# ESDALD03BCX

**WeEn Semiconductors** · ESD And Surge Protection (TVS/ESD) · SOD-323

ESDALD03BCX from WeEn Semiconductors, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of the bidirectional ESD protection diode, which protects one directional I/O line (VR 3.3 V, VBR min 4.5 V at 1 mA for ESDALD03BC). |
| 2 | 2 | passive | Terminal 2 of the bidirectional ESD protection diode, which protects one directional I/O line (VR 3.3 V, VBR min 4.5 V at 1 mA for ESDALD03BC). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | WeEn Semiconductors |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse stand-off voltage | VR |  | 3.3 |  | V |  | 2 |
| Breakdown voltage | VBR | 4.5 |  |  | V | IT = 1 mA | 2 |
| Clamping voltage | VC |  |  | 8.5 | V | Ipp = 1 A | 2 |
| Clamping voltage at max Ipp | VC |  |  | 20 | V | Max Ipp | 2 |
| Peak pulse current | Ipp |  |  | 20 | A |  | 2 |
| Reverse leakage current | IR |  |  | 1 | μA | @ VR | 2 |
| Capacitance | Cj |  | 0.8 |  | pF | 0 V, 1 MHz | 2 |
| ESD per IEC 61000-4-2 (air) | VESD | -30 |  | 30 | kV | Tj = 25 °C | 1 |
| ESD per IEC 61000-4-2 (contact) | VESD | -30 |  | 30 | kV | Tj = 25 °C | 1 |
| Storage temperature range | Tstg | -55 |  | 150 | °C |  | 1 |
| Operating temperature range | Tj | -55 |  | 150 | °C |  | 1 |

## CAD (KiCad official)

- Symbol: `ESDALD03BCX`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `esdald03bcx-etched.step` / `esdald03bcx-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esdald03bcx.step` / `esdald03bcx.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [WeEn Semiconductors datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603039815856373760) (6 pp, sha256 `d9fc6c8fd223195b`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/esdald03bcx-datasheet.pdf)