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ESP32-C6-MINI-1-N4

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Espressif Systems WiFi Modules, SMD-53P. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentiot-communication modulesesp32-c6-mini-1-n4factory-2.0.0extractor-text
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3D Model

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Symbol & Footprint

Schematic Symbol

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Datasheet

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Contents

README

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ESP32-C6-MINI-1-N4

Espressif Systems · WiFi Modules · SMD-53P

ESP32-C6-MINI-1-N4 from Espressif Systems, in a SMD-53P. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
2 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
3 3V3 power_in Module power supply pin; Table 6-2 gives VDD33 of 3.0 V min, 3.3 V typ and 3.6 V max.
4 NC unconnected Not connected.
5 IO2 bidirectional GPIO2 with alternate functions LP_GPIO2, LP_UART_RTSN, ADC1_CH2 and FSPIQ; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
6 IO3 bidirectional GPIO3 with alternate functions LP_GPIO3, LP_UART_CTSN and ADC1_CH3; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
7 NC unconnected Not connected.
8 EN input Chip enable: High turns the chip on and Low turns it off; the datasheet says do not leave this pin floating.
9 IO4 bidirectional GPIO4 (MTMS) with alternate functions LP_GPIO4, LP_UART_RXD, ADC1_CH4 and FSPIHD; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
10 IO5 bidirectional GPIO5 (MTDI) with alternate functions LP_GPIO5, LP_UART_TXD, ADC1_CH5 and FSPIWP; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
11 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
12 IO0 bidirectional GPIO0 with alternate functions XTAL_32K_P, LP_GPIO0, LP_UART_DTRN and ADC1_CH0; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
13 IO1 bidirectional GPIO1 with alternate functions XTAL_32K_N, LP_GPIO1, LP_UART_DSRN and ADC1_CH1; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
14 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
15 IO6 bidirectional GPIO6 (MTCK) with alternate functions LP_GPIO6, LP_I2C_SDA, ADC1_CH6 and FSPICLK; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
16 IO7 bidirectional GPIO7 (MTDO) with alternate functions LP_GPIO7, LP_I2C_SCL and FSPID; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
17 IO12 bidirectional GPIO12 with alternate function USB_D- (the minus sign is garbled in the extracted text); the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
18 IO13 bidirectional GPIO13 with alternate function USB_D+; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
19 IO14 bidirectional GPIO14; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
20 IO15 bidirectional GPIO15, which is a strapping pin for the JTAG signal source; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
21 NC unconnected Not connected.
22 IO8 bidirectional GPIO8, which is a strapping pin used for chip boot mode and ROM message printing; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
23 IO9 bidirectional GPIO9, which is a strapping pin for chip boot mode with a weak pull-up at reset; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
24 IO18 bidirectional GPIO18 with alternate functions SDIO_CMD and FSPICS2; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
25 IO19 bidirectional GPIO19 with alternate functions SDIO_CLK and FSPICS3; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
26 IO20 bidirectional GPIO20 with alternate functions SDIO_DATA0 and FSPICS4; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
27 IO21 bidirectional GPIO21 with alternate functions SDIO_DATA1 and FSPICS5; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
28 IO22 bidirectional GPIO22 with alternate function SDIO_DATA2; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
29 IO23 bidirectional GPIO23 with alternate function SDIO_DATA3; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
30 RXD0 bidirectional UART0 receive (U0RXD) with alternate functions GPIO17 and FSPICS1; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
31 TXD0 bidirectional UART0 transmit (U0TXD) with alternate functions GPIO16 and FSPICS0; the datasheet gives no pin-specific electrical limits beyond the general DC characteristics in Table 6-3.
32 NC unconnected Not connected.
33 NC unconnected Not connected.
34 NC unconnected Not connected.
35 NC unconnected Not connected.
36 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
37 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
38 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
39 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
40 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
41 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
42 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
43 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
44 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
45 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
46 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
47 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
48 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
49 GND power_in Ground pin of the module (the schematic in Figure 9-1 labels it EPAD); the datasheet says soldering it to the base board ground is optional but can improve thermal performance.
50 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
51 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
52 GND power_in Ground pin of the module, listed in Table 3-1 as ground.
53 GND power_in Ground pin of the module, listed in Table 3-1 as ground.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package SMD-53P
Category IoT/Communication Modules
Pins 53

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 26
Power supply voltage VDD33 3 3.3 3.6 V 26
Current delivered by external power supply IVDD 0.5 A 26
Operating ambient temperature TA -40 85 °C 85 °C version 26
Low-level input voltage VIL -0.3 V 26
High-level input current IIH 50 nA 26
Low-level input current IIL 50 nA 26
Chip reset voltage VIL_nRST -0.3 V CHIP_PU voltage is within the specified range 27
Power supply voltage (3.3 V) VCC 2.7 3.3 3.6 V Power supply voltage (3.3 V) 28
Maximum clock frequency FC 80 MHz 28

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 42
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 42
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 42

CAD (KiCad official)

  • Symbol: ESP32-C6-MINI-1-N4
  • Footprint: PCM_Espressif:ESP32-C6-MINI-1
  • 3D model: SMD-53P (KiCad packages3D, STEP)
  • 3D model files: esp32-c6-mini-1-n4-etched.step / esp32-c6-mini-1-n4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-c6-mini-1-n4.step / esp32-c6-mini-1-n4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (53 pp, sha256 26691033f31cbebf, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF