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Contents

README

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ESDA19SC6

STMicroelectronics · ESD Protection Devices · SOT-23-6L

ESDA19SC6 from STMicroelectronics, in a SOT-23-6L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 I/O1 passive Protected data line 1 (unidirectional ESD channel), clamping positive transients just above the 19 V min breakdown level and negative transients to a diode drop below ground.
2 GND power_in Common ground/return of the array, connected internally to pin 5 and shared by all four protection channels.
3 I/O2 passive Protected data line 2 (unidirectional ESD channel), clamping positive transients just above the 19 V min breakdown level and negative transients to a diode drop below ground.
4 I/O3 passive Protected data line 3 (unidirectional ESD channel), paired with pin 3 on the same side of the common node, with the same clamping behavior.
5 GND power_in Common ground/return of the array, connected internally to pin 2 and shared by all four protection channels.
6 I/O4 passive Protected data line 4 (unidirectional ESD channel), paired with pin 1 on the same side of the common node, with the same clamping behavior.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SOT-23-6L
Category Circuit Protection
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown voltage VBR 19 21 V @ IR = 1 mA, Tamb = 25 °C 3
Leakage current IRM 0.1 µA @ VRM = 15 V, Tamb = 25 °C 3
Stand-off voltage VRM 15 V Tamb = 25 °C 3
Clamping voltage VCL 39 V @ IPP = 13 A, Tamb = 25 °C 3
Capacitance C 80 pF 0 V bias, Tamb = 25 °C 3
Forward voltage drop VF 1.2 V @ IF = 10 mA, Tamb = 25 °C 3
Voltage temperature coefficient αT 8.5 10-4/°C Tamb = 25 °C 3
Peak pulse power PPP 400 W 8/20µs, Tamb = 25 °C 2
Peak pulse current IPP 13 A Tamb = 25 °C 2
ESD discharge VPP 30 kV MIL STD 883E Method 3015-7, IEC61000-4-2 air and contact discharge, Tamb = 25 °C 2
Storage temperature range Tstg -55 150 °C 2
Operating junction temperature range Top -55 150 °C 2
Maximum lead temperature for soldering TL 260 °C during 10 s 2

CAD (KiCad official)

  • Symbol: ESDA19SC6
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6L (KiCad packages3D, STEP)
  • 3D model files: esda19sc6-etched.step / esda19sc6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esda19sc6.step / esda19sc6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (9 pp, sha256 83535cf61c43011c, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF