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ESP32-H2-MINI-1-N2

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by adom

Espressif Systems RF and Wireless, 53-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-H2-MINI-1-N2

Espressif Systems · RF and Wireless · 53-SMD Module

ESP32-H2-MINI-1-N2 from Espressif Systems, in a 53-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin of the module.
2 GND power_in Ground pin of the module.
3 3V3 power_in Power supply pin; the recommended VDD33 supply range is 3.0 to 3.6 V (3.3 V typical) with an absolute maximum of 3.6 V.
4 NC unconnected Not connected.
5 IO2 bidirectional GPIO2, also FSPIWP, ADC1_CH1 and MTMS; a high-impedance I/O/T pad.
6 IO3 bidirectional GPIO3, also FSPIHD, ADC1_CH2 and MTDO; a high-impedance I/O/T pad.
7 NC unconnected Not connected.
8 EN input Chip enable: high turns the chip on and low powers it off; do not leave this pin floating.
9 IO0 bidirectional GPIO0, also FSPIQ; a high-impedance I/O/T pad.
10 IO1 bidirectional GPIO1, also FSPICS0 and ADC1_CH0; a high-impedance I/O/T pad.
11 GND power_in Ground pin of the module.
12 IO13 bidirectional GPIO13, also XTAL_32K_P; a high-impedance I/O/T pad.
13 IO14 bidirectional GPIO14, also XTAL_32K_N; a high-impedance I/O/T pad.
14 GND power_in Ground pin of the module.
15 VBAT power_in Connected to the internal 3V3 supply by default, or to an external battery supply of 3.0 to 3.6 V.
16 IO12 bidirectional GPIO12; a high-impedance I/O/T pad.
17 NC unconnected Not connected.
18 IO4 bidirectional GPIO4, also FSPICLK, ADC1_CH3 and MTCK; a high-impedance I/O/T pad.
19 IO5 bidirectional GPIO5, also FSPID, ADC1_CH4 and MTDI; a high-impedance I/O/T pad.
20 IO10 bidirectional GPIO10, also ZCD0; a high-impedance I/O/T pad.
21 IO11 bidirectional GPIO11, also ZCD1; a high-impedance I/O/T pad.
22 IO8 bidirectional GPIO8, a strapping pin for chip boot mode and ROM message printing; a high-impedance I/O/T pad.
23 IO9 bidirectional GPIO9, a strapping pin for chip boot mode (weak pull-up by default); a high-impedance I/O/T pad.
24 IO22 bidirectional GPIO22; a high-impedance I/O/T pad.
25 IO25 bidirectional GPIO25, also FSPICS3, and a JTAG signal-source strapping pin; a high-impedance I/O/T pad.
26 IO26 bidirectional GPIO26, also FSPICS4 and USB_D- (the USB_D- name is cut off in the extracted text); a high-impedance I/O/T pad.
27 IO27 bidirectional GPIO27, also FSPICS5 and USB_D+; a high-impedance I/O/T pad.
28 NC unconnected Not connected.
29 NC unconnected Not connected.
30 RXD0 bidirectional GPIO23, also FSPICS1 and U0RXD (UART0 receive); a high-impedance I/O/T pad.
31 TXD0 bidirectional GPIO24, also FSPICS2 and U0TXD (UART0 transmit); a high-impedance I/O/T pad.
32 NC unconnected Not connected.
33 NC unconnected Not connected.
34 NC unconnected Not connected.
35 NC unconnected Not connected.
36 GND power_in Ground pin of the module.
37 GND power_in Ground pin of the module.
38 GND power_in Ground pin of the module.
39 GND power_in Ground pin of the module.
40 GND power_in Ground pin of the module.
41 GND power_in Ground pin of the module.
42 GND power_in Ground pin of the module.
43 GND power_in Ground pin of the module.
44 GND power_in Ground pin of the module.
45 GND power_in Ground pin of the module.
46 GND power_in Ground pin of the module.
47 GND power_in Ground pin of the module.
48 GND power_in Ground pin of the module.
49 GND power_in Ground pin of the module (the schematic labels this pad as EPAD; soldering it is optional but improves thermal performance).
50 GND power_in Ground pin of the module.
51 GND power_in Ground pin of the module.
52 GND power_in Ground pin of the module.
53 GND power_in Ground pin of the module.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 53-SMD Module
Category RF and Wireless
Pins 53

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 36
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36

CAD (KiCad official)

  • Symbol: ESP32-H2-MINI-1-N2
  • Footprint: PCM_Espressif:ESP32-H2-MINI-1
  • 3D model: 53-SMD Module (KiCad packages3D, STEP)
  • 3D model files: esp32-h2-mini-1-n2-etched.step / esp32-h2-mini-1-n2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-h2-mini-1-n2.step / esp32-h2-mini-1-n2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (45 pp, sha256 33f21dd6428aa348, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF