# ESP32-H2-MINI-1U-H4S

**Espressif Systems** · RF and Wireless · 61-SMD Module

ESP32-H2-MINI-1U-H4S from Espressif Systems, in a 61-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin of the module. |
| 2 | GND | power_in | Ground pin of the module. |
| 3 | 3V3 | power_in | Module power supply input; VDD33 recommended range is 3.0 to 3.6 V (typical 3.3 V), with absolute maximum rating -0.3 to 3.6 V. |
| 4 | NC | unconnected | Marked NC in Table 3; no function is assigned to this pin. |
| 5 | IO2 | bidirectional | GPIO2, also FSPIWP, ADC1_CH1 and MTMS; general-purpose I/O (I/O/T, high impedance). |
| 6 | IO3 | bidirectional | GPIO3, also FSPIHD, ADC1_CH2 and MTDO; general-purpose I/O (I/O/T, high impedance). |
| 7 | NC | unconnected | Marked NC in Table 3; no function is assigned to this pin. |
| 8 | EN | input | Chip enable: High turns the chip on, Low powers the chip off; the EN pin must not be left floating. |
| 9 | IO0 | bidirectional | GPIO0, also FSPIQ; general-purpose I/O (I/O/T, high impedance). |
| 10 | IO1 | bidirectional | GPIO1, also FSPICS0 and ADC1_CH0; general-purpose I/O (I/O/T, high impedance). |
| 11 | GND | power_in | Ground pin of the module. |
| 12 | IO13 | bidirectional | GPIO13, also XTAL_32K_P; general-purpose I/O (I/O/T, high impedance). |
| 13 | IO14 | bidirectional | GPIO14, also XTAL_32K_N; general-purpose I/O (I/O/T, high impedance). |
| 14 | GND | power_in | Ground pin of the module. |
| 15 | VBAT | power_in | Connected to the internal 3V3 supply by default, or to an external battery supply of 3.0 to 3.6 V. |
| 16 | IO12 | bidirectional | GPIO12; general-purpose I/O (I/O/T, high impedance). |
| 17 | NC | unconnected | Marked NC in Table 3; no function is assigned to this pin. |
| 18 | IO4 | bidirectional | GPIO4, also FSPICLK, ADC1_CH3 and MTCK; general-purpose I/O (I/O/T, high impedance). |
| 19 | IO5 | bidirectional | GPIO5, also FSPID, ADC1_CH4 and MTDI; general-purpose I/O (I/O/T, high impedance). |
| 20 | IO10 | bidirectional | GPIO10, also ZCD0; general-purpose I/O (I/O/T, high impedance) and analog pad comparator input. |
| 21 | IO11 | bidirectional | GPIO11, also ZCD1; general-purpose I/O (I/O/T, high impedance) and analog pad comparator input. |
| 22 | IO8 | bidirectional | GPIO8; strapping pin that sets chip boot mode together with GPIO9 and controls ROM message printing. |
| 23 | IO9 | bidirectional | GPIO9; strapping pin for chip boot mode control, with a weak pull-up by default. |
| 24 | IO22 | bidirectional | GPIO22; general-purpose I/O (I/O/T, high impedance). |
| 25 | IO25 | bidirectional | GPIO25, also FSPICS3; strapping pin for JTAG signal source control. |
| 26 | IO26 | bidirectional | GPIO26, also FSPICS4 and USB_D-; general-purpose I/O (I/O/T, high impedance). |
| 27 | IO27 | bidirectional | GPIO27, also FSPICS5 and USB_D+; general-purpose I/O (I/O/T, high impedance). |
| 28 | NC | unconnected | Marked NC in Table 3; no function is assigned to this pin. |
| 29 | NC | unconnected | Marked NC in Table 3; no function is assigned to this pin. |
| 30 | RXD0 | bidirectional | GPIO23, also FSPICS1 and U0RXD (UART0 receive); I/O/T, high impedance. |
| 31 | TXD0 | bidirectional | GPIO24, also FSPICS2 and U0TXD (UART0 transmit); I/O/T, high impedance. |
| 32 | NC | unconnected | Marked NC in Table 3; no function is assigned to this pin. |
| 33 | NC | unconnected | Marked NC in Table 3; no function is assigned to this pin. |
| 34 | NC | unconnected | Marked NC in Table 3; no function is assigned to this pin. |
| 35 | NC | unconnected | Marked NC in Table 3; no function is assigned to this pin. |
| 36 | GND | power_in | Ground pin of the module. |
| 37 | GND | power_in | Ground pin of the module. |
| 38 | GND | power_in | Ground pin of the module. |
| 39 | GND | power_in | Ground pin of the module. |
| 40 | GND | power_in | Ground pin of the module. |
| 41 | GND | power_in | Ground pin of the module. |
| 42 | GND | power_in | Ground pin of the module. |
| 43 | GND | power_in | Ground pin of the module. |
| 44 | GND | power_in | Ground pin of the module. |
| 45 | GND | power_in | Ground pin of the module. |
| 46 | GND | power_in | Ground pin of the module. |
| 47 | GND | power_in | Ground pin of the module. |
| 48 | GND | power_in | Ground pin of the module. |
| 49 | GND | power_in | Ground pin of the module (EPAD); soldering it to base-board ground is optional but improves thermal performance. |
| 50 | GND | power_in | Ground pin of the module. |
| 51 | GND | power_in | Ground pin of the module. |
| 52 | GND | power_in | Ground pin of the module. |
| 53 | GND | power_in | Ground pin of the module. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Espressif Systems |
| Package | 61-SMD Module |
| Category | RF and Wireless |
| Pins | 53 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage | VDD33 | -0.3 |  | 3.6 | V |  | 24 |
| Storage temperature | TST ORE | -40 |  | 105 | °C |  | 24 |
| Power supply voltage | VDD33 | 3 | 3.3 | 3.6 | V |  | 24 |
| Current delivered by external power supply | IVDD | 0.35 |  |  | A |  | 24 |
| Operating ambient temperature | TA | -40 |  | 105 | °C |  | 24 |
| High-level input current | IIH |  |  | 50 | nA |  | 24 |
| Low-level input current | IIL |  |  | 50 | nA |  | 24 |
| Low-level input voltage | VIL | -0.3 |  |  | V |  | 24 |
| Chip reset voltage | VIL_nRST | -0.3 |  |  | V |  | 24 |
| Bluetooth LE RF transmit power range |  | -24 |  | 20 | dBm | Bluetooth LE | 27 |
| Sensitivity |  |  |  | -98 | dBm | Bluetooth LE 1 Mbps, @30.8% PER | 29 |
| Maximum received signal |  |  |  | 8 | dBm | Bluetooth LE 1 Mbps, @30.8% PER | 29 |
| Sensitivity |  |  |  | -95 | dBm | Bluetooth LE 2 Mbps, @30.8% PER | 29 |
| Sensitivity |  |  |  | -105.5 | dBm | Bluetooth LE 125 Kbps, @30.8% PER | 30 |
| Sensitivity |  |  |  | -101.5 | dBm | Bluetooth LE 500 Kbps, @30.8% PER | 30 |
| 802.15.4 RF transmit power range |  | -24 |  | 20 | dBm | 802.15.4 250 Kbps | 31 |
| Sensitivity |  |  |  | -101.5 | dBm | 802.15.4 250 Kbps, @1% PER | 31 |
| Maximum received signal |  |  |  | 8 | dBm | 802.15.4 250 Kbps, @1% PER | 31 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | THERMOPLASTIC |  | HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; | 36 |
| contacts | COPPER ALLOY | gold | CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 36 |
| shell | COPPER ALLOY | gold | SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 36 |

## CAD (KiCad official)

- Symbol: `ESP32-H2-MINI-1U-H4S`
- Footprint: `PCM_Espressif:ESP32-H2-MINI-1U`
- 3D model: 61-SMD Module (KiCad packages3D, STEP)
- 3D model files: `esp32-h2-mini-1u-h4s-etched.step` / `esp32-h2-mini-1u-h4s-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esp32-h2-mini-1u-h4s.step` / `esp32-h2-mini-1u-h4s.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Espressif Systems datasheet](https://www.espressif.com/sites/default/files/documentation/esp32-h2-mini-1_mini-1u_datasheet_en.pdf) (45 pp, sha256 `33f21dd6428aa348`, retrieved 2026-10-28, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/esp32-h2-mini-1u-h4s-datasheet.pdf)