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ESP32-C3-MINI-1U-H4X

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Espressif Systems RF and Wireless, 61-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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ESP32-C3-MINI-1U-H4X

Espressif Systems · RF and Wireless · 61-SMD Module

ESP32-C3-MINI-1U-H4X from Espressif Systems, in a 61-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
2 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
3 3V3 power_in Module power supply pin; recommended supply is 3.0 V to 3.6 V with 3.3 V typical, and absolute maximum is 3.6 V.
4 NC unconnected Not connected on the module; the datasheet gives no function for this pin.
5 IO2 bidirectional GPIO2 with ADC1_CH2 and FSPIQ functions; it is a chip boot mode strapping pin and is floating by default at reset.
6 IO3 bidirectional GPIO3 with ADC1_CH3 function.
7 NC unconnected Not connected on the module; the datasheet gives no function for this pin.
8 EN input Chip enable: high turns the chip on, low powers it off, and the pin must not be left floating.
9 NC unconnected Not connected on the module; the datasheet gives no function for this pin.
10 NC unconnected Not connected on the module; the datasheet gives no function for this pin.
11 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
12 IO0 bidirectional GPIO0 with ADC1_CH0 and XTAL_32K_P functions.
13 IO1 bidirectional GPIO1 with ADC1_CH1 and XTAL_32K_N functions.
14 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
15 NC unconnected Not connected on the module; the datasheet gives no function for this pin.
16 IO10 bidirectional GPIO10 with FSPICS0 function.
17 NC unconnected Not connected on the module; the datasheet gives no function for this pin.
18 IO4 bidirectional GPIO4 with ADC1_CH4, FSPIHD and MTMS functions.
19 IO5 bidirectional GPIO5 with ADC2_CH0, FSPIWP and MTDI functions.
20 IO6 bidirectional GPIO6 with FSPICLK and MTCK functions.
21 IO7 bidirectional GPIO7 with FSPID and MTDO functions.
22 IO8 bidirectional GPIO8; it is a chip boot mode and ROM message printing strapping pin and is floating by default at reset.
23 IO9 bidirectional GPIO9; it is a chip boot mode strapping pin with an internal weak pull-up, so it reads 1 by default.
24 NC unconnected Not connected on the module; the datasheet gives no function for this pin.
25 NC unconnected Not connected on the module; the datasheet gives no function for this pin.
26 IO18 bidirectional GPIO18 with USB_D- function for the USB Serial/JTAG interface.
27 IO19 bidirectional GPIO19 with USB_D+ function for the USB Serial/JTAG interface.
28 NC unconnected Not connected on the module; the datasheet gives no function for this pin.
29 NC unconnected Not connected on the module; the datasheet gives no function for this pin.
30 RXD0 bidirectional GPIO20 with U0RXD function, the UART0 receive signal used for download and log output.
31 TXD0 bidirectional GPIO21 with U0TXD function, the UART0 transmit signal used for download and log output.
32 NC unconnected Not connected on the module; the datasheet gives no function for this pin.
33 NC unconnected Not connected on the module; the datasheet gives no function for this pin.
34 NC unconnected Not connected on the module; the datasheet gives no function for this pin.
35 NC unconnected Not connected on the module; the datasheet gives no function for this pin.
36 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
37 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
38 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
39 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
40 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
41 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
42 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
43 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
44 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
45 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
46 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
47 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
48 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
49 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground); Figure 9-1 labels it EPAD, and soldering it to the base board ground is optional but improves thermal performance.
50 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
51 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
52 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).
53 GND power_in Ground pin of the module (Table 3-1 lists pins 1, 2, 11, 14 and 36-53 as ground).

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 61-SMD Module
Category RF and Wireless
Pins 53

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 21
Power supply voltage VDD33 3 3.3 3.6 V 21
Current delivered by external power supply IVDD 0.5 A 21
Operating ambient temperature TA -40 105 °C 105 °C version module 21
High-level input current IIH 50 nA 21
Low-level input current IIL 50 nA 21
Power supply voltage (1.8 V) VCC 1.65 1.8 2 V Flash, 1.8 V supply 23
Power supply voltage (3.3 V) VCC 2.7 3.3 3.6 V Flash, 3.3 V supply 23
Maximum clock frequency FC 80 MHz 23
Program/erase cycles 100000 cycles 23
Data retention time TRET 20 years 23
Page program time TPP 0.8 5 ms 23
Sector erase time (4 KB) TSE 70 500 ms 23
Block erase time (32 KB) TBE1 0.2 2 s 23
Block erase time (64 KB) TBE2 0.3 3 s 23
Chip erase time (16 Mb) TCE 7 20 s 24
Chip erase time (32 Mb) TCE 20 60 s 24
Chip erase time (64 Mb) TCE 25 100 s 24
Chip erase time (128 Mb) TCE 60 200 s 24
Chip erase time (256 Mb) TCE 70 300 s 24
RF transmit power range -24 20 dBm Bluetooth LE 27
Center frequency range of operating channel 2412 2484 MHz Wi-Fi 25
Temperature sensor range -40 125 °C 20
Insulation resistance 500 MOHM External antenna connector 36
Contact resistance 20 mOHM External antenna connector 36
Pin capacitance CIN 2 pF 21
High-level source current IOH 40 mA VDD = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3 21
Low-level sink current IOL 28 mA VDD = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3 21
Internal weak pull-up resistor RPU 45 kΩ 21
Internal weak pull-down resistor RPD 45 kΩ 21
Light-sleep current 130 µA VDD_SPI and Wi-Fi powered down, all GPIOs high-impedance 23
Deep-sleep current 5 µA RTC timer + RTC memory 23
Power off current 1 µA CHIP_EN set to low level 23

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 36
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36

CAD (KiCad official)

  • Symbol: ESP32-C3-MINI-1U-H4X
  • Footprint: PCM_Espressif:ESP32-C3-MINI-1U
  • 3D model: 61-SMD Module (KiCad packages3D, STEP)
  • 3D model files: esp32-c3-mini-1u-h4x-etched.step / esp32-c3-mini-1u-h4x-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-c3-mini-1u-h4x.step / esp32-c3-mini-1u-h4x.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (48 pp, sha256 de7361381348d82a, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF