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ESP32-C3-MINI-1U-N4X

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Espressif Systems RF and Wireless, 61-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-C3-MINI-1U-N4X

Espressif Systems · RF and Wireless · 61-SMD Module

ESP32-C3-MINI-1U-N4X from Espressif Systems, in a 61-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground.
2 GND power_in Ground.
3 3V3 power_in Power supply, 3.0 to 3.6 V (3.3 V typical).
4 NC unconnected No connect.
5 IO2 bidirectional GPIO2, ADC1_CH2, FSPIQ; strapping pin (floating by default, recommended pulled up).
6 IO3 bidirectional GPIO3, ADC1_CH3.
7 NC unconnected No connect.
8 EN input High enables the chip, low powers it off; do not leave floating.
9 NC unconnected No connect.
10 NC unconnected No connect.
11 GND power_in Ground.
12 IO0 bidirectional GPIO0, ADC1_CH0, XTAL_32K_P.
13 IO1 bidirectional GPIO1, ADC1_CH1, XTAL_32K_N.
14 GND power_in Ground.
15 NC unconnected No connect.
16 IO10 bidirectional GPIO10, FSPICS0.
17 NC unconnected No connect.
18 IO4 bidirectional GPIO4, ADC1_CH4, FSPIHD, MTMS.
19 IO5 bidirectional GPIO5, ADC2_CH0, FSPIWP, MTDI.
20 IO6 bidirectional GPIO6, FSPICLK, MTCK.
21 IO7 bidirectional GPIO7, FSPID, MTDO.
22 IO8 bidirectional GPIO8; strapping pin (floating by default) that also controls UART0 ROM message printing.
23 IO9 bidirectional GPIO9; strapping pin with weak pull-up by default, low selects joint download boot.
24 NC unconnected No connect.
25 NC unconnected No connect.
26 IO18 bidirectional GPIO18, USB_D-.
27 IO19 bidirectional GPIO19, USB_D+.
28 NC unconnected No connect.
29 NC unconnected No connect.
30 RXD0 bidirectional GPIO20, U0RXD (UART0 receive).
31 TXD0 bidirectional GPIO21, U0TXD (UART0 transmit).
32 NC unconnected No connect.
33 NC unconnected No connect.
34 NC unconnected No connect.
35 NC unconnected No connect.
36 GND power_in Ground.
37 GND power_in Ground.
38 GND power_in Ground.
39 GND power_in Ground.
40 GND power_in Ground.
41 GND power_in Ground.
42 GND power_in Ground.
43 GND power_in Ground.
44 GND power_in Ground.
45 GND power_in Ground.
46 GND power_in Ground.
47 GND power_in Ground.
48 GND power_in Ground.
49 GND power_in Ground; exposed pad (EPAD), soldering it to board ground is optional but improves thermal performance.
50 GND power_in Ground.
51 GND power_in Ground.
52 GND power_in Ground.
53 GND power_in Ground.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 61-SMD Module
Category RF and Wireless
Pins 53

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Absolute maximum power supply voltage VDD33 -0.3 3.6 V 21
Power supply voltage VDD33 3 3.3 3.6 V 21
Operating ambient temperature (85 °C version) TA -40 85 °C 85 °C version 21
Current delivered by external power supply IV DD 0.5 A 21
High-level input current IIH 50 nA 21
Low-level input current IIL 50 nA 21
Flash power supply voltage (3.3 V) VCC 2.7 3.3 3.6 V Power supply voltage (3.3 V) 23
Flash maximum clock frequency FC 80 MHz 23
RF transmit power range -24 20 dBm Bluetooth LE RF transmit power range 27
Center frequency range of operating channel 2412 2484 MHz Wi-Fi center frequency range of operating channel 25
Integrated crystal oscillator frequency tolerance -10 10 ppm 40MHz(±10ppm) crystal U1 in schematic 32
Pin capacitance CIN 2 pF 21
High-level source current IOH 40 mA VDD = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3 21
Low-level sink current IOL 28 mA VDD = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3 21
Internal weak pull-up resistor RPU 45 kΩ 21
Internal weak pull-down resistor RPD 45 kΩ 21
Integrated crystal oscillator frequency 40 MHz 40MHz(±10ppm) crystal U1 in schematic 32

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 36
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36

CAD (KiCad official)

  • Symbol: ESP32-C3-MINI-1U-N4X
  • Footprint: PCM_Espressif:ESP32-C3-MINI-1U
  • 3D model: 61-SMD Module (KiCad packages3D, STEP)
  • 3D model files: esp32-c3-mini-1u-n4x-etched.step / esp32-c3-mini-1u-n4x-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-c3-mini-1u-n4x.step / esp32-c3-mini-1u-n4x.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (48 pp, sha256 de7361381348d82a, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF