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ESP32-C6-MINI-1U-H4

Public Made by Adom

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ESPRESSIF INC Global Sourcing Parts, ESP32-C6-MINI-1U. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-C6-MINI-1U-H4

ESPRESSIF INC · Global Sourcing Parts · ESP32-C6-MINI-1U

ESP32-C6-MINI-1U-H4 from ESPRESSIF INC, in a ESP32-C6-MINI-1U. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
2 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
3 3V3 power_in Module power supply input; VDD33 is specified at 3.0 to 3.6 V (3.3 V typical), with an external supply able to deliver at least 0.5 A.
4 NC unconnected Not connected; Table 3-1 assigns no function to this pin.
5 IO2 bidirectional GPIO2 with alternate functions LP_GPIO2, LP_UART_RTSN, ADC1_CH2 and FSPIQ; logic levels follow Table 6-3 (VIL max 0.25 x VDD, VOH min 0.8 x VDD).
6 IO3 bidirectional GPIO3 with alternate functions LP_GPIO3, LP_UART_CTSN and ADC1_CH3; logic levels follow Table 6-3 (VIL max 0.25 x VDD, VOH min 0.8 x VDD).
7 NC unconnected Not connected; Table 3-1 assigns no function to this pin.
8 EN input High enables the chip and low powers it off; the pin must not be left floating.
9 IO4 bidirectional Strapping pin MTMS (GPIO4) that sets the SDIO sampling and driving clock edge at reset, floating by default; other functions include LP_GPIO4, LP_UART_RXD, ADC1_CH4 and FSPIHD.
10 IO5 bidirectional Strapping pin MTDI (GPIO5) that sets the SDIO sampling and driving clock edge at reset, floating by default; other functions include LP_GPIO5, LP_UART_TXD, ADC1_CH5 and FSPIWP.
11 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
12 IO0 bidirectional GPIO0 with alternate functions XTAL_32K_P, LP_GPIO0, LP_UART_DTRN and ADC1_CH0; logic levels follow Table 6-3.
13 IO1 bidirectional GPIO1 with alternate functions XTAL_32K_N, LP_GPIO1, LP_UART_DSRN and ADC1_CH1; logic levels follow Table 6-3.
14 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
15 IO6 bidirectional GPIO6 with alternate functions MTCK, LP_GPIO6, LP_I2C_SDA, ADC1_CH6 and FSPICLK; logic levels follow Table 6-3.
16 IO7 bidirectional GPIO7 with alternate functions MTDO, LP_GPIO7, LP_I2C_SCL and FSPID; logic levels follow Table 6-3.
17 IO12 bidirectional GPIO12 with USB D- function as printed in the pin table (the name cell is truncated in the extracted text); logic levels follow Table 6-3.
18 IO13 bidirectional GPIO13 with USB D+ function; logic levels follow Table 6-3.
19 IO14 bidirectional General-purpose GPIO14; logic levels follow Table 6-3.
20 IO15 bidirectional Strapping pin GPIO15 that selects the JTAG signal source at reset, floating by default; logic levels follow Table 6-3.
21 NC unconnected Not connected; Table 3-1 assigns no function to this pin.
22 IO8 bidirectional Strapping pin GPIO8 that participates in chip boot mode selection and ROM message printing control, floating by default; logic levels follow Table 6-3.
23 IO9 bidirectional Strapping pin GPIO9 that participates in chip boot mode selection, with a weak internal pull-up by default; logic levels follow Table 6-3.
24 IO18 bidirectional GPIO18 with alternate functions SDIO_CMD and FSPICS2; logic levels follow Table 6-3.
25 IO19 bidirectional GPIO19 with alternate functions SDIO_CLK and FSPICS3; logic levels follow Table 6-3.
26 IO20 bidirectional GPIO20 with alternate functions SDIO_DATA0 and FSPICS4; logic levels follow Table 6-3.
27 IO21 bidirectional GPIO21 with alternate functions SDIO_DATA1 and FSPICS5; logic levels follow Table 6-3.
28 IO22 bidirectional GPIO22 with alternate function SDIO_DATA2; logic levels follow Table 6-3.
29 IO23 bidirectional GPIO23 with alternate function SDIO_DATA3; logic levels follow Table 6-3.
30 RXD0 bidirectional UART0 receive (U0RXD), also usable as GPIO17 or FSPICS1; logic levels follow Table 6-3.
31 TXD0 bidirectional UART0 transmit (U0TXD), also usable as GPIO16 or FSPICS0; logic levels follow Table 6-3.
32 NC unconnected Not connected; Table 3-1 assigns no function to this pin.
33 NC unconnected Not connected; Table 3-1 assigns no function to this pin.
34 NC unconnected Not connected; Table 3-1 assigns no function to this pin.
35 NC unconnected Not connected; Table 3-1 assigns no function to this pin.
36 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
37 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
38 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
39 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
40 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
41 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
42 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
43 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
44 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
45 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
46 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
47 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
48 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
49 GND power_in Ground pad (EPAD); soldering it to the base board ground is optional but optimizes thermal performance, and too much solder paste can raise the module off the board.
50 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
51 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
52 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.
53 GND power_in Ground connection; the module's ground pins are 1, 2, 11, 14 and 36 to 53 per Table 3-1.

Key specifications

Parameter Value
Manufacturer ESPRESSIF INC
Package ESP32-C6-MINI-1U
Category Global Sourcing Parts
Pins 53

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage (absolute maximum) VDD33 -0.3 3.6 V 26
Power supply voltage VDD33 3 3.3 3.6 V 26
Current delivered by external power supply IVDD 0.5 A 26
Operating ambient temperature (105 °C version) TA -40 105 °C 105 °C version module 26
Low-level input voltage VIL -0.3 V 3.3 V, 25 °C 26
High-level input current IIH 50 nA 3.3 V, 25 °C 26
Low-level input current IIL 50 nA 3.3 V, 25 °C 26
Chip reset voltage (CHIP_PU voltage is within the specified range) VIL_nRST -0.3 V CHIP_PU voltage is within the specified range 27
Flash power supply voltage (3.3 V) VCC 2.7 3.3 3.6 V 28
Flash maximum clock frequency FC 80 MHz 28
Flash program/erase cycles 100000 cycles 28
Flash data retention time TRET 20 years 28
Flash page program time TPP 0.8 5 ms 28
Flash sector erase time (4 KB) TSE 70 500 ms 29
Flash block erase time (32 KB) TBE1 0.2 2 s 29
Flash block erase time (64 KB) TBE2 0.3 3 s 29
Flash chip erase time (16 Mb) TCE 7 20 s 29
Flash chip erase time (32 Mb) TCE 20 60 s 29
Flash chip erase time (64 Mb) TCE 25 100 s 29
Flash chip erase time (128 Mb) TCE 60 200 s 29
Flash chip erase time (256 Mb) TCE 70 300 s 29
TX EVM limit (802.11b) -25 -10 dB 802.11b, 1 Mbps, DSSS 30
TX EVM limit (802.11g) -24 -5 dB 802.11g, 6 Mbps, OFDM 31
TX EVM limit (802.11g) -28 -25 dB 802.11g, 54 Mbps, OFDM 31
TX EVM limit (802.11n HT20) -27.5 -5 dB 802.11n, HT20, MCS0 31
TX EVM limit (802.11n HT20) -30 -27 dB 802.11n, HT20, MCS7 31
TX EVM limit (802.11n HT40) -27 -5 dB 802.11n, HT40, MCS0 31
TX EVM limit (802.11n HT40) -29.5 -27 dB 802.11n, HT40, MCS7 31
TX EVM limit (802.11ax HE20) -27 -5 dB 802.11ax, HE20, MCS0 31
TX EVM limit (802.11ax HE20) -34 -32 dB 802.11ax, HE20, MCS9 31
Wi-Fi center frequency range of operating channel 2412 2484 MHz Center frequency range of operating channel 30
Bluetooth LE center frequency range of operating channel 2402 2480 MHz Center frequency range of operating channel 33
802.15.4 center frequency range of operating channel 2405 2480 MHz Center frequency range of operating channel 36
Bluetooth LE RF transmit power range -16 19 dBm RF transmit power range 33
802.15.4 RF transmit power range -16 19 dBm RF transmit power range 37
Bluetooth LE receiver sensitivity (1 Mbps) -98 dBm Sensitivity @30.8% PER 34
Bluetooth LE maximum received signal (1 Mbps) 8 dBm Maximum received signal @30.8% PER 34
Bluetooth LE receiver sensitivity (2 Mbps) -95 dBm Sensitivity @30.8% PER 35
Bluetooth LE maximum received signal (2 Mbps) 8 dBm Maximum received signal @30.8% PER 35
Bluetooth LE receiver sensitivity (125 Kbps) -105.5 dBm Sensitivity @30.8% PER 36
Bluetooth LE maximum received signal (125 Kbps) 8 dBm Maximum received signal @30.8% PER 36
Bluetooth LE receiver sensitivity (500 Kbps) -101.5 dBm Sensitivity @30.8% PER 36
Bluetooth LE maximum received signal (500 Kbps) 8 dBm Maximum received signal @30.8% PER 36
802.15.4 receiver sensitivity (250 Kbps) -104 dBm Sensitivity @1% PER 37
802.15.4 maximum received signal (250 Kbps) 8 dBm Maximum received signal @1% PER 37

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 42
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 42
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 42

CAD (KiCad official)

  • Symbol: ESP32-C6-MINI-1U-H4
  • Footprint: PCM_Espressif:ESP32-C6-MINI-1U
  • 3D model: ESP32-C6-MINI-1U (KiCad packages3D, STEP)
  • 3D model files: esp32-c6-mini-1u-h4-etched.step / esp32-c6-mini-1u-h4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-c6-mini-1u-h4.step / esp32-c6-mini-1u-h4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ESPRESSIF INC datasheet (53 pp, sha256 26691033f31cbebf, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF