Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

ESDALC5-1BM2

STMicroelectronics · ESD Protection Devices · SOD-882

ESDALC5-1BM2 from STMicroelectronics, in a SOD-882. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 I/O1 passive Bidirectional ESD protection line I/O1 (pin 1, marked by Pin 1 indicator); breakdown VBR 11 V min to 17 V max from I/O1 to I/O2 at IR = 1 mA, 26 pF typ. line capacitance at 0 V.
2 I/O2 passive Bidirectional ESD protection line I/O2 (pin 2); breakdown VBR 5.8 V min to 11 V max from I/O2 to I/O1 at IR = 1 mA, leakage 60 nA max at VRM = 5 V.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SOD-882
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown voltage I/O1 to I/O2 VBR 11 13 17 V From I/O1 to I/O2, IR = 1 mA 2
Breakdown voltage I/O2 to I/O1 VBR 5.8 8 11 V From I/O2 to I/O1, IR = 1 mA 2
Reverse leakage current IRM 60 nA VRM = 5 V 2
Line capacitance Cline 26 30 pF F = 1 MHz, VR = 0 V 2
Clamping voltage I/O1 to I/O2 VCL 16 V 8 kV contact discharge after 30 ns IEC 61000-4-2, From I/O1 to I/O2 2
Clamping voltage I/O2 to I/O1 VCL 11 V 8 kV contact discharge after 30 ns IEC 61000-4-2, From I/O2 to I/O1 2
Peak pulse voltage, contact discharge VPP 30 kV IEC 61000-4-2: Contact discharge 2
Peak pulse voltage, air discharge VPP 30 kV IEC 61000-4-2: Air discharge 2
Peak pulse power PPP 150 W 8/20μs, Tj initial = Tamb 2
Peak pulse current IPP 9 A 8/20μs 2
Storage temperature range Tstg -65 150 °C 2
Junction temperature Tj -55 150 °C 2
Maximum lead temperature for soldering TL 260 °C during 10 s 2
Dynamic resistance I/O1 to I/O2 Rd 0.25 Ω Pulse width 100 ns, From I/O1 to I/O2 2
Dynamic resistance I/O2 to I/O1 Rd 0.23 Ω Pulse width 100 ns, From I/O2 to I/O1 2

CAD (KiCad official)

  • Symbol: ESDALC5-1BM2
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: SOD-882 (KiCad packages3D, STEP)
  • 3D model files: esdalc5-1bm2-etched.step / esdalc5-1bm2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esdalc5-1bm2.step / esdalc5-1bm2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (13 pp, sha256 1677611952000cd0, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF