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ESP32-C5-WROOM-1-N4

Espressif Systems · RF and Wireless · 28-SMD Module

ESP32-C5-WROOM-1-N4 from Espressif Systems, in a 28-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	GND	power_in	Ground.
2	3V3	power_in	Power supply pin; the datasheet's recommended VDD33 supply range is 3.0 V to 3.6 V with 3.3 V typical.
3	EN	input	High enables the chip and low powers it off; do not leave this pin floating.
4	IO2	bidirectional	GPIO2, also multiplexed as MTMS, LP_GPIO2, LP_UART_RTSN, LP_I2C_SDA, ADC1_CH1 and FSPIQ.
5	IO3	bidirectional	GPIO3, also multiplexed as MTDI, LP_GPIO3, LP_UART_CTSN, LP_I2C_SCL and ADC1_CH2.
6	IO0	bidirectional	GPIO0, also multiplexed as XTAL_32K_P, LP_GPIO0 and LP_UART_DTRN.
7	IO1	bidirectional	GPIO1, also multiplexed as XTAL_32K_N, LP_GPIO1, LP_UART_DSRN and ADC1_CH0.
8	IO6	bidirectional	GPIO6, also multiplexed as LP_GPIO6, ADC1_CH5 and FSPICLK.
9	IO7	bidirectional	GPIO7, also multiplexed as FSPID and SDIO_DATA1.
10	IO8	bidirectional	GPIO8, also multiplexed as PAD_COMP0 and SDIO_DATA0.
11	IO9	bidirectional	GPIO9, also multiplexed as PAD_COMP1 and SDIO_CLK.
12	IO10	bidirectional	GPIO10, also multiplexed as FSPICS0 and SDIO_CMD.
13	IO13	bidirectional	GPIO13, also multiplexed as USB_D- and SDIO_DATA3.
14	IO14	bidirectional	GPIO14, also multiplexed as USB_D+ and SDIO_DATA2.
15	IO28	bidirectional	GPIO28 only; this pin is also a boot strapping pin with a pull-up by default.
16	IO5	bidirectional	GPIO5, also multiplexed as MTDO, LP_GPIO5, LP_UART_TXD, ADC1_CH4 and FSPIWP.
17	IO4	bidirectional	GPIO4, also multiplexed as MTCK, LP_GPIO4, LP_UART_RXD, ADC1_CH3 and FSPIHD.
18	IO27	bidirectional	GPIO27 only; this pin is also a boot strapping pin with a pull-up by default.
19	NC/IO15	bidirectional	Functions as SPICS1 for the in-package SPI PSRAM and cannot be used otherwise in PSRAM modules; in modules without in-package PSRAM it can be used as GPIO15.
20	NC	unconnected	Not connected.
21	IO23	bidirectional	GPIO23 only.
22	NC	unconnected	Not connected.
23	IO24	bidirectional	GPIO24 only.
24	RX0	bidirectional	UART0 receive (U0RXD), also usable as GPIO12.
25	TX0	bidirectional	UART0 transmit (U0TXD), also usable as GPIO11.
26	IO25	bidirectional	GPIO25 only; this pin is also a boot strapping pin (SDIO sampling/driving edge) and is floating by default.
27	IO26	bidirectional	GPIO26 only; this pin is also a boot strapping pin (chip boot mode) and is floating by default.
28	GND	power_in	Ground.
29	EPAD	power_in	Exposed ground pad, listed as ground in the pin table.

Key specifications

Parameter	Value
Manufacturer	Espressif Systems
Package	28-SMD Module
Category	RF and Wireless
Pins	29

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Power supply voltage	VDD33	-0.3		3.6	V		32
Power supply voltage	VDD33	3	3.3	3.6	V		32
Current delivered by external power supply	IVDD	0.6			A		32
Operating ambient temperature	TA	-40		85	°C		32
High-level input current	IIH			50	nA		32
Low-level input current	IIL			50	nA		32
Power supply voltage (3.3 V flash)	VCC	2.7	3.3	3.6	V	Flash specification, 3.3 V	35
Maximum clock frequency (flash)	FC	80			MHz		35
Pin capacitance	CIN		2		pF		32
High-level source current	IOH		40		mA	VDD = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3	32
Low-level sink current	IOL		28		mA	VDD = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3	32
Internal weak pull-up resistor	RPU		45		kΩ		32
Internal weak pull-down resistor	RPD		45		kΩ		32
Light-sleep current			0.25		mA	CPU and wireless communication modules powered down, peripheral clocks disabled, all GPIOs high-impedance	35
Deep-sleep current			0.012		mA	RTC timer and LP memory powered on	35
Power off current			0.002		mA	CHIP_PU set to low level, chip powered off	35
Light-sleep current (CPU and peripherals powered down)			0.06		mA	CPU, wireless communication modules and peripherals powered down, all GPIOs high-impedance	35

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts		tin	Solder: Sn-Ag-Cu (SAC305) lead-free solder Temperature (°C)	56

CAD (KiCad official)

Symbol: ESP32-C5-WROOM-1-N4
Footprint: PCM_Espressif:ESP32-C5-WROOM-1
3D model: 28-SMD Module (KiCad packages3D, STEP)
3D model files: esp32-c5-wroom-1-n4-etched.step / esp32-c5-wroom-1-n4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-c5-wroom-1-n4.step / esp32-c5-wroom-1-n4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Espressif Systems datasheet (62 pp, sha256 fa50f329237226d0, retrieved 2026-10-28, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF