component
ESDA25B1RL
Public Made by Adomby adom
STMicroelectronics ESD And Surge Protection (TVS/ESD), SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownESDA25B1RL
STMicroelectronics · ESD And Surge Protection (TVS/ESD) · SOIC-8
ESDA25B1RL from STMicroelectronics, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O1 | passive | Bidirectional TVS I/O line 1, clamps ESD to ground with breakdown voltage 25-30 V and 150 W peak pulse power (8/20 µs). |
| 2 | I/O2 | passive | Bidirectional TVS I/O line 2, clamps ESD to ground with breakdown voltage 25-30 V and 150 W peak pulse power (8/20 µs). |
| 3 | I/O3 | passive | Bidirectional TVS I/O line 3, clamps ESD to ground with breakdown voltage 25-30 V and 150 W peak pulse power (8/20 µs). |
| 4 | I/O4 | passive | Bidirectional TVS I/O line 4, clamps ESD to ground with breakdown voltage 25-30 V and 150 W peak pulse power (8/20 µs). |
| 5 | I/O5 | passive | Bidirectional TVS I/O line 5, clamps ESD to ground with breakdown voltage 25-30 V and 150 W peak pulse power (8/20 µs). |
| 6 | GND | power_in | Ground reference pin shared by the six-channel bidirectional TVS array against which each I/O line is clamped. |
| 7 | GND | power_in | Ground reference pin shared by the six-channel bidirectional TVS array against which each I/O line is clamped. |
| 8 | I/O6 | passive | Bidirectional TVS I/O line 6, clamps ESD to ground with breakdown voltage 25-30 V and 150 W peak pulse power (8/20 µs). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | SOIC-8 |
| Category | Circuit Protection |
| Pins | 8 |
CAD (KiCad official)
- Symbol:
ESDA25B1RL - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
esda25b1rl-etched.step/esda25b1rl-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esda25b1rl.step/esda25b1rl.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (5 pp, sha256
ae59c2771ef50906, retrieved 2026-09-24, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).