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Contents

README

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ESDA8V2-1J

STMicroelectronics · ESD And Surge Protection (TVS/ESD) · SOD-323

ESDA8V2-1J from STMicroelectronics, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the unidirectional Transil diode, marked by the bar on the package, connected to the protected line with VBR = 8.2 V min at 1 mA and leakage below 0.5 µA at VRM = 5 V.
2 A passive Anode of the unidirectional Transil diode, connected to ground (GND) per the footprint, with 500 W peak pulse power (8/20 µs) and ±30 kV ESD capability.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SOD-323
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
ESD discharge (IEC 61000-4-2 air discharge on input pin) VPP -30 30 kV IEC 61000-4-2 air discharge on input pin 2
ESD discharge (IEC 61000-4-2 contact discharge on input pin) VPP -30 30 kV IEC 61000-4-2 contact discharge on input pin 2
ESD discharge (MIL STD 883G Method 3015-7 class 3B) VPP -30 30 kV MIL STD 883G - Method 3015-7: class 3B 2
Peak pulse power dissipation PPP 500 W 8/20 µs, Tj initial = Tamb 2
Peak pulse current IPP 25 A 8/20 µs 2
Junction temperature range Tj -40 125 °C 2
Storage temperature range Tstg -55 150 °C 2
Maximum lead temperature for soldering TL 260 °C during 10 s 2
Breakdown voltage VBR 8.2 V IR = 1 mA 2
Leakage current @ VRM IRM 0.1 0.5 µA VRM = 5 V 2
Clamping voltage (8/20 µs waveform) VCL 11 V IPP = 1 A 2
Clamping voltage (8/20 µs waveform) VCL 13 V IPP = 5 A 2
Clamping voltage (8/20 µs waveform) VCL 20 V Ipp = 25 A 2
Input capacitance C 210 250 pF VR = 0 V, Fosc = 1 MHz, Vosc = 30 mV 2

CAD (KiCad official)

  • Symbol: ESDA8V2-1J
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: esda8v2-1j-etched.step / esda8v2-1j-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esda8v2-1j.step / esda8v2-1j.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (7 pp, sha256 434e72a7d7f04e24, retrieved 2026-11-06, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF