component
ESP32-C6-WROOM-1-N4
Public Made by Adomby adom
ESPRESSIF INC WiFi Modules, SMD-28P. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
ESP32-C6-WROOM-1-N4
ESPRESSIF INC · WiFi Modules · SMD-28P
ESP32-C6-WROOM-1-N4 from ESPRESSIF INC, in a SMD-28P. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin of the module. |
| 2 | 3V3 | power_in | Power supply pin; the datasheet's recommended operating range for the module supply (VDD33) is 3.0 V to 3.6 V with a 3.3 V typical value. |
| 3 | EN | input | Chip enable: high turns the chip on and low powers it off, and the pin must not be left floating. |
| 4 | IO4 | bidirectional | GPIO4 with alternate functions MTMS, LP_GPIO4, LP_UART_RXD, ADC1_CH4 and FSPIHD; MTMS is a strapping pin. |
| 5 | IO5 | bidirectional | GPIO5 with alternate functions MTDI, LP_GPIO5, LP_UART_TXD, ADC1_CH5 and FSPIWP; MTDI is a strapping pin. |
| 6 | IO6 | bidirectional | GPIO6 with alternate functions MTCK, LP_GPIO6, LP_I2C_SDA, ADC1_CH6 and FSPICLK. |
| 7 | IO7 | bidirectional | GPIO7 with alternate functions MTDO, LP_GPIO7, LP_I2C_SCL and FSPID. |
| 8 | IO0 | bidirectional | GPIO0 with alternate functions XTAL_32K_P, LP_GPIO0, LP_UART_DTRN and ADC1_CH0. |
| 9 | IO1 | bidirectional | GPIO1 with alternate functions XTAL_32K_N, LP_GPIO1, LP_UART_DSRN and ADC1_CH1. |
| 10 | IO8 | bidirectional | GPIO8; strapping pin used for chip boot mode and ROM message printing control. |
| 11 | IO10 | bidirectional | GPIO10 general-purpose I/O. |
| 12 | IO11 | bidirectional | GPIO11 general-purpose I/O. |
| 13 | IO12 | bidirectional | GPIO12 with USB D- function (USB_D-), as printed in the pin table. |
| 14 | IO13 | bidirectional | GPIO13 with USB D+ function (USB_D+). |
| 15 | IO9 | bidirectional | GPIO9; strapping pin used for chip boot mode selection (default weak pull-up). |
| 16 | IO18 | bidirectional | GPIO18 with alternate functions SDIO_CMD and FSPICS2. |
| 17 | IO19 | bidirectional | GPIO19 with alternate functions SDIO_CLK and FSPICS3. |
| 18 | IO20 | bidirectional | GPIO20 with alternate functions SDIO_DATA0 and FSPICS4. |
| 19 | IO21 | bidirectional | GPIO21 with alternate functions SDIO_DATA1 and FSPICS5. |
| 20 | IO22 | bidirectional | GPIO22 with alternate function SDIO_DATA2. |
| 21 | IO23 | bidirectional | GPIO23 with alternate function SDIO_DATA3. |
| 22 | NC | unconnected | Not connected (NC) pin. |
| 23 | IO15 | bidirectional | GPIO15; strapping pin used for JTAG signal source control. |
| 24 | RXD0 | bidirectional | UART0 receive (U0RXD) with alternate functions GPIO17 and FSPICS1. |
| 25 | TXD0 | bidirectional | UART0 transmit (U0TXD) with alternate functions GPIO16 and FSPICS0. |
| 26 | IO3 | bidirectional | GPIO3 with alternate functions LP_GPIO3, LP_UART_CTSN and ADC1_CH3. |
| 27 | IO2 | bidirectional | GPIO2 with alternate functions LP_GPIO2, LP_UART_RTSN, ADC1_CH2 and FSPIQ. |
| 28 | GND | power_in | Ground pin of the module. |
| 29 | EPAD | power_in | Exposed thermal pad that is ground; soldering it to the base board ground is optional and improves thermal performance, but excess solder paste can degrade adhesion of the other pins. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ESPRESSIF INC |
| Package | SMD-28P |
| Category | IoT/Communication Modules |
| Pins | 29 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage | VDD33 | -0.3 | 3.6 | V | 26 | ||
| Storage temperature | TSTORE | -40 | 105 | °C | 26 | ||
| Power supply voltage | VDD33 | 3 | 3.3 | 3.6 | V | 26 | |
| Current delivered by external power supply | IVDD | 0.5 | A | 26 | |||
| Operating ambient temperature | TA | -40 | 85 | °C | 85 °C version | 26 | |
| Low-level input voltage | VIL | -0.3 | V | 26 | |||
| Low-level input current | IIL | 50 | nA | 26 | |||
| High-level input current | IIH | 50 | nA | 26 | |||
| Chip reset voltage | VIL_nRST | -0.3 | V | CHIP_PU voltage is within the specified range | 27 | ||
| RF transmit power range | -16 | 19 | dBm | 802.15.4 Transmitter Characteristics - 250 Kbps | 37 | ||
| Power supply voltage (1.8 V) | VCC | 1.65 | 1.8 | 2 | V | Power supply voltage (1.8 V) | 28 |
| Power supply voltage (3.3 V) | VCC | 2.7 | 3.3 | 3.6 | V | Power supply voltage (3.3 V) | 28 |
| Maximum clock frequency | FC | 80 | MHz | 28 | |||
| Program/erase cycles | 100000 | cycles | 28 | ||||
| Data retention time | TRET | 20 | years | 28 | |||
| Page program time | TPP | 0.8 | 5 | ms | 28 | ||
| Sector erase time (4 KB) | TSE | 70 | 500 | ms | Sector erase time (4 KB) | 29 | |
| Block erase time (32 KB) | TBE1 | 0.2 | 2 | s | Block erase time (32 KB) | 29 | |
| Block erase time (64 KB) | TBE2 | 0.3 | 3 | s | Block erase time (64 KB) | 29 | |
| Chip erase time (16 Mb) | TCE | 7 | 20 | s | Chip erase time (16 Mb) | 29 | |
| Chip erase time (32 Mb) | TCE | 20 | 60 | s | Chip erase time (32 Mb) | 29 | |
| Chip erase time (64 Mb) | TCE | 25 | 100 | s | Chip erase time (64 Mb) | 29 | |
| Chip erase time (128 Mb) | TCE | 60 | 200 | s | Chip erase time (128 Mb) | 29 | |
| Chip erase time (256 Mb) | TCE | 70 | 300 | s | Chip erase time (256 Mb) | 29 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Solder: Sn-Ag-Cu (SAC305) lead-free solder Temperature (°C) | 46 |
CAD (KiCad official)
- Symbol:
ESP32-C6-WROOM-1-N4 - Footprint:
PCM_Espressif:ESP32-C6-WROOM-1 - 3D model: SMD-28P (KiCad packages3D, STEP)
- 3D model files:
esp32-c6-wroom-1-n4-etched.step/esp32-c6-wroom-1-n4-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esp32-c6-wroom-1-n4.step/esp32-c6-wroom-1-n4.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ESPRESSIF INC datasheet (52 pp, sha256
163020762fa6d499, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ESP32-C6-WROOM-1-N4
**ESPRESSIF INC** · WiFi Modules · SMD-28P
ESP32-C6-WROOM-1-N4 from ESPRESSIF INC, in a SMD-28P. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin of the module. |
| 2 | 3V3 | power_in | Power supply pin; the datasheet's recommended operating range for the module supply (VDD33) is 3.0 V to 3.6 V with a 3.3 V typical value. |
| 3 | EN | input | Chip enable: high turns the chip on and low powers it off, and the pin must not be left floating. |
| 4 | IO4 | bidirectional | GPIO4 with alternate functions MTMS, LP_GPIO4, LP_UART_RXD, ADC1_CH4 and FSPIHD; MTMS is a strapping pin. |
| 5 | IO5 | bidirectional | GPIO5 with alternate functions MTDI, LP_GPIO5, LP_UART_TXD, ADC1_CH5 and FSPIWP; MTDI is a strapping pin. |
| 6 | IO6 | bidirectional | GPIO6 with alternate functions MTCK, LP_GPIO6, LP_I2C_SDA, ADC1_CH6 and FSPICLK. |
| 7 | IO7 | bidirectional | GPIO7 with alternate functions MTDO, LP_GPIO7, LP_I2C_SCL and FSPID. |
| 8 | IO0 | bidirectional | GPIO0 with alternate functions XTAL_32K_P, LP_GPIO0, LP_UART_DTRN and ADC1_CH0. |
| 9 | IO1 | bidirectional | GPIO1 with alternate functions XTAL_32K_N, LP_GPIO1, LP_UART_DSRN and ADC1_CH1. |
| 10 | IO8 | bidirectional | GPIO8; strapping pin used for chip boot mode and ROM message printing control. |
| 11 | IO10 | bidirectional | GPIO10 general-purpose I/O. |
| 12 | IO11 | bidirectional | GPIO11 general-purpose I/O. |
| 13 | IO12 | bidirectional | GPIO12 with USB D- function (USB_D-), as printed in the pin table. |
| 14 | IO13 | bidirectional | GPIO13 with USB D+ function (USB_D+). |
| 15 | IO9 | bidirectional | GPIO9; strapping pin used for chip boot mode selection (default weak pull-up). |
| 16 | IO18 | bidirectional | GPIO18 with alternate functions SDIO_CMD and FSPICS2. |
| 17 | IO19 | bidirectional | GPIO19 with alternate functions SDIO_CLK and FSPICS3. |
| 18 | IO20 | bidirectional | GPIO20 with alternate functions SDIO_DATA0 and FSPICS4. |
| 19 | IO21 | bidirectional | GPIO21 with alternate functions SDIO_DATA1 and FSPICS5. |
| 20 | IO22 | bidirectional | GPIO22 with alternate function SDIO_DATA2. |
| 21 | IO23 | bidirectional | GPIO23 with alternate function SDIO_DATA3. |
| 22 | NC | unconnected | Not connected (NC) pin. |
| 23 | IO15 | bidirectional | GPIO15; strapping pin used for JTAG signal source control. |
| 24 | RXD0 | bidirectional | UART0 receive (U0RXD) with alternate functions GPIO17 and FSPICS1. |
| 25 | TXD0 | bidirectional | UART0 transmit (U0TXD) with alternate functions GPIO16 and FSPICS0. |
| 26 | IO3 | bidirectional | GPIO3 with alternate functions LP_GPIO3, LP_UART_CTSN and ADC1_CH3. |
| 27 | IO2 | bidirectional | GPIO2 with alternate functions LP_GPIO2, LP_UART_RTSN, ADC1_CH2 and FSPIQ. |
| 28 | GND | power_in | Ground pin of the module. |
| 29 | EPAD | power_in | Exposed thermal pad that is ground; soldering it to the base board ground is optional and improves thermal performance, but excess solder paste can degrade adhesion of the other pins. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ESPRESSIF INC |
| Package | SMD-28P |
| Category | IoT/Communication Modules |
| Pins | 29 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage | VDD33 | -0.3 | | 3.6 | V | | 26 |
| Storage temperature | TSTORE | -40 | | 105 | °C | | 26 |
| Power supply voltage | VDD33 | 3 | 3.3 | 3.6 | V | | 26 |
| Current delivered by external power supply | IVDD | 0.5 | | | A | | 26 |
| Operating ambient temperature | TA | -40 | | 85 | °C | 85 °C version | 26 |
| Low-level input voltage | VIL | -0.3 | | | V | | 26 |
| Low-level input current | IIL | | | 50 | nA | | 26 |
| High-level input current | IIH | | | 50 | nA | | 26 |
| Chip reset voltage | VIL_nRST | -0.3 | | | V | CHIP_PU voltage is within the specified range | 27 |
| RF transmit power range | | -16 | | 19 | dBm | 802.15.4 Transmitter Characteristics - 250 Kbps | 37 |
| Power supply voltage (1.8 V) | VCC | 1.65 | 1.8 | 2 | V | Power supply voltage (1.8 V) | 28 |
| Power supply voltage (3.3 V) | VCC | 2.7 | 3.3 | 3.6 | V | Power supply voltage (3.3 V) | 28 |
| Maximum clock frequency | FC | 80 | | | MHz | | 28 |
| Program/erase cycles | | 100000 | | | cycles | | 28 |
| Data retention time | TRET | 20 | | | years | | 28 |
| Page program time | TPP | | 0.8 | 5 | ms | | 28 |
| Sector erase time (4 KB) | TSE | | 70 | 500 | ms | Sector erase time (4 KB) | 29 |
| Block erase time (32 KB) | TBE1 | | 0.2 | 2 | s | Block erase time (32 KB) | 29 |
| Block erase time (64 KB) | TBE2 | | 0.3 | 3 | s | Block erase time (64 KB) | 29 |
| Chip erase time (16 Mb) | TCE | | 7 | 20 | s | Chip erase time (16 Mb) | 29 |
| Chip erase time (32 Mb) | TCE | | 20 | 60 | s | Chip erase time (32 Mb) | 29 |
| Chip erase time (64 Mb) | TCE | | 25 | 100 | s | Chip erase time (64 Mb) | 29 |
| Chip erase time (128 Mb) | TCE | | 60 | 200 | s | Chip erase time (128 Mb) | 29 |
| Chip erase time (256 Mb) | TCE | | 70 | 300 | s | Chip erase time (256 Mb) | 29 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | Solder: Sn-Ag-Cu (SAC305) lead-free solder Temperature (°C) | 46 |
## CAD (KiCad official)
- Symbol: `ESP32-C6-WROOM-1-N4`
- Footprint: `PCM_Espressif:ESP32-C6-WROOM-1`
- 3D model: SMD-28P (KiCad packages3D, STEP)
- 3D model files: `esp32-c6-wroom-1-n4-etched.step` / `esp32-c6-wroom-1-n4-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esp32-c6-wroom-1-n4.step` / `esp32-c6-wroom-1-n4.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [ESPRESSIF INC datasheet](https://www.espressif.com/sites/default/files/documentation/esp32-c6-wroom-1-wroom-1u_datasheet_en.pdf) (52 pp, sha256 `163020762fa6d499`, retrieved 2026-10-28, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/esp32-c6-wroom-1-n4-datasheet.pdf)