component
ESP32-H2-MINI-1-H2S
Public Made by Adomby adom
Espressif Systems RF and Wireless, 61-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20251024
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| esp32-h2-mini-1-h2s-etched.step | 19h ago |
| esp32-h2-mini-1-h2s.glb | 19h ago |
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ESP32-H2-MINI-1-H2S
Espressif Systems · RF and Wireless · 61-SMD Module
ESP32-H2-MINI-1-H2S from Espressif Systems, in a 61-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 2 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 3 | 3V3 | power_in | Power supply pin; the recommended supply voltage is 3.0 to 3.6 V (typ. 3.3 V). |
| 4 | NC | unconnected | Not connected (NC) per Table 3. |
| 5 | IO2 | bidirectional | GPIO2, also multiplexed as FSPIWP, ADC1_CH1 and MTMS; I/O/T pin with high-impedance state. |
| 6 | IO3 | bidirectional | GPIO3, also multiplexed as FSPIHD, ADC1_CH2 and MTDO; I/O/T pin with high-impedance state. |
| 7 | NC | unconnected | Not connected (NC) per Table 3. |
| 8 | EN | input | Chip enable: high enables the chip, low powers the chip off; the pin must not be left floating. |
| 9 | IO0 | bidirectional | GPIO0, also multiplexed as FSPIQ; I/O/T pin with high-impedance state. |
| 10 | IO1 | bidirectional | GPIO1, also multiplexed as FSPICS0 and ADC1_CH0; I/O/T pin with high-impedance state. |
| 11 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 12 | IO13 | bidirectional | GPIO13, also multiplexed as XTAL_32K_P; I/O/T pin with high-impedance state. |
| 13 | IO14 | bidirectional | GPIO14, also multiplexed as XTAL_32K_N; I/O/T pin with high-impedance state. |
| 14 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 15 | VBAT | power_in | Connected to the internal 3V3 supply (default) or to an external battery supply of 3.0 to 3.6 V. |
| 16 | IO12 | bidirectional | GPIO12; I/O/T pin with high-impedance state. |
| 17 | NC | unconnected | Not connected (NC) per Table 3. |
| 18 | IO4 | bidirectional | GPIO4, also multiplexed as FSPICLK, ADC1_CH3 and MTCK; I/O/T pin with high-impedance state. |
| 19 | IO5 | bidirectional | GPIO5, also multiplexed as FSPID, ADC1_CH4 and MTDI; I/O/T pin with high-impedance state. |
| 20 | IO10 | bidirectional | GPIO10, also multiplexed as ZCD0; I/O/T pin with high-impedance state. |
| 21 | IO11 | bidirectional | GPIO11, also multiplexed as ZCD1; I/O/T pin with high-impedance state. |
| 22 | IO8 | bidirectional | GPIO8, which is also a boot strapping pin (chip boot mode and ROM message control); I/O/T pin with high-impedance state. |
| 23 | IO9 | bidirectional | GPIO9, which is also a boot strapping pin (chip boot mode control); weak pull-up by default; I/O/T pin with high-impedance state. |
| 24 | IO22 | bidirectional | GPIO22; I/O/T pin with high-impedance state. |
| 25 | IO25 | bidirectional | GPIO25, also multiplexed as FSPICS3 and the JTAG source strapping pin; I/O/T pin with high-impedance state. |
| 26 | IO26 | bidirectional | GPIO26, also multiplexed as FSPICS4 and USB_D-; I/O/T pin with high-impedance state. |
| 27 | IO27 | bidirectional | GPIO27, also multiplexed as FSPICS5 and USB_D+; I/O/T pin with high-impedance state. |
| 28 | NC | unconnected | Not connected (NC) per Table 3. |
| 29 | NC | unconnected | Not connected (NC) per Table 3. |
| 30 | RXD0 | bidirectional | GPIO23, also multiplexed as FSPICS1 and U0RXD (UART0 receive); I/O/T pin with high-impedance state. |
| 31 | TXD0 | bidirectional | GPIO24, also multiplexed as FSPICS2 and U0TXD (UART0 transmit); I/O/T pin with high-impedance state. |
| 32 | NC | unconnected | Not connected (NC) per Table 3. |
| 33 | NC | unconnected | Not connected (NC) per Table 3. |
| 34 | NC | unconnected | Not connected (NC) per Table 3. |
| 35 | NC | unconnected | Not connected (NC) per Table 3. |
| 36 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 37 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 38 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 39 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 40 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 41 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 42 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 43 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 44 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 45 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 46 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 47 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 48 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 49 | GND | power_in | Ground pin of the module (exposed pad); soldering it to base-board ground is optional but improves thermal performance. |
| 50 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 51 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 52 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
| 53 | GND | power_in | Ground pin of the module; connect to the base-board ground plane. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Espressif Systems |
| Package | 61-SMD Module |
| Category | RF and Wireless |
| Pins | 53 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage | VDD33 | -0.3 | 3.6 | V | 24 | ||
| Storage temperature | TSTORE | -40 | 105 | °C | 24 | ||
| Power supply voltage | VDD33 | 3 | 3.3 | 3.6 | V | 24 | |
| Current delivered by external power supply | IVDD | 0.35 | A | 24 | |||
| Operating ambient temperature | TA | -40 | 105 | °C | 24 | ||
| Low-level input voltage | VIL | -0.3 | V | 24 | |||
| High-level input current | IIH | 50 | nA | 24 | |||
| Low-level input current | IIL | 50 | nA | 24 | |||
| Chip reset voltage | VIL_nRST | -0.3 | V | 24 | |||
| Sensitivity (Bluetooth LE 1 Mbps) | -98 | dBm | @30.8% PER | 29 | |||
| Maximum received signal (Bluetooth LE 1 Mbps) | 8 | dBm | @30.8% PER | 29 | |||
| Sensitivity (Bluetooth LE 2 Mbps) | -95 | dBm | @30.8% PER | 29 | |||
| Maximum received signal (Bluetooth LE 2 Mbps) | 8 | dBm | @30.8% PER | 29 | |||
| Sensitivity (Bluetooth LE 125 Kbps) | -105.5 | dBm | @30.8% PER | 30 | |||
| Maximum received signal (Bluetooth LE 125 Kbps) | 8 | dBm | @30.8% PER | 30 | |||
| Sensitivity (Bluetooth LE 500 Kbps) | -101.5 | dBm | @30.8% PER | 30 | |||
| Maximum received signal (Bluetooth LE 500 Kbps) | 8 | dBm | @30.8% PER | 30 | |||
| Sensitivity (802.15.4 250 Kbps) | -101.5 | dBm | @1% PER | 31 | |||
| Maximum received signal (802.15.4 250 Kbps) | 8 | dBm | @1% PER | 31 | |||
| RF transmit power range (802.15.4 250 Kbps) | -24 | 20 | dBm | 31 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | THERMOPLASTIC | HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; | 36 | |
| contacts | COPPER ALLOY | gold | CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 36 |
| shell | COPPER ALLOY | gold | SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 36 |
CAD (KiCad official)
- Symbol:
ESP32-H2-MINI-1-H2S - Footprint:
PCM_Espressif:ESP32-H2-MINI-1 - 3D model: 61-SMD Module (KiCad packages3D, STEP)
- 3D model files:
esp32-h2-mini-1-h2s-etched.step/esp32-h2-mini-1-h2s-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esp32-h2-mini-1-h2s.step/esp32-h2-mini-1-h2s.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Espressif Systems datasheet (45 pp, sha256
33f21dd6428aa348, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).