient temperature TA -40 85 °C 85 °C version 15
Low-level input voltage VIL -0.3 V 15
High-level input current IIH 50 nA 15
Low-level input current IIL 50 nA 15
Chip reset voltage VIL_nRST -0.3 V 15

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 27
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 27
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 27

CAD (KiCad official)

  • Symbol: ESP32-S2-MINI-1-N4R2
  • Footprint: PCM_Espressif:ESP32-S2-MINI-1
  • 3D model: 65-SMD Module (KiCad packages3D, STEP)
  • 3D model files: esp32-s2-mini-1-n4r2-etched.step / esp32-s2-mini-1-n4r2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-s2-mini-1-n4r2.step / esp32-s2-mini-1-n4r2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (34 pp, sha256 06999476c9d1dede, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF