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ESP32-S2-MINI-1-N4

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Espressif Systems RF and Wireless, 56-VFQFN Exposed Pad. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-S2-MINI-1-N4

Espressif Systems · RF and Wireless · 56-VFQFN Exposed Pad

ESP32-S2-MINI-1-N4 from Espressif Systems, in a 56-VFQFN Exposed Pad. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground.
2 GND power_in Ground.
3 3V3 power_in Power supply, recommended 3.0 to 3.6 V (3.3 V typ), with at least 0.5 A delivered by the external supply.
4 IO0 bidirectional RTC_GPIO0/GPIO0; strapping pin (default pull-up) that selects SPI boot when 1 and Download Boot when 0 together with GPIO46.
5 IO1 bidirectional General-purpose I/O with functions RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0.
6 IO2 bidirectional General-purpose I/O with functions RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1.
7 IO3 bidirectional General-purpose I/O with functions RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2.
8 IO4 bidirectional General-purpose I/O with functions RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3.
9 IO5 bidirectional General-purpose I/O with functions RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4.
10 IO6 bidirectional General-purpose I/O with functions RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5.
11 IO7 bidirectional General-purpose I/O with functions RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6.
12 IO8 bidirectional General-purpose I/O with functions RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7.
13 IO9 bidirectional General-purpose I/O with functions RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD.
14 IO10 bidirectional General-purpose I/O with functions RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4.
15 IO11 bidirectional General-purpose I/O with functions RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5.
16 IO12 bidirectional General-purpose I/O with functions RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6.
17 IO13 bidirectional General-purpose I/O with functions RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7.
18 IO14 bidirectional General-purpose I/O with functions RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS.
19 IO15 bidirectional General-purpose I/O with functions RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P.
20 IO16 bidirectional General-purpose I/O with functions RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N.
21 IO17 bidirectional General-purpose I/O with functions RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6, DAC_1.
22 IO18 bidirectional General-purpose I/O with functions RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, DAC_2, CLK_OUT3.
23 IO19 bidirectional General-purpose I/O with functions RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB D-.
24 IO20 bidirectional General-purpose I/O with functions RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB D+.
25 IO21 bidirectional General-purpose I/O with functions RTC_GPIO21, GPIO21.
26 IO26 bidirectional SPICS1/GPIO26; used by the embedded PSRAM only on the N4R2 variants, so it is a usable GPIO on the -N4 module.
27 NC unconnected No connection.
28 IO33 bidirectional General-purpose I/O with functions SPIIO4, GPIO33, FSPIHD.
29 IO34 bidirectional General-purpose I/O with functions SPIIO5, GPIO34, FSPICS0.
30 GND power_in Ground.
31 IO35 bidirectional General-purpose I/O with functions SPIIO6, GPIO35, FSPID.
32 IO36 bidirectional General-purpose I/O with functions SPIIO7, GPIO36, FSPICLK.
33 IO37 bidirectional General-purpose I/O with functions SPIDQS, GPIO37, FSPIQ.
34 IO38 bidirectional General-purpose I/O with functions GPIO38, FSPIWP.
35 IO39 bidirectional General-purpose I/O with functions MTCK, GPIO39, CLK_OUT3.
36 IO40 bidirectional General-purpose I/O with functions MTDO, GPIO40, CLK_OUT2.
37 IO41 bidirectional General-purpose I/O with functions MTDI, GPIO41, CLK_OUT1.
38 IO42 bidirectional General-purpose I/O with functions MTMS, GPIO42.
39 TXD0 bidirectional UART0 transmit U0TXD / GPIO43 / CLK_OUT1; also the default ROM message output.
40 RXD0 bidirectional UART0 receive U0RXD / GPIO44 / CLK_OUT2.
41 IO45 bidirectional GPIO45; strapping pin (default pull-down) that selects the VDD_SPI voltage.
42 GND power_in Ground.
43 GND power_in Ground.
44 IO46 input GPIO46 input only; strapping pin (default pull-down) that controls boot mode together with GPIO0 and ROM message printing.
45 EN input Chip enable: high turns the chip on, low powers it off; do not leave floating.
46 GND power_in Ground.
47 GND power_in Ground.
48 GND power_in Ground.
49 GND power_in Ground.
50 GND power_in Ground.
51 GND power_in Ground.
52 GND power_in Ground.
53 GND power_in Ground.
54 GND power_in Ground.
55 GND power_in Ground.
56 GND power_in Ground.
57 GND power_in Ground.
58 GND power_in Ground.
59 GND power_in Ground.
60 GND power_in Ground.
61 GND power_in Ground; this is the EPAD, and soldering it to the base board ground is optional but improves thermal performance.
62 GND power_in Ground.
63 GND power_in Ground.
64 GND power_in Ground.
65 GND power_in Ground.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 56-VFQFN Exposed Pad
Category RF and Wireless
Pins 65

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 15
Storage temperature TSTORE -40 105 °C 15
Power supply voltage VDD33 3 3.3 3.6 V 15
Current delivered by external power supply IVDD 0.5 A 15
Operating ambient temperature (85 °C version) TA -40 85 °C 85 °C version 15
High-level input current IIH 50 nA 15
Low-level input current IIL 50 nA 15

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 27
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 27
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 27

CAD (KiCad official)

  • Symbol: ESP32-S2-MINI-1-N4
  • Footprint: PCM_Espressif:ESP32-S2-MINI-1
  • 3D model: 56-VFQFN Exposed Pad (KiCad packages3D, STEP)
  • 3D model files: esp32-s2-mini-1-n4-etched.step / esp32-s2-mini-1-n4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-s2-mini-1-n4.step / esp32-s2-mini-1-n4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (34 pp, sha256 06999476c9d1dede, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF