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ESP32-H2-MINI-1-H4

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Espressif Systems RF and Wireless, 61-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-H2-MINI-1-H4

Espressif Systems · RF and Wireless · 61-SMD Module

ESP32-H2-MINI-1-H4 from Espressif Systems, in a 61-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground.
2 GND power_in Ground.
3 3V3 power_in Power supply; VDD33 recommended operating range is 3.0 to 3.6 V with 3.3 V typical.
4 NC unconnected Marked NC in Table 3; no function is assigned.
5 IO2 bidirectional GPIO2 with alternate functions FSPIWP, ADC1_CH1 and MTMS.
6 IO3 bidirectional GPIO3 with alternate functions FSPIHD, ADC1_CH2 and MTDO.
7 NC unconnected Marked NC in Table 3; no function is assigned.
8 EN input High enables the chip and low powers it off; do not leave the EN pin floating.
9 IO0 bidirectional GPIO0 with alternate function FSPIQ.
10 IO1 bidirectional GPIO1 with alternate functions FSPICS0 and ADC1_CH0.
11 GND power_in Ground.
12 IO13 bidirectional GPIO13 with alternate function XTAL_32K_P.
13 IO14 bidirectional GPIO14 with alternate function XTAL_32K_N.
14 GND power_in Ground.
15 VBAT power_in Connected to internal 3V3 power supply by default, or to an external battery power supply of 3.0 to 3.6 V.
16 IO12 bidirectional GPIO12.
17 NC unconnected Marked NC in Table 3; no function is assigned.
18 IO4 bidirectional GPIO4 with alternate functions FSPICLK, ADC1_CH3 and MTCK.
19 IO5 bidirectional GPIO5 with alternate functions FSPID, ADC1_CH4 and MTDI.
20 IO10 bidirectional GPIO10 with alternate function ZCD0.
21 IO11 bidirectional GPIO11 with alternate function ZCD1.
22 IO8 bidirectional GPIO8, which is also a chip boot mode strapping pin.
23 IO9 bidirectional GPIO9, which is also a chip boot mode strapping pin with a weak pull-up by default.
24 IO22 bidirectional GPIO22.
25 IO25 bidirectional GPIO25 with alternate function FSPICS3; also the JTAG signal source strapping pin.
26 IO26 bidirectional GPIO26 with alternate functions FSPICS4 and USB_D-.
27 IO27 bidirectional GPIO27 with alternate functions FSPICS5 and USB_D+.
28 NC unconnected Marked NC in Table 3; no function is assigned.
29 NC unconnected Marked NC in Table 3; no function is assigned.
30 RXD0 bidirectional Pin named RXD0 carrying GPIO23 with alternate functions FSPICS1 and U0RXD.
31 TXD0 bidirectional Pin named TXD0 carrying GPIO24 with alternate functions FSPICS2 and U0TXD.
32 NC unconnected Marked NC in Table 3; no function is assigned.
33 NC unconnected Marked NC in Table 3; no function is assigned.
34 NC unconnected Marked NC in Table 3; no function is assigned.
35 NC unconnected Marked NC in Table 3; no function is assigned.
36 GND power_in Ground.
37 GND power_in Ground.
38 GND power_in Ground.
39 GND power_in Ground.
40 GND power_in Ground.
41 GND power_in Ground.
42 GND power_in Ground.
43 GND power_in Ground.
44 GND power_in Ground.
45 GND power_in Ground.
46 GND power_in Ground.
47 GND power_in Ground.
48 GND power_in Ground.
49 GND power_in Ground; the datasheet notes soldering this EPAD to the base board ground is optional but improves thermal performance.
50 GND power_in Ground.
51 GND power_in Ground.
52 GND power_in Ground.
53 GND power_in Ground.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 61-SMD Module
Category RF and Wireless
Pins 53

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 24
Storage temperature TSTORE -40 105 °C 24
Power supply voltage VDD33 3 3.3 3.6 V 24
Current delivered by external power supply IVDD 0.35 A 24
Operating ambient temperature TA -40 105 °C 24
Low-level input voltage VIL -0.3 V DC Characteristics (3.3 V, 25 °C) 24
Chip reset voltage VIL_nRST -0.3 V DC Characteristics (3.3 V, 25 °C) 24
High-level input current IIH 50 nA DC Characteristics (3.3 V, 25 °C) 24
Low-level input current IIL 50 nA DC Characteristics (3.3 V, 25 °C) 24

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 36
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36

CAD (KiCad official)

  • Symbol: ESP32-H2-MINI-1-H4
  • Footprint: PCM_Espressif:ESP32-H2-MINI-1
  • 3D model: 61-SMD Module (KiCad packages3D, STEP)
  • 3D model files: esp32-h2-mini-1-h4-etched.step / esp32-h2-mini-1-h4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-h2-mini-1-h4.step / esp32-h2-mini-1-h4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (45 pp, sha256 33f21dd6428aa348, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF