# ESDSLC3V3LB-TP

**MCC(Micro Commercial Components)** · TVS · DFN1006-2

ESDSLC3V3LB-TP from MCC(Micro Commercial Components), in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | DFN1006-2 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage | VBR | 5 |  |  | V | IT=1mA | 2 |
| Reverse Leakage Current | IR |  |  | 0.05 | μA | VRWM=3.3V | 2 |
| Clamping Voltage | VC |  |  | 10 | V | IPP=1A, tP=8/20μs | 2 |
| Clamping Voltage | VC |  |  | 20 | V | IPP=5A, tP=8/20μs | 2 |
| Junction Capacitance | CJ |  | 0.25 | 0.3 | pF | VR=0V, f=1MHz | 2 |
| Working Peak Reverse Voltage | VRWM |  |  | 3.3 | V |  | 2 |
| Peak Pulse Power | PPP |  |  | 100 | W | tp=8/20us | 1 |
| Maximum Reverse Peak Pulse Current (IEC61000-4-5 surge) | IPP |  |  | 5 | A | IEC61000-4-5 @8/20us | 1 |
| ESD Air Discharge (IEC61000-4-2) |  |  |  | 20 | KV | IEC61000-4-2 air discharge | 1 |
| ESD Contact Discharge (IEC61000-4-2) |  |  |  | 25 | KV | IEC61000-4-2 contact discharge | 1 |
| EFT (IEC61000-4-4) |  |  |  | 40 | A | IEC61000-4-4 @5/50ns | 1 |
| Operating Junction Temperature Range | TJ | -55 |  | 125 | °C |  | 1 |
| Storage Temperature Range | TSTG | -55 |  | 150 | °C |  | 1 |

## CAD (KiCad official)

- Symbol: `ESDSLC3V3LB-TP`
- Footprint: `Diode_SMD:D_SOD-882`
- 3D model: DFN1006-2 (KiCad packages3D, STEP)
- 3D model files: `esdslc3v3lb-tp-etched.step` / `esdslc3v3lb-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esdslc3v3lb-tp.step` / `esdslc3v3lb-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC(Micro Commercial Components) datasheet](docs/esdslc3v3lb-tp-datasheet.pdf) (4 pp, sha256 `fe4137e48bea9d89`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/esdslc3v3lb-tp-datasheet.pdf)