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ESDZV18-1BF4

STMicroelectronics · ESD And Surge Protection (TVS/ESD) · 0201

ESDZV18-1BF4 from STMicroelectronics, in a 0201. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IO1 passive Bidirectional TVS terminal marked by the dot (pin 1) that connects to the protected line; the device triggers above 18 V min VTrig and has 3 pF typical line capacitance.
2 IO2 passive Second bidirectional TVS terminal, connected to ground or the opposite side of the protected line, with stand-off IRM of 100 nA max at VRM = 16 V.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package 0201
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Trigger voltage VTrig 18 24 V Higher voltage than VTrig guarantees the protection turn-on 2
Holding voltage VH 16 17.3 V Lower voltage than VH guarantees the protection turn-off 2
Leakage current IRM 100 nA VRM = 16 V(1) 2
Clamping voltage (ESD contact discharge) VCL 21.5 V 8 kV contact discharge after 30 ns, IEC 61000-4-2 2
Clamping voltage (8/20 µs waveform) VCL 18 V 8/20 µs waveform, IPP = 1 A 2
Input capacitance per line CLINE 3 4 pF F = 1 MHz, VLINE = 0 V, VOSC = 30 mV 2
Dynamic resistance RD 0.2 Ω Pulse duration 100 ns 2
Peak pulse voltage (IEC 61000-4-2 contact discharge) VPP 30 kV IEC 61000-4-2 contact discharge 2
Peak pulse voltage (IEC 61000-4-2 air discharge) VPP 30 kV IEC 61000-4-2 air discharge 2
Peak pulse power dissipation PPP 140 W 8/20 µs 2
Peak pulse current IPP 6 A 8/20 µs 2
Operating junction temperature range Tj -55 150 °C 2
Storage temperature range Tstg -65 150 °C 2
Maximum lead temperature for soldering TL 260 °C during 10 s 2

CAD (KiCad official)

  • Symbol: ESDZV18-1BF4
  • Footprint: Diode_SMD:D_0201_0603Metric
  • 3D model: 0201, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.3 mm nominal 01005 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: esdzv18-1bf4-etched.step / esdzv18-1bf4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esdzv18-1bf4.step / esdzv18-1bf4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (10 pp, sha256 e4b779e6a07f79fc, retrieved 2026-10-20, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF