# ESDALCL5-1BM2

**STMicroelectronics** · ESD Protection Devices · SOD-882

ESDALCL5-1BM2 from STMicroelectronics, in a SOD-882. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O1 | bidirectional | Bidirectional ESD-protected data line with 26 pF typical line capacitance at 0 V and breakdown voltage VBR of 5.0 V minimum, rated for IEC 61000-4-2 level 4 (±30 kV contact and air discharge). |
| 2 | I/O2 | bidirectional | Bidirectional ESD-protected data line with 26 pF typical line capacitance at 0 V and breakdown voltage VBR of 5.0 V minimum, rated for IEC 61000-4-2 level 4 (±30 kV contact and air discharge). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | SOD-882 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Diode capacitance per line | Cline |  | 26 | 30 | pF | F = 1 MHz, VR = 0 V | 2 |
| Breakdown voltage, pin2 to pin1 | VBR | 5 | 8 |  | V | From pin2 to pin1, IR = 1 mA | 2 |
| Breakdown voltage, pin1 to pin2 | VBR | 11 | 13 |  | V | From pin1 to pin2, IR = 1 mA | 2 |
| Leakage current at VRM = 3 V | IRM |  |  | 10 | nA | VRM = 3 V | 2 |
| Leakage current at VRM = 1 V | IRM |  |  | 1 | nA | VRM = 1 V | 2 |
| Dynamic resistance | Rd |  |  | 650 | mΩ | Square pulse, IPP = 1 A, tp = 2.5 µs | 2 |
| Peak pulse voltage (IEC 61000-4-2 contact and air discharge) | VPP | -30 |  | 30 | kV | IEC 61000-4-2 contact discharge and air discharge | 2 |
| Peak pulse power dissipation | PPP |  |  | 150 | W | 8/20 µs, Tj initial = Tamb | 2 |
| Peak pulse current | IPP |  |  | 9 | A | 8/20 µs | 2 |
| Junction temperature | Tj | -55 |  | 150 | °C |  | 2 |
| Storage temperature range | Tstg | -65 |  | 150 | °C |  | 2 |
| Maximum lead temperature for soldering | TL |  |  | 260 | °C | During 10 s | 2 |

## CAD (KiCad official)

- Symbol: `ESDALCL5-1BM2`
- Footprint: `Diode_SMD:D_SOD-882`
- 3D model: SOD-882 (KiCad packages3D, STEP)
- 3D model files: `esdalcl5-1bm2-etched.step` / `esdalcl5-1bm2-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esdalcl5-1bm2.step` / `esdalcl5-1bm2.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [STMicroelectronics datasheet](https://www.st.com/resource/en/datasheet/esdalcl5-1bm2.pdf) (12 pp, sha256 `defdf8e62c296a68`, retrieved 2026-10-30, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/esdalcl5-1bm2-datasheet.pdf)