component
ESP32-C3-MINI-1-N4
Public Made by Adomby adom
Espressif Systems RF Modules, ESP32-C3-MINI-1. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20251024
| Name | Last updated |
|---|---|
| docs | 7d ago |
| viewers | 7d ago |
| esp32-c3-mini-1-n4-etched.glb | 7d ago |
| esp32-c3-mini-1-n4-etched.step | 7d ago |
| esp32-c3-mini-1-n4.glb | 7d ago |
| esp32-c3-mini-1-n4.kicad_mod | 7d ago |
| esp32-c3-mini-1-n4.kicad_sym | 7d ago |
| esp32-c3-mini-1-n4.lbr | 7d ago |
| esp32-c3-mini-1-n4.step | 7d ago |
| package.json | 7d ago |
| page.json | 7d ago |
| README.md | 7d ago |
ESP32-C3-MINI-1-N4
Espressif Systems · RF Modules · ESP32-C3-MINI-1
ESP32-C3-MINI-1-N4 from Espressif Systems, in a ESP32-C3-MINI-1. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin of the module. |
| 2 | GND | power_in | Ground pin of the module. |
| 3 | 3V3 | power_in | Module power supply input; the recommended supply range is 3.0 V to 3.6 V with 3.3 V typical (VDD33), and the external power supply must deliver at least 0.5 A. |
| 4 | NC | unconnected | Not connected. |
| 5 | IO2 | bidirectional | GPIO2 with ADC1_CH2 and FSPIQ functions; it is a chip boot mode strapping pin and is floating by default. |
| 6 | IO3 | bidirectional | GPIO3 with ADC1_CH3 analog input function. |
| 7 | NC | unconnected | Not connected. |
| 8 | EN | input | High enables the chip and low powers it off; the pin must not be left floating. |
| 9 | NC | unconnected | Not connected. |
| 10 | NC | unconnected | Not connected. |
| 11 | GND | power_in | Ground pin of the module. |
| 12 | IO0 | bidirectional | GPIO0 with ADC1_CH0 and XTAL_32K_P functions. |
| 13 | IO1 | bidirectional | GPIO1 with ADC1_CH1 and XTAL_32K_N functions. |
| 14 | GND | power_in | Ground pin of the module. |
| 15 | NC | unconnected | Not connected. |
| 16 | IO10 | bidirectional | GPIO10 with FSPICS0 function. |
| 17 | NC | unconnected | Not connected. |
| 18 | IO4 | bidirectional | GPIO4 with ADC1_CH4, FSPIHD and MTMS functions. |
| 19 | IO5 | bidirectional | GPIO5 with ADC2_CH0, FSPIWP and MTDI functions. |
| 20 | IO6 | bidirectional | GPIO6 with FSPICLK and MTCK functions. |
| 21 | IO7 | bidirectional | GPIO7 with FSPID and MTDO functions. |
| 22 | IO8 | bidirectional | GPIO8; a chip boot mode strapping pin that also controls ROM message printing, and is floating by default. |
| 23 | IO9 | bidirectional | GPIO9; a chip boot mode strapping pin with a weak internal pull-up that reads logic 1 by default. |
| 24 | NC | unconnected | Not connected. |
| 25 | NC | unconnected | Not connected. |
| 26 | IO18 | bidirectional | GPIO18 with USB_D- function for the USB Serial/JTAG controller. |
| 27 | IO19 | bidirectional | GPIO19 with USB_D+ function for the USB Serial/JTAG controller. |
| 28 | NC | unconnected | Not connected. |
| 29 | NC | unconnected | Not connected. |
| 30 | RXD0 | bidirectional | GPIO20 with U0RXD function, the UART0 receive signal. |
| 31 | TXD0 | bidirectional | GPIO21 with U0TXD function, the UART0 transmit signal. |
| 32 | NC | unconnected | Not connected. |
| 33 | NC | unconnected | Not connected. |
| 34 | NC | unconnected | Not connected. |
| 35 | NC | unconnected | Not connected. |
| 36 | GND | power_in | Ground pin of the module. |
| 37 | GND | power_in | Ground pin of the module. |
| 38 | GND | power_in | Ground pin of the module. |
| 39 | GND | power_in | Ground pin of the module. |
| 40 | GND | power_in | Ground pin of the module. |
| 41 | GND | power_in | Ground pin of the module. |
| 42 | GND | power_in | Ground pin of the module. |
| 43 | GND | power_in | Ground pin of the module. |
| 44 | GND | power_in | Ground pin of the module. |
| 45 | GND | power_in | Ground pin of the module. |
| 46 | GND | power_in | Ground pin of the module. |
| 47 | GND | power_in | Ground pin of the module. |
| 48 | GND | power_in | Ground pin of the module. |
| 49 | GND | power_in | Ground pin; this is the EPAD thermal pad, and soldering it to the base board ground is optional but improves thermal performance. |
| 50 | GND | power_in | Ground pin of the module. |
| 51 | GND | power_in | Ground pin of the module. |
| 52 | GND | power_in | Ground pin of the module. |
| 53 | GND | power_in | Ground pin of the module. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Espressif Systems |
| Package | ESP32-C3-MINI-1 |
| Category | IoT/Communication Modules |
| Pins | 53 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage | VDD33 | -0.3 | 3.6 | V | 21 | ||
| Power supply voltage | VDD33 | 3 | 3.3 | 3.6 | V | 21 | |
| Current delivered by external power supply | IV DD | 0.5 | A | 21 | |||
| Operating ambient temperature | TA | -40 | 85 | °C | 85 °C version | 21 | |
| Low-level input voltage | VIL | -0.3 | V | 3.3 V, 25 °C | 21 | ||
| High-level input current | IIH | 50 | nA | 3.3 V, 25 °C | 21 | ||
| Low-level input current | IIL | 50 | nA | 3.3 V, 25 °C | 21 | ||
| Chip reset voltage | VIL_nRST | -0.3 | V | CHIP_EN voltage is within the specified range | 22 | ||
| Power supply voltage (3.3 V) | VCC | 2.7 | 3.3 | 3.6 | V | 23 | |
| Maximum clock frequency | FC | 80 | MHz | 23 | |||
| Program/erase cycles | 100000 | cycles | 23 | ||||
| Data retention time | TRET | 20 | years | 23 | |||
| Page program time | TPP | 0.8 | 5 | ms | 23 | ||
| Sector erase time (4 KB) | TSE | 70 | 500 | ms | 23 | ||
| Block erase time (32 KB) | TBE1 | 0.2 | 2 | s | 23 | ||
| Block erase time (64 KB) | TBE2 | 0.3 | 3 | s | 23 | ||
| Chip erase time (32 Mb) | TCE | 20 | 60 | s | 24 | ||
| Center frequency range of operating channel (Wi-Fi) | 2412 | 2484 | MHz | 25 | |||
| Center frequency range of operating channel (Bluetooth LE) | 2402 | 2480 | MHz | 27 | |||
| RF transmit power range | -24 | 20 | dBm | Bluetooth LE | 27 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | THERMOPLASTIC | HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; | 36 | |
| contacts | COPPER ALLOY | gold | CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 36 |
| shell | COPPER ALLOY | gold | SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 36 |
CAD (KiCad official)
- Symbol:
ESP32-C3-MINI-1-N4 - Footprint:
PCM_Espressif:ESP32-C3-MINI-1 - 3D model: ESP32-C3-MINI-1 (KiCad packages3D, STEP)
- 3D model files:
esp32-c3-mini-1-n4-etched.step/esp32-c3-mini-1-n4-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esp32-c3-mini-1-n4.step/esp32-c3-mini-1-n4.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Espressif Systems datasheet (48 pp, sha256
de7361381348d82a, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).