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ESP32-C3-MINI-1U-H4

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Espressif Systems WiFi Modules, ESP32-C3-MINI-1U. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-C3-MINI-1U-H4

Espressif Systems · WiFi Modules · ESP32-C3-MINI-1U

ESP32-C3-MINI-1U-H4 from Espressif Systems, in a ESP32-C3-MINI-1U. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference pin of the module.
2 GND power_in Ground reference pin of the module.
3 3V3 power_in Power supply input; Table 6-2 gives VDD33 as 3.0 V min, 3.3 V typ, 3.6 V max.
4 NC unconnected Not connected; the datasheet lists this pin as NC with no function.
5 IO2 bidirectional GPIO2 with ADC1_CH2 and FSPIQ functions; also a chip boot mode strapping pin, and the pin is floating by default.
6 IO3 bidirectional GPIO3 with ADC1_CH3 function.
7 NC unconnected Not connected; the datasheet lists this pin as NC with no function.
8 EN input Chip enable: High turns the chip on, Low turns it off; do not leave the EN pin floating.
9 NC unconnected Not connected; the datasheet lists this pin as NC with no function.
10 NC unconnected Not connected; the datasheet lists this pin as NC with no function.
11 GND power_in Ground reference pin of the module.
12 IO0 bidirectional GPIO0 with ADC1_CH0 and XTAL_32K_P functions.
13 IO1 bidirectional GPIO1 with ADC1_CH1 and XTAL_32K_N functions.
14 GND power_in Ground reference pin of the module.
15 NC unconnected Not connected; the datasheet lists this pin as NC with no function.
16 IO10 bidirectional GPIO10 with FSPICS0 function.
17 NC unconnected Not connected; the datasheet lists this pin as NC with no function.
18 IO4 bidirectional GPIO4 with ADC1_CH4, FSPIHD and MTMS functions.
19 IO5 bidirectional GPIO5 with ADC2_CH0, FSPIWP and MTDI functions.
20 IO6 bidirectional GPIO6 with FSPICLK and MTCK functions.
21 IO7 bidirectional GPIO7 with FSPID and MTDO functions.
22 IO8 bidirectional GPIO8 general-purpose I/O; also a chip boot mode and ROM message printing strapping pin.
23 IO9 bidirectional GPIO9 general-purpose I/O; also a chip boot mode strapping pin with a weak pull-up by default.
24 NC unconnected Not connected; the datasheet lists this pin as NC with no function.
25 NC unconnected Not connected; the datasheet lists this pin as NC with no function.
26 IO18 bidirectional GPIO18 with USB_D- function.
27 IO19 bidirectional GPIO19 with USB_D+ function.
28 NC unconnected Not connected; the datasheet lists this pin as NC with no function.
29 NC unconnected Not connected; the datasheet lists this pin as NC with no function.
30 RXD0 bidirectional GPIO20 with U0RXD function (UART0 receive).
31 TXD0 bidirectional GPIO21 with U0TXD function (UART0 transmit).
32 NC unconnected Not connected; the datasheet lists this pin as NC with no function.
33 NC unconnected Not connected; the datasheet lists this pin as NC with no function.
34 NC unconnected Not connected; the datasheet lists this pin as NC with no function.
35 NC unconnected Not connected; the datasheet lists this pin as NC with no function.
36 GND power_in Ground reference pin of the module.
37 GND power_in Ground reference pin of the module.
38 GND power_in Ground reference pin of the module.
39 GND power_in Ground reference pin of the module.
40 GND power_in Ground reference pin of the module.
41 GND power_in Ground reference pin of the module.
42 GND power_in Ground reference pin of the module.
43 GND power_in Ground reference pin of the module.
44 GND power_in Ground reference pin of the module.
45 GND power_in Ground reference pin of the module.
46 GND power_in Ground reference pin of the module.
47 GND power_in Ground reference pin of the module.
48 GND power_in Ground reference pin of the module.
49 GND power_in Ground exposed thermal pad (EPAD); soldering it to base-board ground is optional and improves thermal performance if the correct amount of solder paste is used.
50 GND power_in Ground reference pin of the module.
51 GND power_in Ground reference pin of the module.
52 GND power_in Ground reference pin of the module.
53 GND power_in Ground reference pin of the module.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package ESP32-C3-MINI-1U
Category IoT/Communication Modules
Pins 53

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 21
Operating ambient temperature TA -40 105 °C 105 °C version 21
Power supply voltage VDD33 3 3.3 3.6 V 21
Current delivered by external power supply IVDD 0.5 A 21
High-level input current IIH 50 nA 3.3 V, 25 °C 21
Low-level input current IIL 50 nA 3.3 V, 25 °C 21
Power supply voltage (1.8 V), flash VCC 1.65 1.8 2 V 23
Power supply voltage (3.3 V), flash VCC 2.7 3.3 3.6 V 23
Maximum clock frequency, flash FC 80 MHz 23
Program/erase cycles, flash 100000 cycles 23
Data retention time, flash TRET 20 years 23
Page program time, flash TPP 0.8 5 ms 23
Sector erase time (4 KB), flash TSE 70 500 ms 23
Block erase time (32 KB), flash TBE1 0.2 2 s 23
Block erase time (64 KB), flash TBE2 0.3 3 s 23
Chip erase time (16 Mb), flash TCE 7 20 s 24
Chip erase time (32 Mb), flash TCE 20 60 s 24
Chip erase time (64 Mb), flash TCE 25 100 s 24
Chip erase time (128 Mb), flash TCE 60 200 s 24
Chip erase time (256 Mb), flash TCE 70 300 s 24
Center frequency range of operating channel (Wi-Fi) 2412 2484 MHz 25
RF transmit power range (Bluetooth LE) -24 20 dBm 27
Center frequency range of operating channel (Bluetooth LE) 2402 2480 MHz 27
TX EVM limit, 802.11b 1 Mbps EVM -10 dB @20.5 dBm 25
TX EVM limit, 802.11b 11 Mbps EVM -10 dB @20.5 dBm 25
TX EVM limit, 802.11g 6 Mbps EVM -5 dB @20 dBm 25
TX EVM limit, 802.11g 54 Mbps EVM -25 dB @18 dBm 25
TX EVM limit, 802.11n HT20 MCS0 EVM -5 dB @19 dBm 26
TX EVM limit, 802.11n HT20 MCS7 EVM -27 dB @17.5 dBm 26
TX EVM limit, 802.11n HT40 MCS0 EVM -5 dB @18.5 dBm 26
TX EVM limit, 802.11n HT40 MCS7 EVM -27 dB @17 dBm 26
Carrier frequency offset (Bluetooth LE 1 Mbps) -9 kHz Bluetooth LE 1 Mbps 28
Carrier frequency offset (Bluetooth LE 2 Mbps) -9 kHz Bluetooth LE 2 Mbps 28
Carrier frequency offset (Bluetooth LE 125 Kbps) -13.7 kHz Bluetooth LE 125 Kbps 28
Carrier frequency offset (Bluetooth LE 500 Kbps) -11.9 kHz Bluetooth LE 500 Kbps 29

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 36
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 36

CAD (KiCad official)

  • Symbol: ESP32-C3-MINI-1U-H4
  • Footprint: PCM_Espressif:ESP32-C3-MINI-1U
  • 3D model: ESP32-C3-MINI-1U (KiCad packages3D, STEP)
  • 3D model files: esp32-c3-mini-1u-h4-etched.step / esp32-c3-mini-1u-h4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-c3-mini-1u-h4.step / esp32-c3-mini-1u-h4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (48 pp, sha256 de7361381348d82a, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF