component
ESP32-C3-MINI-1-N4-A
Public Made by Adomby adom
Espressif Systems RF and Wireless, 53-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20251024
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| esp32-c3-mini-1-n4-a-etched.step | 22h ago |
| esp32-c3-mini-1-n4-a.glb | 22h ago |
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ESP32-C3-MINI-1-N4-A
Espressif Systems · RF and Wireless · 53-SMD Module
ESP32-C3-MINI-1-N4-A from Espressif Systems, in a 53-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin of the module. |
| 2 | GND | power_in | Ground pin of the module. |
| 3 | 3V3 | power_in | Power supply input; Table 6-2 gives VDD33 as 3.0 V min, 3.3 V typ, 3.6 V max. |
| 4 | NC | unconnected | Listed as NC (no connection) in the pin definition table. |
| 5 | IO2 | bidirectional | GPIO2 with ADC1_CH2 and FSPIQ functions; also a chip boot mode strapping pin, floating by default. |
| 6 | IO3 | bidirectional | GPIO3 with ADC1_CH3 function. |
| 7 | NC | unconnected | Listed as NC (no connection) in the pin definition table. |
| 8 | EN | input | Chip enable: high turns the chip on, low powers it off; do not leave this pin floating. |
| 9 | NC | unconnected | Listed as NC (no connection) in the pin definition table. |
| 10 | NC | unconnected | Listed as NC (no connection) in the pin definition table. |
| 11 | GND | power_in | Ground pin of the module. |
| 12 | IO0 | bidirectional | GPIO0 with ADC1_CH0 and XTAL_32K_P functions. |
| 13 | IO1 | bidirectional | GPIO1 with ADC1_CH1 and XTAL_32K_N functions. |
| 14 | GND | power_in | Ground pin of the module. |
| 15 | NC | unconnected | Listed as NC (no connection) in the pin definition table. |
| 16 | IO10 | bidirectional | GPIO10 with FSPICS0 function. |
| 17 | NC | unconnected | Listed as NC (no connection) in the pin definition table. |
| 18 | IO4 | bidirectional | GPIO4 with ADC1_CH4, FSPIHD and MTMS functions. |
| 19 | IO5 | bidirectional | GPIO5 with ADC2_CH0, FSPIWP and MTDI functions. |
| 20 | IO6 | bidirectional | GPIO6 with FSPICLK and MTCK functions. |
| 21 | IO7 | bidirectional | GPIO7 with FSPID and MTDO functions. |
| 22 | IO8 | bidirectional | GPIO8; also a strapping pin for chip boot mode and ROM message printing, floating by default. |
| 23 | IO9 | bidirectional | GPIO9; also a chip boot mode strapping pin, weak pull-up (logic 1) by default. |
| 24 | NC | unconnected | Listed as NC (no connection) in the pin definition table. |
| 25 | NC | unconnected | Listed as NC (no connection) in the pin definition table. |
| 26 | IO18 | bidirectional | GPIO18 with USB_D- function (USB Serial/JTAG). |
| 27 | IO19 | bidirectional | GPIO19 with USB_D+ function (USB Serial/JTAG). |
| 28 | NC | unconnected | Listed as NC (no connection) in the pin definition table. |
| 29 | NC | unconnected | Listed as NC (no connection) in the pin definition table. |
| 30 | RXD0 | bidirectional | GPIO20 with U0RXD function (UART0 receive, used for firmware download and log output). |
| 31 | TXD0 | bidirectional | GPIO21 with U0TXD function (UART0 transmit, used for firmware download and log output). |
| 32 | NC | unconnected | Listed as NC (no connection) in the pin definition table. |
| 33 | NC | unconnected | Listed as NC (no connection) in the pin definition table. |
| 34 | NC | unconnected | Listed as NC (no connection) in the pin definition table. |
| 35 | NC | unconnected | Listed as NC (no connection) in the pin definition table. |
| 36 | GND | power_in | Ground pin of the module. |
| 37 | GND | power_in | Ground pin of the module. |
| 38 | GND | power_in | Ground pin of the module. |
| 39 | GND | power_in | Ground pin of the module. |
| 40 | GND | power_in | Ground pin of the module. |
| 41 | GND | power_in | Ground pin of the module. |
| 42 | GND | power_in | Ground pin of the module. |
| 43 | GND | power_in | Ground pin of the module. |
| 44 | GND | power_in | Ground pin of the module. |
| 45 | GND | power_in | Ground pin of the module. |
| 46 | GND | power_in | Ground pin of the module. |
| 47 | GND | power_in | Ground pin of the module. |
| 48 | GND | power_in | Ground pin of the module. |
| 49 | GND | power_in | Ground thermal pad (labelled EPAD in the schematic); soldering it to the base board ground is optional but improves thermal performance, applied with a correct amount of solder paste. |
| 50 | GND | power_in | Ground pin of the module. |
| 51 | GND | power_in | Ground pin of the module. |
| 52 | GND | power_in | Ground pin of the module. |
| 53 | GND | power_in | Ground pin of the module. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Espressif Systems |
| Package | 53-SMD Module |
| Category | RF and Wireless |
| Pins | 53 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage | VDD33 | -0.3 | 3.6 | V | 21 | ||
| Power supply voltage | VDD33 | 3 | 3.3 | 3.6 | V | 21 | |
| Current delivered by external power supply | IVDD | 0.5 | A | 21 | |||
| Operating ambient temperature (85 °C version) | TA | -40 | 85 | °C | 85 °C version | 21 | |
| Pin capacitance | CIN | 2 | pF | 21 | |||
| High-level input current | IIH | 50 | nA | 21 | |||
| Low-level input current | IIL | 50 | nA | 21 | |||
| High-level source current | IOH | 40 | mA | VDD = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3 | 21 | ||
| Low-level sink current | IOL | 28 | mA | VDD = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3 | 21 | ||
| Internal weak pull-up resistor | RPU | 45 | kΩ | 21 | |||
| Internal weak pull-down resistor | RPD | 45 | kΩ | 21 | |||
| Power supply voltage (1.8 V) | VCC | 1.65 | 1.8 | 2 | V | Flash, power supply voltage (1.8 V) | 23 |
| Power supply voltage (3.3 V) | VCC | 2.7 | 3.3 | 3.6 | V | Flash, power supply voltage (3.3 V) | 23 |
| Maximum clock frequency | FC | 80 | MHz | Flash | 23 | ||
| Light-sleep current | 130 | µA | VDD_SPI and Wi-Fi powered down, all GPIOs high-impedance | 23 | |||
| Deep-sleep current | 5 | µA | RTC timer + RTC memory | 23 | |||
| Power-off current | 1 | µA | CHIP_EN set to low level, chip powered off | 23 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | THERMOPLASTIC | HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; | 36 | |
| contacts | COPPER ALLOY | gold | CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 36 |
| shell | COPPER ALLOY | gold | SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 36 |
CAD (KiCad official)
- Symbol:
ESP32-C3-MINI-1-N4-A - Footprint:
PCM_Espressif:ESP32-C3-MINI-1 - 3D model: 53-SMD Module (KiCad packages3D, STEP)
- 3D model files:
esp32-c3-mini-1-n4-a-etched.step/esp32-c3-mini-1-n4-a-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esp32-c3-mini-1-n4-a.step/esp32-c3-mini-1-n4-a.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Espressif Systems datasheet (48 pp, sha256
de7361381348d82a, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).