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ESP32-H2-MINI-1-H4S

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Espressif Systems RF and Wireless, 61-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-H2-MINI-1-H4S

Espressif Systems · RF and Wireless · 61-SMD Module

ESP32-H2-MINI-1-H4S from Espressif Systems, in a 61-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground.
2 GND power_in Ground.
3 3V3 power_in Power supply; module operating voltage is 3.0~3.6 V.
4 NC unconnected No connection.
5 IO2 bidirectional GPIO2, FSPIWP, ADC1_CH1, MTMS (JTAG).
6 IO3 bidirectional GPIO3, FSPIHD, ADC1_CH2, MTDO (JTAG).
7 NC unconnected No connection.
8 EN input High enables the chip, low powers the chip off; do not leave the EN pin floating.
9 IO0 bidirectional GPIO0, FSPIQ.
10 IO1 bidirectional GPIO1, FSPICS0, ADC1_CH0.
11 GND power_in Ground.
12 IO13 bidirectional GPIO13, XTAL_32K_P.
13 IO14 bidirectional GPIO14, XTAL_32K_N.
14 GND power_in Ground.
15 VBAT power_in Connected to internal 3V3 power supply (default) or external battery power supply (3.0~3.6 V).
16 IO12 bidirectional GPIO12.
17 NC unconnected No connection.
18 IO4 bidirectional GPIO4, FSPICLK, ADC1_CH3, MTCK (JTAG).
19 IO5 bidirectional GPIO5, FSPID, ADC1_CH4, MTDI (JTAG).
20 IO10 bidirectional GPIO10, ZCD0.
21 IO11 bidirectional GPIO11, ZCD1.
22 IO8 bidirectional GPIO8, strapping pin for boot mode and ROM message printing (default floating).
23 IO9 bidirectional GPIO9, strapping pin for boot mode (default weak pull-up; low selects Joint Download Boot).
24 IO22 bidirectional GPIO22.
25 IO25 bidirectional GPIO25, FSPICS3; strapping pin for JTAG signal source (no internal pull resistors).
26 IO26 bidirectional GPIO26, FSPICS4, USB_D-.
27 IO27 bidirectional GPIO27, FSPICS5, USB_D+.
28 NC unconnected No connection.
29 NC unconnected No connection.
30 RXD0 bidirectional GPIO23, FSPICS1, U0RXD.
31 TXD0 bidirectional GPIO24, FSPICS2, U0TXD.
32 NC unconnected No connection.
33 NC unconnected No connection.
34 NC unconnected No connection.
35 NC unconnected No connection.
36 GND power_in Ground.
37 GND power_in Ground.
38 GND power_in Ground.
39 GND power_in Ground.
40 GND power_in Ground.
41 GND power_in Ground.
42 GND power_in Ground.
43 GND power_in Ground.
44 GND power_in Ground.
45 GND power_in Ground.
46 GND power_in Ground.
47 GND power_in Ground.
48 GND power_in Ground.
49 GND power_in Ground; shown as EPAD in the schematic, soldering it to base-board ground is optional but improves thermal performance.
50 GND power_in Ground.
51 GND power_in Ground.
52 GND power_in Ground.
53 GND power_in Ground.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 61-SMD Module
Category RF and Wireless
Pins 53

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 24
Storage temperature TSTORE -40 105 °C 24
Power supply voltage VDD33 3 3.3 3.6 V 24
Current delivered by external power supply IVDD 0.35 A 24
Operating ambient temperature TA -40 105 °C 24
Low-level input voltage VIL -0.3 V 24
Chip reset voltage VIL_nRST -0.3 V 24
High-level input current IIH 50 nA 24
Low-level input current IIL 50 nA 24

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 36
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36

CAD (KiCad official)

  • Symbol: ESP32-H2-MINI-1-H4S
  • Footprint: PCM_Espressif:ESP32-H2-MINI-1
  • 3D model: 61-SMD Module (KiCad packages3D, STEP)
  • 3D model files: esp32-h2-mini-1-h4s-etched.step / esp32-h2-mini-1-h4s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-h2-mini-1-h4s.step / esp32-h2-mini-1-h4s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (45 pp, sha256 33f21dd6428aa348, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF