# ESDT12VD3

**Changjing** · ESD And Surge Protection (TVS/ESD) · SOD-323

ESDT12VD3 from Changjing, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode of the uni-directional ESD protection diode, connected to the protected line (reverse stand-off voltage 12V), and identified by the marking bar. |
| 2 | A | passive | Anode of the uni-directional ESD protection diode, normally connected to ground, with the diode clamping at 32V max at IPP=50A (8/20µs). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Changjing |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse leakage current | IR |  |  | 1 | μA | VRWM=12V | 3 |
| Breakdown voltage | V(BR) | 13.3 |  | 16.5 | V | IT=1mA | 3 |
| Clamping voltage | VC |  |  | 32 | V | IPP=50A, 8/20μs | 3 |
| Forward voltage | VF |  |  | 0.9 | V | IF=10mA | 3 |
| Junction capacitance | CJ |  |  | 300 | pF | VR=0V,f=1MHz | 3 |
| Reverse stand off voltage | VRWM |  | 12 |  | V |  | 3 |
| IEC 61000-4-2 ESD Voltage Air Model | VESD | -25 |  | 25 | kV | Ta=25℃, ten non-repetitive ESD pulses | 2 |
| IEC 61000-4-2 ESD Voltage Contact Model | VESD | -25 |  | 25 | kV | Ta=25℃, ten non-repetitive ESD pulses | 2 |
| JESD22-A114-B ESD Voltage Per Human Body Model | VESD | -16 |  | 16 | kV | Ta=25℃, ten non-repetitive ESD pulses | 2 |
| ESD Voltage Machine Model | VESD | -0.4 |  | 0.4 | kV | Ta=25℃, ten non-repetitive ESD pulses | 2 |
| Peak Pulse Power | PPP |  |  | 1600 | W | Non-repetitive 8/20µs exponential decay, IEC61000-4-5 | 2 |
| Peak Pulse Current | IPP |  |  | 50 | A | Non-repetitive 8/20µs exponential decay, IEC61000-4-5 | 2 |
| Lead Solder Temperature - Maximum | TL |  |  | 260 | ℃ | 10 Second Duration | 2 |
| Operation Junction and Storage Temperature Range | TJ,Tstg | -55 |  | 150 | ℃ |  | 2 |

## CAD (KiCad official)

- Symbol: `ESDT12VD3`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `esdt12vd3-etched.step` / `esdt12vd3-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esdt12vd3.step` / `esdt12vd3.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Changjing datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589836773666168832) (6 pp, sha256 `b25cd68fa7bf56b2`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/esdt12vd3-datasheet.pdf)